Adhesive Degasser
TEL:18925129293
Conductive Adhesive Defoaming Machine
Eliminate Bubbles & Filler Agglomeration for Conductive Adhesives · Continuous Conductive Path and Low Contact Resistance
Vacuum Defoaming + Disperse Conductive Fillers + Non-contact Design Without Contaminating High-value Adhesives
SIENOX conductive adhesive defoaming solution solves the problem of air entrapment and agglomeration of silver/nickel-silver fillers in conductive epoxy and conductive bonding adhesives. Mixing, defoaming and dispersion are completed simultaneously under vacuum to achieve dense adhesive layers, continuous conductivity and stable low contact resistance.
✓ CE Certification ✓ ISO9001 Quality System ✓ RoHS Compliance ✓ Custom Voltage Available (110V/220V)
Why Need Conductive Adhesive Defoaming Machine
Conductive Bonding of ComponentsConductive adhesives are used for bonding and grounding of electronic components and shielding cans. Bubbles and filler agglomeration will cause discontinuous conductivity, high contact resistance and failure of shielding grounding. | Filler AgglomerationSilver / nickel-silver conductive fillers tend to agglomerate and trap air, breaking conductive paths in adhesive layers and causing batch fluctuation of resistance. | High-value AdhesivesSilver-filled conductive adhesives come with high material cost. Insufficient defoaming leads to dispensing voids and defective products, so a stable and reproducible defoaming process is required. |
✨ Traditional Dilemma: Conductive adhesives suffer from both air entrapment and filler agglomeration, resulting in fluctuating conductive resistance and voids during dispensing. Synchronized vacuum defoaming and dispersion is required.
Why Choose SIENOX Conductive Adhesive Defoaming Solution
Continuous ConductivityVacuum defoaming and conductive filler dispersion deliver dense adhesive layers with continuous conductive paths and low, stable contact resistance. | Clean Non-contact OperationNo contamination to high-value conductive adhesives and no ratio change, ensuring consistent bonding and conductive performance across batches. | Smooth Scale-upC/ZK series for formula sampling, MIX series for mass production; process parameters can be scaled up smoothly. |
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Equipment Supporting Description
SIENOX AB adhesive defoaming solution can be combined with other equipment to form a complete potting process chain: Integrated Mixing & Defoaming: MIX series mixers complete mixing of AB adhesives and synchronous defoaming under vacuum, finishing mixing and bubble removal in one single process. Temperature-controlled Defoaming: WK series temperature-controlled defoamers perform defoaming at preset temperatures. Suitable for high-viscosity AB adhesives to reduce viscosity by heating and improve defoaming efficiency. Defoaming & Dispensing Linkage: Directly connect to SIE-301/302/303 dispensers for potting after defoaming to avoid new bubbles introduced during material transfer. Pressurized Fine Defoaming: For scenarios requiring high defoaming rate, transfer materials to RX pressurized defoamer for secondary fine defoaming after vacuum mixing to achieve higher defoaming performance. | ![]() |
Specifications & Parameters
Selection Guide
| Conductive Adhesive Type | Typical State | Recommended Defoaming Method | Recommended Equipment |
| R&D Sampling | Small batch of adhesive | Centrifugal / Vacuum Defoaming & Dispersion | C Series / ZK Series |
| Conductive Epoxy Adhesive | High-viscosity Paste | Vacuum Mixing, Defoaming & Dispersion | MIX60 / MIX80 |
| EMI Shielding Conductive Adhesive | Medium to High Viscosity | Vacuum Mixing, Defoaming & Dispersion | MIX Series / MIX1000plus |
| High-precision Conductive Bonding | High Viscosity | Vacuum Mixing + Pressurized Fine Defoaming | MIX1000plus / RX Series |
Our Partners
Trusted by leading industrial manufacturing clusters and advanced university laboratories worldwide
FAQ - Frequently Asked Questions
Answers to common questions about product performance and everyday process selection
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What is the working principle of a centrifugal defoaming machine?
Principle of centrifugal defoaming machine: The bubbles are released by the downward principle of gravity.
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How is the after-sales service?
The company has professional after-sales service personnel, 24-hour dedicated service, and one-on-one technical support to solve your worries.
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Why choose SIENOX?
There are many reasons for choosing SIENOX, and the following are some of the main reasons:
1. Professionalism: Our team consists of a group of professional individuals with rich experience and knowledge in their respective fields. We not only understand industry trends and best practices, but also provide practical and feasible solutions.
2. Service quality: We focus on customer needs and satisfaction, and are always committed to providing high-quality services. We not only respond quickly to customer needs, but also provide customized services according to their requirements.
3. Reliability: We adhere to the principles of integrity and professionalism, always adhering to commitments and agreements. Our work methods and deliverables comply with industry standards and best practices, enabling our clients to trust us.
4. Innovation: We continuously explore new methods and tools to provide better services and meet customer needs. We encourage innovation and experimentation, and are willing to accept challenges and change.
5. Cost effectiveness: We provide cost-effective services that not only help customers save costs, but also improve efficiency and productivity. We always prioritize the interests of our customers and provide them with the best solutions.
6. Teamwork: We believe in the power and value of teamwork, and our team members support, collaborate, and respect each other. We establish close cooperative relationships with customers, partners, and other stakeholders to achieve common goals.
The above are just some of the reasons for choosing us. We believe there are many other advantages and values that can be provided to customers. If you are looking for a professional, reliable, and high-quality service provider, we look forward to working with you.
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How does the stirring and defoaming machine work?
The SIENOX stirring and defoaming machine performs defoaming through centrifugal force at revolution and stirring through shear force formed by revolution and rotation,
Assisted by a vacuum pump to extract gas and achieve a vacuum state, removing nanoscale tiny bubbles. No contact with materials, no secondary pollution, and no secondary waste.
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What is the function of a defoaming machine?
A defoaming machine is a device used to remove bubbles from liquids. Its function is to assist in the liquid mixing, reaction, coating, printing, infusion and other process steps in the production process, avoiding the generation of bubbles and their impact on the final product. In many industrial and laboratory environments, removing bubbles is essential as they may have a negative impact on product quality, such as affecting surface tension and stability. Defoaming machines typically use various techniques such as vibration, ultrasound, centrifugation, etc. to achieve effective bubble removal. It has a wide range of applications, including but not limited to semiconductors, solar energy, optics, biotechnology, materials science, etc.
Technical Specification List
Full‑line standardized specifications for accurate process evaluation and equipment selection
| Conductive Adhesive Type | Typical State | Recommended Defoaming Method | Recommended Equipment |
| R&D Sampling | Small volume adhesive | Centrifugal / Vacuum Defoaming & Dispersion | C Series / ZK Series |
| Conductive Epoxy Adhesive | High-viscosity Paste | Vacuum Mixing, Defoaming & Dispersion | MIX60 / MIX80 |
| EMI Shielding Conductive Adhesive | Medium to High Viscosity | Vacuum Mixing, Defoaming & Dispersion | MIX Series / MIX1000plus |
| High-precision Conductive Bonding | High Viscosity | Vacuum Mixing + Pressurized Fine Defoaming | MIX1000plus / RX Series |
Multi‑Industry Solutions
Covering stirring and debubbling applications of typical materials across six major industries
Conductive BondingConductive bonding and grounding for electronic components |
EMI ShieldingShielding cans and conductive sealing |
Chip BondingDie attach conductive bonding for chips |
Photovoltaic ModulesConductive bonding for modules |
Automotive ElectronicsOn-board conductive bonding and grounding |
Conductive Adhesive ManufacturersR&D and filling of conductive adhesives |
Full-range Equipment Operation Demo Videos
Measured Defoaming‑Process Performance
Measured Processing Results for Six Typical Materials
Paste Materials |
Adhesives & Powders |
Polymer Materials |
Pharmaceutical Gels |
Silver Paste Materials |
Battery Slurries |
Precautions for Use
| Precautions | Operating Instructions |
| Loading & Rotation Speed | Conductive fillers tend to sink to the bottom. Match the cup loading volume with rotation speed to ensure uniform filler dispersion. |
| Anti-oxidation & Anti-contamination | Prevent oxidation of silver fillers and cross-contamination; keep tools and containers clean. |
| Slow Pressure Relief | Release pressure slowly after defoaming to avoid foaming and splashing of paste materials. |
| Timely Dispensing | Perform dispensing promptly after defoaming and dispersion to prevent filler agglomeration and sedimentation during standing. |
* Internal laboratory test data. Actual results vary depending on adhesive formulation and dispensing process. Contact sales for real customer cases.
Customer Delivery & Application Cases
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