Solutions

SIENOX has 20‑years of focus on mixing and defoaming for adhesives and sealants. We provide comprehensive vacuum mixing‑defoaming solutions for full‑range adhesive types including epoxy resin, polyurethane, silicone sealant and acrylic adhesive.

Practical test of planetary mixing and defoaming process parameters for three major categories of UV adhesives: optical-grade, electronic assembly-grade and thick-coat types. Covering viscosity range from 800 to 18,000 cps with bubble removal rate＞98%, it solves bubble-related issues including reduced light transmittance, incomplete curing and bonding failure.

SIENOX boasts 20‑year expertise in mixing and defoaming for high‑viscosity colloid and phosphor powder materials. We deliver vacuum mixing‑defoaming solutions for LED phosphor glue, optical phosphor coating, fluorescent encapsulation adhesive, phosphor conversion materials and other high‑viscosity colloid‑phosphor composites.

In fields such as electronic packaging, medical consumables and automotive seals, silicone rubber serves as a critical material thanks to its high elasticity, high‑temperature resistance and aging resistance. Nevertheless, bubbles tend to form during silicone rubber compounding and injection molding, which impair product appearance, mechanical properties and service life.

SIENOX provides practical test cases of vacuum degassing for solder paste, covering three typical working conditions: standard SMT printing solder paste (Type 4), fine-pitch high-density solder paste (Type 5), and semiconductor packaging grade solder paste (Type 6). Bubble removal rate＞98%, free material testing available.