Adhesive Degasser

TEL:18925129293

Conductive Adhesive Defoaming Machine


Eliminate Bubbles & Filler Agglomeration for Conductive Adhesives · Continuous Conductive Path and Low Contact Resistance

Vacuum Defoaming + Disperse Conductive Fillers + Non-contact Design Without Contaminating High-value Adhesives

SIENOX conductive adhesive defoaming solution solves the problem of air entrapment and agglomeration of silver/nickel-silver fillers in conductive epoxy and conductive bonding adhesives. Mixing, defoaming and dispersion are completed simultaneously under vacuum to achieve dense adhesive layers, continuous conductivity and stable low contact resistance.

✓ CE Certification  ✓ ISO9001 Quality System ✓ RoHS Compliance ✓ Custom Voltage Available (110V/220V)

Online Message Free Sample Testing Engineer Hotline: 189-2512-9293

Why Need Conductive Adhesive Defoaming Machine

Conductive Bonding of Components

Conductive adhesives are used for bonding and grounding of electronic components and shielding cans. Bubbles and filler agglomeration will cause discontinuous conductivity, high contact resistance and failure of shielding grounding.

Filler Agglomeration

Silver / nickel-silver conductive fillers tend to agglomerate and trap air, breaking conductive paths in adhesive layers and causing batch fluctuation of resistance.

High-value Adhesives

Silver-filled conductive adhesives come with high material cost. Insufficient defoaming leads to dispensing voids and defective products, so a stable and reproducible defoaming process is required.

✨ Traditional Dilemma: Conductive adhesives suffer from both air entrapment and filler agglomeration, resulting in fluctuating conductive resistance and voids during dispensing. Synchronized vacuum defoaming and dispersion is required.

Why Choose SIENOX Conductive Adhesive Defoaming Solution

Continuous Conductivity

Vacuum defoaming and conductive filler dispersion deliver dense adhesive layers with continuous conductive paths and low, stable contact resistance.

Clean Non-contact Operation

No contamination to high-value conductive adhesives and no ratio change, ensuring consistent bonding and conductive performance across batches.

Smooth Scale-up

C/ZK series for formula sampling, MIX series for mass production; process parameters can be scaled up smoothly.

✨

Equipment Supporting Description

SIENOX AB adhesive defoaming solution can be combined with other equipment to form a complete potting process chain: 

Integrated Mixing & Defoaming: MIX series mixers complete mixing of AB adhesives and synchronous defoaming under vacuum, finishing mixing and bubble removal in one single process. 

Temperature-controlled Defoaming: WK series temperature-controlled defoamers perform defoaming at preset temperatures. Suitable for high-viscosity AB adhesives to reduce viscosity by heating and improve defoaming efficiency. 

Defoaming & Dispensing Linkage: Directly connect to SIE-301/302/303 dispensers for potting after defoaming to avoid new bubbles introduced during material transfer. 

Pressurized Fine Defoaming: For scenarios requiring high defoaming rate, transfer materials to RX pressurized defoamer for secondary fine defoaming after vacuum mixing to achieve higher defoaming performance.

Mixing and Defoaming Working Principle 03.jpg

Specifications & Parameters

Selection Guide

Conductive Adhesive TypeTypical StateRecommended Defoaming MethodRecommended Equipment
R&D SamplingSmall batch of adhesiveCentrifugal / Vacuum Defoaming & DispersionC Series / ZK Series
Conductive Epoxy AdhesiveHigh-viscosity PasteVacuum Mixing, Defoaming & DispersionMIX60 / MIX80
EMI Shielding Conductive AdhesiveMedium to High ViscosityVacuum Mixing, Defoaming & DispersionMIX Series / MIX1000plus
High-precision Conductive BondingHigh ViscosityVacuum Mixing + Pressurized Fine DefoamingMIX1000plus / RX Series

Our Partners

Trusted by leading industrial manufacturing clusters and advanced university laboratories worldwide

Partner Showcase

FAQ - Frequently Asked Questions

Answers to common questions about product performance and everyday process selection

  • What is the working principle of a centrifugal defoaming machine?

    Principle of centrifugal defoaming machine: The bubbles are released by the downward principle of gravity.

  • How is the after-sales service?

    The company has professional after-sales service personnel, 24-hour dedicated service, and one-on-one technical support to solve your worries.

  • Why choose SIENOX?

    There are many reasons for choosing SIENOX, and the following are some of the main reasons:

    1. Professionalism: Our team consists of a group of professional individuals with rich experience and knowledge in their respective fields. We not only understand industry trends and best practices, but also provide practical and feasible solutions.

    2. Service quality: We focus on customer needs and satisfaction, and are always committed to providing high-quality services. We not only respond quickly to customer needs, but also provide customized services according to their requirements.

    3. Reliability: We adhere to the principles of integrity and professionalism, always adhering to commitments and agreements. Our work methods and deliverables comply with industry standards and best practices, enabling our clients to trust us.

    4. Innovation: We continuously explore new methods and tools to provide better services and meet customer needs. We encourage innovation and experimentation, and are willing to accept challenges and change.

    5. Cost effectiveness: We provide cost-effective services that not only help customers save costs, but also improve efficiency and productivity. We always prioritize the interests of our customers and provide them with the best solutions.

    6. Teamwork: We believe in the power and value of teamwork, and our team members support, collaborate, and respect each other. We establish close cooperative relationships with customers, partners, and other stakeholders to achieve common goals.

    The above are just some of the reasons for choosing us. We believe there are many other advantages and values that can be provided to customers. If you are looking for a professional, reliable, and high-quality service provider, we look forward to working with you.


  • How does the stirring and defoaming machine work?

    The SIENOX stirring and defoaming machine performs defoaming through centrifugal force at revolution and stirring through shear force formed by revolution and rotation,

    Assisted by a vacuum pump to extract gas and achieve a vacuum state, removing nanoscale tiny bubbles. No contact with materials, no secondary pollution, and no secondary waste.

  • What is the function of a defoaming machine?

    A defoaming machine is a device used to remove bubbles from liquids. Its function is to assist in the liquid mixing, reaction, coating, printing, infusion and other process steps in the production process, avoiding the generation of bubbles and their impact on the final product. In many industrial and laboratory environments, removing bubbles is essential as they may have a negative impact on product quality, such as affecting surface tension and stability. Defoaming machines typically use various techniques such as vibration, ultrasound, centrifugation, etc. to achieve effective bubble removal. It has a wide range of applications, including but not limited to semiconductors, solar energy, optics, biotechnology, materials science, etc.

Technical Specification List

Full‑line standardized specifications for accurate process evaluation and equipment selection

Conductive Adhesive TypeTypical StateRecommended Defoaming MethodRecommended Equipment
R&D SamplingSmall volume adhesiveCentrifugal / Vacuum Defoaming & DispersionC Series / ZK Series
Conductive Epoxy AdhesiveHigh-viscosity PasteVacuum Mixing, Defoaming & DispersionMIX60 / MIX80
EMI Shielding Conductive AdhesiveMedium to High ViscosityVacuum Mixing, Defoaming & DispersionMIX Series / MIX1000plus
High-precision Conductive BondingHigh ViscosityVacuum Mixing + Pressurized Fine DefoamingMIX1000plus / RX Series

Multi‑Industry Solutions

Covering stirring and debubbling applications of typical materials across six major industries

Conductive Bonding.jpg

Conductive Bonding

Conductive bonding and grounding for electronic components

EMI Shielding.jpg

EMI Shielding

Shielding cans and conductive sealing

Chip Bonding.jpg

Chip Bonding

Die attach conductive bonding for chips

Photovoltaic.jpg

Photovoltaic Modules

Conductive bonding for modules

Automotive Electronics.jpg

Automotive Electronics

On-board conductive bonding and grounding

Conductive Adhesive Factory.jpg

Conductive Adhesive Manufacturers

R&D and filling of conductive adhesives

Full-range Equipment Operation Demo Videos

Measured Defoaming‑Process Performance

Measured Processing Results for Six Typical Materials

Lubricant Mixing & Defoaming.jpg

Paste Materials

Photoresist Mixing & Defoaming.jpg

Adhesives & Powders

Polymer Materials.jpg

Polymer Materials

Gel Defoaming 02.jpg

Pharmaceutical Gels

Silver Paste Mixing & Defoaming.jpg

Silver Paste Materials

Battery Slurry & Adhesive Mixing Defoaming.jpg

Battery Slurries



Precautions for Use

PrecautionsOperating Instructions
Loading & Rotation SpeedConductive fillers tend to sink to the bottom. Match the cup loading volume with rotation speed to ensure uniform filler dispersion.
Anti-oxidation & Anti-contaminationPrevent oxidation of silver fillers and cross-contamination; keep tools and containers clean.
Slow Pressure ReliefRelease pressure slowly after defoaming to avoid foaming and splashing of paste materials.
Timely DispensingPerform dispensing promptly after defoaming and dispersion to prevent filler agglomeration and sedimentation during standing.

* Internal laboratory test data. Actual results vary depending on adhesive formulation and dispensing process. Contact sales for real customer cases.

Customer Delivery & Application Cases

Rooted in manufacturing frontlines, empowering benchmark production lines and key national research institutions across diverse industries.


真空脱泡搅拌机:彻底解决UV胶固化难题01.jpg

Stirring‑Defoaming Solution for Glue Materials in Consumer‑Electronics Industry


施诺斯真空脱泡搅拌机在胶粘剂中的解决方案.jpg

Vacuum Defoaming Solution for Consumer Electronics Adhesives


涂膜材料01.jpg

Industrial University Solves Bubble Challenges of Coating‑Film Materials with SIENOX Defoaming Machine

Back to Top