Slurry Degasser

TEL:18925129293

Solder Paste Defoaming Machine


Eliminate bubbles and splashing of solder paste · Full solder joints, fewer solder beads & stable printing

Vacuum defoaming reduces printing bubbles + No change to flux system + Flexible for small batches

SIENOX solder paste defoaming solution solves problems including entrapped air after SMT solder paste stirring, printing slumping, solder splashing and solder beads. Vacuum defoaming enables stable solder paste printing, full solder joints and fewer solder beads and cold solder joints.

✓ CE certification  ✓ ISO9001 Quality System ✓ RoHS Compliance ✓ Custom voltage available (110V/220V)

Online Message Free Sample Testing Engineer Hotline: 189-2512-9293

Why Do We Need Solder Paste Defoaming Machine

SMT Printing

Air entrapped after solder paste stirring causes slumping, stringing and pinholes when printed on PCB, impairing printed pattern integrity and SMT yield rate.

Solder Splashing & Solder Beads

Bubbles inside paste expand and burst under heat during reflow soldering, generating splashed solder beads which lead to short circuits, tombstoning and other soldering defects with high rework cost.

Precision Electronic Assembly

Precision SMT and underfill require high consistency of solder joints. Bubbles and uneven paste directly compromise solder joint reliability.

✨ Traditional Dilemma: Air is trapped after solder paste stirring, leading to bursting and solder bead formation during reflow soldering. Manual defoaming risks altering flux activity. Gentle vacuum defoaming is required.

Why Choose SIENOX Solder Paste Defoaming Solution

Reduce Solder Bead Splashing

Vacuum removes bubbles inside paste to cut solder bursting and solder bead splashing during reflow and form plump solder joints.

Preserve Flux System

Gentle non-contact defoaming keeps flux activity and printing performance of solder paste unchanged.

Flexible for Small Batches

C/ZK series supports small-batch sampling and color change. MIX series for mass production enables stable and repeatable printing results.

✨

Equipment Supporting Description

Supporting Process Workflow 

Weigh resin and powder → Vacuum stirring, mixing and degassing → Discharge for compacting / casting → Curing / sintering.

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Specifications & Parameters

Selection Guide

Solder Paste ApplicationTypical StateRecommended Defoaming MethodRecommended Equipment
Small Batch / Sample TestSmall amount of solder pasteCentrifugal / Vacuum DefoamingC Series / ZK Series
Conventional SMT Solder PasteHigh-viscosity pasteVacuum DefoamingMIX60
Precision Assembly / UnderfillHigh-viscosity pasteVacuum Stirring and DefoamingMIX Series / MIX1000plus
High-demand Solder JointsHigh viscosityVacuum stirring + Pressure Fine DefoamingMIX1000plus / RX Series

Our Partners

Trusted by leading industrial manufacturing clusters and advanced university laboratories worldwide

Partner Showcase

FAQ - Frequently Asked Questions

Answers to common questions about product performance and everyday process selection

  • What is the working principle of a centrifugal defoaming machine?

    Principle of centrifugal defoaming machine: The bubbles are released by the downward principle of gravity.

  • How is the after-sales service?

    The company has professional after-sales service personnel, 24-hour dedicated service, and one-on-one technical support to solve your worries.

  • Why choose SIENOX?

    There are many reasons for choosing SIENOX, and the following are some of the main reasons:

    1. Professionalism: Our team consists of a group of professional individuals with rich experience and knowledge in their respective fields. We not only understand industry trends and best practices, but also provide practical and feasible solutions.

    2. Service quality: We focus on customer needs and satisfaction, and are always committed to providing high-quality services. We not only respond quickly to customer needs, but also provide customized services according to their requirements.

    3. Reliability: We adhere to the principles of integrity and professionalism, always adhering to commitments and agreements. Our work methods and deliverables comply with industry standards and best practices, enabling our clients to trust us.

    4. Innovation: We continuously explore new methods and tools to provide better services and meet customer needs. We encourage innovation and experimentation, and are willing to accept challenges and change.

    5. Cost effectiveness: We provide cost-effective services that not only help customers save costs, but also improve efficiency and productivity. We always prioritize the interests of our customers and provide them with the best solutions.

    6. Teamwork: We believe in the power and value of teamwork, and our team members support, collaborate, and respect each other. We establish close cooperative relationships with customers, partners, and other stakeholders to achieve common goals.

    The above are just some of the reasons for choosing us. We believe there are many other advantages and values that can be provided to customers. If you are looking for a professional, reliable, and high-quality service provider, we look forward to working with you.


  • How does the stirring and defoaming machine work?

    The SIENOX stirring and defoaming machine performs defoaming through centrifugal force at revolution and stirring through shear force formed by revolution and rotation,

    Assisted by a vacuum pump to extract gas and achieve a vacuum state, removing nanoscale tiny bubbles. No contact with materials, no secondary pollution, and no secondary waste.

  • What is the function of a defoaming machine?

    A defoaming machine is a device used to remove bubbles from liquids. Its function is to assist in the liquid mixing, reaction, coating, printing, infusion and other process steps in the production process, avoiding the generation of bubbles and their impact on the final product. In many industrial and laboratory environments, removing bubbles is essential as they may have a negative impact on product quality, such as affecting surface tension and stability. Defoaming machines typically use various techniques such as vibration, ultrasound, centrifugation, etc. to achieve effective bubble removal. It has a wide range of applications, including but not limited to semiconductors, solar energy, optics, biotechnology, materials science, etc.

Technical Specification List

Full‑line standardized specifications for accurate process evaluation and equipment selection

Solder Paste ApplicationTypical StateRecommended Defoaming MethodRecommended Equipment
Small Batch / Sample PreparationSmall amount of solder pasteCentrifugal / Vacuum DefoamingC Series / ZK Series
Conventional SMT Solder PasteHigh-viscosity pasteVacuum DefoamingMIX60
Precision Assembly / UnderfillHigh-viscosity pasteVacuum Stirring and DefoamingMIX Series / MIX1000plus
High-spec Solder JointsHigh viscosityVacuum stirring + Pressure Fine DefoamingMIX1000plus / RX Series

Multi‑Industry Solutions

Covering stirring and debubbling applications of typical materials across six major industries

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SMT Mounting

PCB mounting and soldering

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Solder Paste Printing

Stencil printing and solder paste defoaming

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Precision Assembly

Precision electronics and module assembly

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Underfill

Underfill encapsulant

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Solder Paste Production

R&D and filling of solder paste

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Electronic Manufacturing

Consumer electronics and automotive electronics

Comprehensive Equipment Operation Demo Videos

Measured Defoaming‑Process Performance

Measured Processing Results for Six Typical Materials

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Paste Materials

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Adhesive with Powder

Polymer Materials.jpg

Polymer Materials

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Pharmaceutical Gel

Silver Paste Powder Stirring & Defoaming.jpg

Silver Paste Materials

Battery Slurry & Adhesive Stirring & Defoaming.jpg

Battery Slurry

Precautions for Use

NotesOperation Instructions
Cold Chain TemperingSolder paste shall be stored at low temperature as required. Fully temper before defoaming and stirring.
Gentle DefoamingControl rotating speed and vacuum level to prevent excessive stirring from impairing printability and flux activity of solder paste.
Slow Pressure ReliefRelease pressure slowly after defoaming to avoid re-foaming of paste.
Prompt UsePrint as soon as possible after defoaming to prevent moisture absorption or grain coarsening of solder paste.

* Internal laboratory test data. Actual results vary with solder paste formulation and soldering process. Contact sales for real customer cases.

Customer Delivery & Application Cases

Rooted in manufacturing frontlines, empowering benchmark production lines and key national research institutions across diverse industries.


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Stirring‑Defoaming Solution for Glue Materials in Consumer‑Electronics Industry


施诺斯真空脱泡搅拌机在胶粘剂中的解决方案.jpg

Vacuum Defoaming Solution for Consumer Electronics Adhesives


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Industrial University Solves Bubble Challenges of Coating‑Film Materials with SIENOX Defoaming Machine

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