SIENOX Silver Paste Material Solution

Working Condition Requirements

• Material Type: Silver Paste (Conductive Silver Paste / Electronic Slurry)

• Initial State: Contains abundant micron-scale bubbles. Silver powder features high density and tends to settle and delaminate. Direct filling or printing easily causes pinholes and broken lines, which seriously impairs conductivity and product yield.

• Processing Target: Uniformly remove micron-sized bubbles in silver paste, disperse silver powder particles evenly within the organic carrier, ensure consistent conductivity and uniform printing/coating of the slurry, and meet high-precision process requirements for semiconductor packaging, photovoltaic cells and electronic components.

Comparison Before and After Improvement

Before Improvement — Pain Points of Traditional Processes

Silver paste is a key conductive material for industries including semiconductors, photovoltaics and electronic components. Its quality directly determines product conductivity and yield. Nevertheless, silver paste contains numerous micron bubbles and high-density silver powder prone to sedimentation, bringing multiple challenges to conventional processing:

• Difficult removal of micron-scale bubbles: High viscosity of silver paste and fine silver powder particles make static storage or low-speed stirring ineffective for eliminating micron bubbles, resulting in pinholes, broken lines and uneven films during printing & coating.

• Silver powder sedimentation and delamination: Silver powder has much higher density than organic carriers. Long-term static placement leads to excessive silver powder concentration at the bottom and surplus carrier on the upper layer, causing large fluctuations of conductivity between batches.

• High-speed dispersion damages particles: Traditional high-speed dispersers deliver excessive shear force, which may damage silver powder morphology, alter slurry rheological properties and reduce printing precision.

• Poor consistency: Silver paste demands extremely high homogeneity. Conventional methods create uneven silver powder distribution across batches, triggering fluctuation of printed resistance and unstable yield.

Solution

• Vacuum Defoaming + Planetary Motion: Under vacuum conditions, planetary rotation & revolution generates powerful shear and convection, gradually lifting and extracting micron bubbles inside silver paste for thorough defoaming.

• Gentle & Uniform Dispersion: Planetary motion delivers 360° dead-zone-free mixing. Silver powder particles are re-dispersed under mild and uniform force field without morphology damage.

• High Batch Consistency: Parameterized control over rotating speed, duration and vacuum level guarantees consistent results for every batch and stable printed resistance.

• Compatible with High-precision Scenarios: Processed silver paste applies to high-precision processes such as semiconductor packaging, photovoltaic cell grid line printing and electrode coating of electronic components, greatly lifting product yield.

Advantages of Mixing & Defoaming Machine

• Efficient Removal of Micron Bubbles: Vacuum environment combined with planetary motion effectively eliminates micron bubbles in silver paste and eliminates risks of printing pinholes and broken lines.

• Uniform Dispersion Without Damage: Gentle and uniform planetary motion of rotation and revolution realizes damage-free dispersion of silver powder and preserves original slurry rheology.

• Precisely Controllable Parameters: Adjustable rotating speed, processing time and vacuum degree for accurate parameter optimization tailored to different silver paste formulas.

• Excellent Batch Consistency: Standardized workflow ensures even silver powder distribution across batches and minor fluctuation of printed resistance.

• High Efficiency & Time Saving: Complete mixing and defoaming within several minutes to greatly boost production efficiency.

• Compatible with High-precision Processes: Treated silver paste meets high-precision printing / coating requirements for semiconductor packaging, photovoltaic cells and electronic components.

Test Conditions

Comparison Before and After Mixing

Mature Application Fields

✅ Semiconductor Packaging

✅ Photovoltaic Cells

✅ Electronic Components

✅ Flexible Circuits

✅ Conductive Coatings

✅ Sensor Manufacturing

SIENOX has accumulated more than 1800 cases of material mixing and defoaming. Free sample test and machine trial available.