Products

SIENOX conductive adhesive defoaming solution addresses the problem of air entrapment and agglomeration of silver/nickel-silver fillers in conductive epoxy and conductive bonding adhesives. It realizes mixing, defoaming and dispersion at the same time under vacuum, creating dense adhesive layers with continuous conductivity and stable low contact resistance.

SIENOX silicone sealant defoaming solution addresses air entrapment and void defects during filling and dispensing of one-component glass glue and silicone sealants. After vacuum defoaming, the sealant beads are full and continuous with reliable weather-resistant sealing performance.

SIE‑MIX2000 delivers efficient vacuum mixing for small‑batch electronics

SIE‑MIX2000 delivers efficient vacuum mixing for small‑batch electronics

Expanded defoamer boosts mass‑production throughput reliably

Mass‑production defoamer for large‑size & high‑volume demands