Why You Need to Remove Bubbles


Structural defects — Bubbles create voids that significantly weaken adhesion, leading to delamination and compromised product integrity.

Surface flaws — Trapped air leaves pinholes and craters on coated or cast surfaces, impacting both aesthetics and functional quality.

Performance loss — In optical, conductive, and insulating materials, bubbles degrade clarity, conductivity, and insulation properties.

Process instability — Bubbles cause inconsistent dispensing, pump cavitation, and elevated scrap rates in automated production lines.

Viscosity challenges — High-viscosity fluids are particularly prone to microbubble entrapment during material handling and transfer.

Eliminating bubbles is a fundamental prerequisite for achieving high-quality, high-reliability production.

Why Choose the SIE‑C012


100–4500 RPM adjustable speed Adaptable centrifugal force for different material viscosities and bubble extraction demands.

Vacuum up to -99kPa Removes even micron-sized bubbles thoroughly and reliably.

Non‑contact planetary design Patented (游星式) centrifugal technology; zero foreign contact with the material. Original chemical properties remain fully intact.

Silent operation ≈ 50dB Purpose‑built for laboratories, noise‑sensitive production floors, and office environments.

16‑syringe configuration (customizable 1–96) Higher throughput than smaller needle‑type models, meeting pilot and production requirements.

Wide container compatibility Supports tubes, cans, and proprietary containers, providing flexible workflow integration.

100‑program digital memory Repeatable, operator‑independent operation with consistent process quality.

Optional MES / cooling / heating Full in‑line connectivity with real‑time process traceability and temperature control.

Rugged build 304 stainless steel casing with imported components for long‑term durability.l cycles

Optional MES / cooling / heating Full in-line integration with digital process traceability

Working principle


Principle of centrifugal defoamer: By using the principle of gravity downward to release bubbles, it can efficiently remove tiny bubbles from materials and improve product quality.

Product parameters table


Model

SIE-C006

SIE-C008

SIE-C012

Speed(rpm)

100-4000Adjustable

100-4500Adjustable

100-4500Adjustable

Time(min)

0-99

0-99

0-99

Container

pipe

pipe

pipe

Capacity(cc)

3/5/10/30

3/5/10/30/55

3/5/10/30/…/200

Quantity

6 pieces

8pieces

16  pieces

Safety lock

Yes

Yes

Yes

Inertial delay

Yes

Yes

Yes

Time display

Digital real-time

Digital real-time

Digital real-time

Speed display

数码实时

Digital real-time

Digital real-time

Size(cm)

56*64*37

63*74*38

66*74*38

Weight(kg)

32

45

65

***The above are just typical models, and we can provide personalized solutions according to customer needs.


Applications


Semiconductor & Microelectronics — Void‑free underfill, encapsulation, conductive pastes. Sienox technology achieves void rates below 0.001% in advanced semiconductor packaging.

New Energy & Battery — Battery electrode slurries and structural adhesives with <0.2% porosity.

LED / LCD / Optical — Bubble‑free phosphor coatings and optical‑grade silicone encapsulation.

Medical & Pharma — Contamination‑free processing of medical‑grade silicones and composites.

Adhesives & Chemicals — Epoxies, PU, silver pastes, high‑viscosity structural glues.

Cosmetics & Daily Chemicals — Creams and gels with uniform, air‑free texture.

R&D Labs & Universities — Small‑batch preparation, formula development, and material testing.

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*Sienox has processed 1,800+ material cases. Contact us with your specific material for a free sample test.*

Customer Proof


EV Battery Pack Sealing

Achieved <0.2% porosity in structural silicone adhesives under vacuum, stable viscosity control at 60°C, and IP67 waterproof compliance — enabling 500,000 battery packs per year with zero leakage.

5G mm‑Wave Chip Packaging

99.2% nano‑silica filler uniformity, 30% fluidity improvement, filling time reduced to 3 seconds, and void rate below 0.001% in advanced semiconductor encapsulation.

Semiconductor Material Preparation

Sienox planetary defoaming technology enables void‑free encapsulation in semiconductor packaging applications where even ultra‑small bubbles create critical reliability concerns.

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Our cooperative clients

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***Only partial successful customer information is displayed. We need more case studies and product selection materials. Please feel free to contact us


FAQ


1. What materials can the SIE‑C012 process?

Fluorescent powders, adhesives, silicone gels, silver paste, aluminum paste, conductive inks, insulating adhesive, battery pastes, and more. Free sample testing is available.

2. Does the process change material properties?

No. The non‑contact patented planetary design preserves the original chemical composition — no blades, no paddles, no contamination.

3. What containers are supported?

Standard syringes (3–200 cc), tubes, cans, and fully custom proprietary containers.

4. Can it integrate into a production line?

Yes — optional MES connectivity, heating, cooling, and vacuum modules support full in‑line operation.

5. How does the C012 differ from C006 and C008?

C006 (6 syringes, 0–30cc, desktop lab design), C008 (8 syringes, 0–55cc, pilot batch model), C012 (16 syringes, 0–200cc, higher‑capacity production model). All share the same core non‑contact planetary technology.

6. How do I start a sample evaluation?

Send your materials to Sienox — we provide free testing and a detailed process recommendation report.


Sienox Defoaming Machine Product Selection Table

Model

SIE-C006

SIE-C008

SIE-C012

Speed(rpm)

100-4000Adjustable

100-4500Adjustable

100-4500Adjustable

Time(min)

0-99

0-99

0-99

Container

Capacity(cc)

3/5/10/30

3/5/10/30/55

3/5/10/30/…/200

Quantity

6 支

8支

16 支

Safety lock

Yes

Yes

Yes

Inertial delay

Yes

Yes

Yes

Time display

数码实时

数码实时

数码实时

Speed display

数码实时

数码实时

数码实时

Size(cm)

56*64*37

63*74*38

66*74*38

Weight(kg)

32

45

65

***The above are just typical models, and we can provide personalized solutions according to customer needs.

◆ Syringe quantity optional 

◆ Tube/can options available, with a wide variety of container types 

◆ Vacuum level up to -99kPa 

◆ Capable of storing up to 100 sets of operating parameters 

◆ Non-contact design that does not alter the chemical properties of the material 

◆ Unique patented design with strong centrifugal force for clean and efficient defoaming 

◆Speed range: 0-4500 RPM, adjustable for different material characteristics 

◆ Silent model, suitable for offices, laboratories, and industrial use 

◆ Customizable capacity, with standard options of 30cc, 55cc, 75cc, 960mL, and 2600mL 

◆ Equipped with imported components, the casing is made of 304 stainless steel for long-lasting durability 

◆ Optional features: vacuum, temperature control, and MES system connectivity 

◆ Aesthetically pleasing, sturdy, and durable design

This centrifugal defoaming machine meets the defoaming needs for 0-200cc, featuring a unique patented design that provides strong centrifugal force, ensuring clean and efficient defoaming. We offer personalized customization services based on customer requirements. It is versatile in application, aesthetically pleasing, sturdy, and durable.