Material Processing Degassing Equipment

SIENOX epoxy resin defoaming solution encompasses three technical approaches: centrifugal defoaming, vacuum defoaming, and vacuum mixing and defoaming. Designed to address air bubbles trapped during the mixing, potting and pouring of two-part epoxy AB adhesives, it delivers end-to-end solutions from laboratory formula validation to mass potting, ensuring dense, uniform, electrically insulated and reliable epoxy potting components in every batch.

SIENOX offers vacuum mixing and defoaming solutions to address bubbles entrained during batching and stirring of UV curable resin, photosensitive resin and optical UV adhesive. UV adhesives require exceptionally high transparency; even a single microbubble can be visible under light transmission. The vacuum environment paired with low-shear mixing allows microbubbles to expand and rise for one-time thorough removal, generating no shear heat and preventing premature curing

Polyurethane (PU) potting adhesive, elastomer and potting compound are highly susceptible to air entrapment and slight foaming after mixing Part A and Part B. The SIENOX vacuum mixing defoaming machine performs mixing and gas extraction simultaneously under negative pressure to restrain foaming and remove bubbles, yielding PU castings with dense interior, smooth surface and stable mechanical properties.

SIENOX silicone defoaming solution targets bubbles generated during mixing and potting of potting silicone, silicone rubber, thermal conductive grease and silicone gel. It performs mixing and defoaming under a negative pressure of −98 kPa to produce crystal-clear transparent silicone without white spots and thermal conductive adhesive with uniformly dispersed fillers and no voids.

SIENOX unsaturated polyester defoaming solution targets trapped air in filled resin systems such as FRP, cast crafts and artificial stone during batching and curing. It adopts vacuum mixing and defoaming after powder pre-mixing to eliminate bubbles generated in the blending of resin and fillers, producing products with dense surfaces and reduced pinholes and interlayer voids.

SIENOX phenolic resin defoaming solution targets "powder + resin" systems such as bakelite powder, phenolic molding compounds, grinding wheel/brake pad binders and refractory castables. It enables synchronous mixing and degassing under negative pressure to achieve homogeneous mixtures and dense green bodies, reducing pores, porosity and mechanical defects after sintering or curing.