Solutions

SIENOX has 20‑year focus on vacuum defoaming for consumer‑electronics adhesives. We delivered vacuum stirring‑defoaming solutions for a Guangdong‑based electronics manufacturer. Adopting rotation‑revolution planetary motion paired with vacuum system, it efficiently removes nano‑scale micro‑bubbles inside adhesives.

SIENOX planetary stirring‑defoaming machine uses rotation‑revolution mixing and fully‑enclosed non‑contact defoaming, offering R&D‑to‑mass‑production solutions for high‑viscosity epoxy and polyurethane adhesives to realize zero‑defect bonding.

SIENOX brings 20‑year expertise in semiconductor packaging adhesive mixing‑defoaming.
Our vacuum defoaming solutions remove nano‑scale micro‑bubbles for uniform die attach, molding compound, underfill and dam‑fill materials.
Boost chip packaging reliability and yield; free sample testing & trial‑test services offered.

SIENOX has 20‑year expertise in defoaming for high‑viscosity gels, providing centrifugal defoaming solutions for gel materials including 90,000‑cps high‑viscosity gels, sealants, silicone gels and polyurethane gels.

LED raw materials are mainly applied in lighting, electronics, automotive, home appliance, advertising, interior decoration, smart grid and other industries.

SIENOX planetary mixing‑defoaming machine applies non‑contact planetary mixing and nanoscale vacuum deaeration for zero‑contamination, consistent processing of EMC, DAF and photoresist to realize semiconductor micron‑level defect control.