Slurry Degasser
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Solder Paste Defoaming Machine
Eliminate bubbles and splashing of solder paste · Full solder joints, fewer solder beads & stable printing
Vacuum defoaming reduces printing bubbles + No change to flux system + Flexible for small batches
SIENOX solder paste defoaming solution solves problems including entrapped air after SMT solder paste stirring, printing slumping, solder splashing and solder beads. Vacuum defoaming enables stable solder paste printing, full solder joints and fewer solder beads and cold solder joints.
✓ CE certification ✓ ISO9001 Quality System ✓ RoHS Compliance ✓ Custom voltage available (110V/220V)
Why Do We Need Solder Paste Defoaming Machine
SMT PrintingAir entrapped after solder paste stirring causes slumping, stringing and pinholes when printed on PCB, impairing printed pattern integrity and SMT yield rate. | Solder Splashing & Solder BeadsBubbles inside paste expand and burst under heat during reflow soldering, generating splashed solder beads which lead to short circuits, tombstoning and other soldering defects with high rework cost. | Precision Electronic AssemblyPrecision SMT and underfill require high consistency of solder joints. Bubbles and uneven paste directly compromise solder joint reliability. |
✨ Traditional Dilemma: Air is trapped after solder paste stirring, leading to bursting and solder bead formation during reflow soldering. Manual defoaming risks altering flux activity. Gentle vacuum defoaming is required.
Why Choose SIENOX Solder Paste Defoaming Solution
Reduce Solder Bead SplashingVacuum removes bubbles inside paste to cut solder bursting and solder bead splashing during reflow and form plump solder joints. | Preserve Flux SystemGentle non-contact defoaming keeps flux activity and printing performance of solder paste unchanged. | Flexible for Small BatchesC/ZK series supports small-batch sampling and color change. MIX series for mass production enables stable and repeatable printing results. |
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Equipment Supporting Description
Supporting Process Workflow Weigh resin and powder → Vacuum stirring, mixing and degassing → Discharge for compacting / casting → Curing / sintering. | ![]() |
Specifications & Parameters
Selection Guide
| Solder Paste Application | Typical State | Recommended Defoaming Method | Recommended Equipment |
| Small Batch / Sample Test | Small amount of solder paste | Centrifugal / Vacuum Defoaming | C Series / ZK Series |
| Conventional SMT Solder Paste | High-viscosity paste | Vacuum Defoaming | MIX60 |
| Precision Assembly / Underfill | High-viscosity paste | Vacuum Stirring and Defoaming | MIX Series / MIX1000plus |
| High-demand Solder Joints | High viscosity | Vacuum stirring + Pressure Fine Defoaming | MIX1000plus / RX Series |
Our Partners
Trusted by leading industrial manufacturing clusters and advanced university laboratories worldwide
FAQ - Frequently Asked Questions
Answers to common questions about product performance and everyday process selection
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What is the working principle of a centrifugal defoaming machine?
Principle of centrifugal defoaming machine: The bubbles are released by the downward principle of gravity.
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How is the after-sales service?
The company has professional after-sales service personnel, 24-hour dedicated service, and one-on-one technical support to solve your worries.
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Why choose SIENOX?
There are many reasons for choosing SIENOX, and the following are some of the main reasons:
1. Professionalism: Our team consists of a group of professional individuals with rich experience and knowledge in their respective fields. We not only understand industry trends and best practices, but also provide practical and feasible solutions.
2. Service quality: We focus on customer needs and satisfaction, and are always committed to providing high-quality services. We not only respond quickly to customer needs, but also provide customized services according to their requirements.
3. Reliability: We adhere to the principles of integrity and professionalism, always adhering to commitments and agreements. Our work methods and deliverables comply with industry standards and best practices, enabling our clients to trust us.
4. Innovation: We continuously explore new methods and tools to provide better services and meet customer needs. We encourage innovation and experimentation, and are willing to accept challenges and change.
5. Cost effectiveness: We provide cost-effective services that not only help customers save costs, but also improve efficiency and productivity. We always prioritize the interests of our customers and provide them with the best solutions.
6. Teamwork: We believe in the power and value of teamwork, and our team members support, collaborate, and respect each other. We establish close cooperative relationships with customers, partners, and other stakeholders to achieve common goals.
The above are just some of the reasons for choosing us. We believe there are many other advantages and values that can be provided to customers. If you are looking for a professional, reliable, and high-quality service provider, we look forward to working with you.
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How does the stirring and defoaming machine work?
The SIENOX stirring and defoaming machine performs defoaming through centrifugal force at revolution and stirring through shear force formed by revolution and rotation,
Assisted by a vacuum pump to extract gas and achieve a vacuum state, removing nanoscale tiny bubbles. No contact with materials, no secondary pollution, and no secondary waste.
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What is the function of a defoaming machine?
A defoaming machine is a device used to remove bubbles from liquids. Its function is to assist in the liquid mixing, reaction, coating, printing, infusion and other process steps in the production process, avoiding the generation of bubbles and their impact on the final product. In many industrial and laboratory environments, removing bubbles is essential as they may have a negative impact on product quality, such as affecting surface tension and stability. Defoaming machines typically use various techniques such as vibration, ultrasound, centrifugation, etc. to achieve effective bubble removal. It has a wide range of applications, including but not limited to semiconductors, solar energy, optics, biotechnology, materials science, etc.
Technical Specification List
Full‑line standardized specifications for accurate process evaluation and equipment selection
| Solder Paste Application | Typical State | Recommended Defoaming Method | Recommended Equipment |
| Small Batch / Sample Preparation | Small amount of solder paste | Centrifugal / Vacuum Defoaming | C Series / ZK Series |
| Conventional SMT Solder Paste | High-viscosity paste | Vacuum Defoaming | MIX60 |
| Precision Assembly / Underfill | High-viscosity paste | Vacuum Stirring and Defoaming | MIX Series / MIX1000plus |
| High-spec Solder Joints | High viscosity | Vacuum stirring + Pressure Fine Defoaming | MIX1000plus / RX Series |
Multi‑Industry Solutions
Covering stirring and debubbling applications of typical materials across six major industries
SMT MountingPCB mounting and soldering |
Solder Paste PrintingStencil printing and solder paste defoaming |
Precision AssemblyPrecision electronics and module assembly |
UnderfillUnderfill encapsulant |
Solder Paste ProductionR&D and filling of solder paste |
Electronic ManufacturingConsumer electronics and automotive electronics |
Comprehensive Equipment Operation Demo Videos
Measured Defoaming‑Process Performance
Measured Processing Results for Six Typical Materials
Paste Materials |
Adhesive with Powder |
Polymer Materials |
Pharmaceutical Gel |
Silver Paste Materials |
Battery Slurry |
Precautions for Use
| Notes | Operation Instructions |
| Cold Chain Tempering | Solder paste shall be stored at low temperature as required. Fully temper before defoaming and stirring. |
| Gentle Defoaming | Control rotating speed and vacuum level to prevent excessive stirring from impairing printability and flux activity of solder paste. |
| Slow Pressure Relief | Release pressure slowly after defoaming to avoid re-foaming of paste. |
| Prompt Use | Print as soon as possible after defoaming to prevent moisture absorption or grain coarsening of solder paste. |
* Internal laboratory test data. Actual results vary with solder paste formulation and soldering process. Contact sales for real customer cases.
Customer Delivery & Application Cases
Rooted in manufacturing frontlines, empowering benchmark production lines and key national research institutions across diverse industries.















