Adhesive Degasser
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Underfill Defoaming Machine
Eliminate Underfill Voids & Bubbles · Complete Chip Filling & Reliable Solder Joints
High-fluidity Defoaming + Void-free Filling + Reliable Precision Electronic Assembly
The SIENOX underfill defoaming solution solves the air entrapment issue that easily occurs when CSP/BGA underfill adhesive flows and fills the bottom of chips. Vacuum defoaming ensures complete void-free filling, relieves thermal stress and protects solder joints effectively.
✓ CE Certification ✓ ISO9001 Quality System ✓ RoHS Compliance ✓ Custom Voltage Available (110V/220V)
Why Underfill Defoaming Machine Is Required
BGA/CSP UnderfillWhen underfill adhesive flows to fill beneath chips, bubbles and voids lead to concentrated thermal stress, resulting in solder joint cracking and chip failure under temperature cycling. | Restricted Filling FlowEntrapped air hinders capillary filling of adhesive, leaving unfilled voids at the bottom and weakening protection and reinforcement performance. | Yield for Precision PackagingPrecision electronic packaging is highly sensitive to voids. Rework cost for void defects is high, so adhesive must be fully defoamed before dispensing. |
✨ Traditional Dilemma: Air entrapment occurs during underfill dispensing, causing voids under the chip and solder joint cracking. High-fluidity defoaming is required to achieve void-free filling.
Why Choose SIENOX Underfill Defoaming Solution
Void-free FillingAfter bubble removal, the adhesive flows well for complete filling under chips without voids, delivering higher solder joint reliability. | Precision Volume ControlNon-contact defoaming keeps adhesive ratio and fluidity unchanged, ensuring accurate and stable dispensing volume. | From Lab Samples to Mass ProductionC/ZK series for R&D sampling and MIX series for mass production enable smooth process scaling-up. |
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Equipment Supporting Description
SIENOX AB adhesive defoaming solution can cooperate with other equipment to form a complete potting process chain: Integrated Mixing & Defoaming: MIX series planetary mixers mix AB adhesives and perform synchronous defoaming under vacuum, finishing mixing and bubble removal in one single process. Temperature-controlled Defoaming: WK series temperature-controlled defoamers work at preset temperatures. It is suitable for high-viscosity AB adhesives, which can be heated to reduce viscosity and improve defoaming efficiency. Defoaming & Dispensing Linkage: Directly connect to SIE-301/302/303 dispensers for potting after defoaming to reduce new bubbles generated during material transfer. Pressurized Fine Defoaming: For applications requiring high defoaming rate, transfer materials to RX pressurized defoamer for secondary fine defoaming after vacuum mixing to achieve superior bubble removal performance. | ![]() |
Specifications & Parameters
Selection Guide
| Underfill Adhesive Type | Typical State | Recommended Defoaming Method | Recommended Equipment |
| R&D Sampling | Small volume adhesive | Centrifugal / Vacuum Defoaming | C Series / ZK Series |
| Capillary Flow Underfill | Low to Medium Viscosity | Vacuum Defoaming | ZK Series / MIX60 |
| Fast-cure Underfill | Medium Viscosity | Vacuum Mixing & Defoaming | MIX60 / MIX80 |
| Mass Packaging Dispensing | Medium Viscosity | Vacuum Mixing & Defoaming | MIX1000plus |
Our Partners
Trusted by leading industrial manufacturing clusters and advanced university laboratories worldwide
FAQ - Frequently Asked Questions
Answers to common questions about product performance and everyday process selection
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What is the working principle of a centrifugal defoaming machine?
Principle of centrifugal defoaming machine: The bubbles are released by the downward principle of gravity.
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How is the after-sales service?
The company has professional after-sales service personnel, 24-hour dedicated service, and one-on-one technical support to solve your worries.
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Why choose SIENOX?
There are many reasons for choosing SIENOX, and the following are some of the main reasons:
1. Professionalism: Our team consists of a group of professional individuals with rich experience and knowledge in their respective fields. We not only understand industry trends and best practices, but also provide practical and feasible solutions.
2. Service quality: We focus on customer needs and satisfaction, and are always committed to providing high-quality services. We not only respond quickly to customer needs, but also provide customized services according to their requirements.
3. Reliability: We adhere to the principles of integrity and professionalism, always adhering to commitments and agreements. Our work methods and deliverables comply with industry standards and best practices, enabling our clients to trust us.
4. Innovation: We continuously explore new methods and tools to provide better services and meet customer needs. We encourage innovation and experimentation, and are willing to accept challenges and change.
5. Cost effectiveness: We provide cost-effective services that not only help customers save costs, but also improve efficiency and productivity. We always prioritize the interests of our customers and provide them with the best solutions.
6. Teamwork: We believe in the power and value of teamwork, and our team members support, collaborate, and respect each other. We establish close cooperative relationships with customers, partners, and other stakeholders to achieve common goals.
The above are just some of the reasons for choosing us. We believe there are many other advantages and values that can be provided to customers. If you are looking for a professional, reliable, and high-quality service provider, we look forward to working with you.
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How does the stirring and defoaming machine work?
The SIENOX stirring and defoaming machine performs defoaming through centrifugal force at revolution and stirring through shear force formed by revolution and rotation,
Assisted by a vacuum pump to extract gas and achieve a vacuum state, removing nanoscale tiny bubbles. No contact with materials, no secondary pollution, and no secondary waste.
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What is the function of a defoaming machine?
A defoaming machine is a device used to remove bubbles from liquids. Its function is to assist in the liquid mixing, reaction, coating, printing, infusion and other process steps in the production process, avoiding the generation of bubbles and their impact on the final product. In many industrial and laboratory environments, removing bubbles is essential as they may have a negative impact on product quality, such as affecting surface tension and stability. Defoaming machines typically use various techniques such as vibration, ultrasound, centrifugation, etc. to achieve effective bubble removal. It has a wide range of applications, including but not limited to semiconductors, solar energy, optics, biotechnology, materials science, etc.
Technical Specification List
Full‑line standardized specifications for accurate process evaluation and equipment selection
| Underfill Adhesive Type | Typical State | Recommended Defoaming Method | Recommended Equipment |
| R&D Sampling | Small volume adhesive | Centrifugal / Vacuum Defoaming | C Series / ZK Series |
| Capillary Flow Underfill | Low to Medium Viscosity | Vacuum Defoaming | ZK Series / MIX60 |
| Fast-cure Underfill | Medium Viscosity | Vacuum Mixing & Defoaming | MIX60 / MIX80 |
| Mass Packaging Dispensing | Medium Viscosity | Vacuum Mixing & Defoaming | MIX1000plus |
Multi‑Industry Solutions
Covering stirring and debubbling applications of typical materials across six major industries
BGA PackagingBGA/CSP Underfill |
Mobile ChipsChip packaging for mobile phones and tablets |
Memory ChipsUnderfill for memory devices and modules |
Automotive ElectronicsUnderfill for automotive modules |
Camera ModulesFilling and reinforcement for image modules |
Underfill ManufacturersR&D and filling of underfill adhesives |
Full-range Equipment Operation Demo Videos
Measured Defoaming‑Process Performance
Measured Processing Results for Six Typical Materials
Paste Materials |
Adhesives & Powders |
Polymer Materials |
Pharmaceutical Gels |
Silver Paste Materials |
Battery Slurries |
Precautions for Use
| Precautions | Operating Instructions |
| Preheating for Viscosity Reduction | High-viscosity underfill can be preheated to reduce viscosity before defoaming according to process requirements to improve fluidity. |
| Slow Pressure Relief | Release pressure slowly after defoaming to prevent re-foaming which adversely affects dispensing. |
| Precision Volume Control | Verify sufficient defoaming before dispensing to avoid voids caused by microbubbles. |
| Timely Dispensing | Complete dispensing and filling promptly after defoaming to prevent air re-entrapment during standing. |
* Internal laboratory test data. Actual results vary depending on adhesive formulation and dispensing process. Contact sales for real customer cases.
Customer Delivery & Application Cases
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