SIENOX Silver Paste Material Solution

Working Condition Requirements

• Material Type: Silver paste (conductive silver paste / electronic slurry)

• Initial State: Contains abundant micron-sized bubbles. Silver powder features high density and tends to settle and delaminate. Direct filling or printing easily causes pinholes and broken lines, which seriously impair conductivity and yield rate.

• Treatment Target: Uniformly remove micron-sized bubbles from silver paste, disperse silver powder particles evenly in the organic carrier, ensure consistent conductivity and uniform printing/coating of slurry, and meet high-precision process requirements for semiconductor packaging, photovoltaic cells, electronic components and other fields.

Comparison Before and After Improvement

Before Improvement — Pain Points of Traditional Processes

Silver paste is a key conductive material for semiconductor, photovoltaic, electronic component and other industries. Its quality directly determines product conductivity and yield rate. However, silver paste contains a large number of micron bubbles and silver powder with high density is prone to sedimentation, bringing multiple challenges to traditional processing methods:

• Difficult to remove micron-sized bubbles: Silver paste has high viscosity with fine silver powder particles. Traditional static placement or low-speed stirring cannot effectively eliminate micron bubbles, resulting in pinholes, broken lines and uneven film layers during printing/coating.

• Silver powder easy to settle and delaminate: The density of silver powder is much higher than that of organic carriers. Long-time static placement leads to excessive silver powder concentration at the bottom and excessive carrier on the upper layer, causing big fluctuation of conductivity between batches.

• High-speed dispersion tends to damage particles: Traditional high-speed dispersers deliver excessive shear force, which may damage the morphology of silver powder particles, change the rheological properties of slurry and affect printing precision.

• Hard to guarantee consistency: Silver paste requires extremely high uniformity. Uneven silver powder distribution in different batches with traditional methods leads to fluctuating printed resistance and unstable yield.

Solution

• Vacuum Defoaming + Planetary Motion: Under vacuum environment, strong shear and convection generated by planetary motion (rotation & revolution) make micron bubbles in silver paste float up gradually and be extracted for more thorough defoaming.

• Gentle and Uniform Dispersion: Planetary motion realizes 360° dead-angle-free mixing. Silver powder particles are re-dispersed in a soft and uniform force field without damage to particle morphology.

• High Batch Consistency: Parameterized control of rotating speed, time and vacuum degree ensures consistent treatment effect for each batch and stable printed resistance value.

• Suitable for High-precision Scenarios: The treated silver paste can be used in high-precision processes such as semiconductor packaging, grid line printing of photovoltaic cells and electrode coating of electronic components, greatly improving yield.

Advantages of Stirring Defoaming Machine

• Efficient removal of micron bubbles: Vacuum combined with planetary motion effectively removes micron bubbles inside silver paste and eliminates hidden troubles of pinholes and broken lines in printing.

• Uniform dispersion without damage: Gentle and uniform planetary motion of rotation and revolution disperses silver powder particles without damage and retains the original rheological properties of slurry.

• Precisely controllable parameters: Rotating speed, time and vacuum degree are adjustable to accurately optimize process parameters for different silver paste formulas.

• Good batch consistency: Standardized processing flow ensures even silver powder distribution across batches and small fluctuation of printed resistance.

• Time-saving & High Efficiency: The whole stirring and defoaming process is finished within several minutes, greatly boosting production efficiency.

• Compatible with high-precision processes: Treated silver paste meets high-precision printing/coating requirements for semiconductor packaging, photovoltaic cells and electronic components.

Test Conditions

Comparison Before and After Stirring

Mature Application Fields

✅ Semiconductor Packaging

✅ Photovoltaic Cells

✅ Electronic Components

✅ Flexible Circuits

✅ Conductive Coatings

✅ Sensor Manufacturing

***SIENOX has more than 1800 cases of material stirring and defoaming. Free sample test & machine trial available.