Adhesive Degasser

TEL:18925129293

Underfill Defoaming Machine


Eliminate Underfill Voids & Bubbles · Complete Chip Filling & Reliable Solder Joints

High-fluidity Defoaming + Void-free Filling + Reliable Precision Electronic Assembly

The SIENOX underfill defoaming solution solves the air entrapment issue that easily occurs when CSP/BGA underfill adhesive flows and fills the bottom of chips. Vacuum defoaming ensures complete void-free filling, relieves thermal stress and protects solder joints effectively.

✓ CE Certification  ✓ ISO9001 Quality System ✓ RoHS Compliance ✓ Custom Voltage Available (110V/220V)

Online Message Free Sample Testing Engineer Hotline: 189-2512-9293

Why Underfill Defoaming Machine Is Required

BGA/CSP Underfill

When underfill adhesive flows to fill beneath chips, bubbles and voids lead to concentrated thermal stress, resulting in solder joint cracking and chip failure under temperature cycling.

Restricted Filling Flow

Entrapped air hinders capillary filling of adhesive, leaving unfilled voids at the bottom and weakening protection and reinforcement performance.

Yield for Precision Packaging

Precision electronic packaging is highly sensitive to voids. Rework cost for void defects is high, so adhesive must be fully defoamed before dispensing.

✨ Traditional Dilemma: Air entrapment occurs during underfill dispensing, causing voids under the chip and solder joint cracking. High-fluidity defoaming is required to achieve void-free filling.

Why Choose SIENOX Underfill Defoaming Solution

Void-free Filling

After bubble removal, the adhesive flows well for complete filling under chips without voids, delivering higher solder joint reliability.

Precision Volume Control

Non-contact defoaming keeps adhesive ratio and fluidity unchanged, ensuring accurate and stable dispensing volume.

From Lab Samples to Mass Production

C/ZK series for R&D sampling and MIX series for mass production enable smooth process scaling-up.

✨

Equipment Supporting Description

SIENOX AB adhesive defoaming solution can cooperate with other equipment to form a complete potting process chain: 

Integrated Mixing & Defoaming: MIX series planetary mixers mix AB adhesives and perform synchronous defoaming under vacuum, finishing mixing and bubble removal in one single process. 

Temperature-controlled Defoaming: WK series temperature-controlled defoamers work at preset temperatures. It is suitable for high-viscosity AB adhesives, which can be heated to reduce viscosity and improve defoaming efficiency. 

Defoaming & Dispensing Linkage: Directly connect to SIE-301/302/303 dispensers for potting after defoaming to reduce new bubbles generated during material transfer. 

Pressurized Fine Defoaming: For applications requiring high defoaming rate, transfer materials to RX pressurized defoamer for secondary fine defoaming after vacuum mixing to achieve superior bubble removal performance.

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Specifications & Parameters

Selection Guide

Underfill Adhesive TypeTypical StateRecommended Defoaming MethodRecommended Equipment
R&D SamplingSmall volume adhesiveCentrifugal / Vacuum DefoamingC Series / ZK Series
Capillary Flow UnderfillLow to Medium ViscosityVacuum DefoamingZK Series / MIX60
Fast-cure UnderfillMedium ViscosityVacuum Mixing & DefoamingMIX60 / MIX80
Mass Packaging DispensingMedium ViscosityVacuum Mixing & DefoamingMIX1000plus

Our Partners

Trusted by leading industrial manufacturing clusters and advanced university laboratories worldwide

Partner Showcase

FAQ - Frequently Asked Questions

Answers to common questions about product performance and everyday process selection

  • What is the working principle of a centrifugal defoaming machine?

    Principle of centrifugal defoaming machine: The bubbles are released by the downward principle of gravity.

  • How is the after-sales service?

    The company has professional after-sales service personnel, 24-hour dedicated service, and one-on-one technical support to solve your worries.

  • Why choose SIENOX?

    There are many reasons for choosing SIENOX, and the following are some of the main reasons:

    1. Professionalism: Our team consists of a group of professional individuals with rich experience and knowledge in their respective fields. We not only understand industry trends and best practices, but also provide practical and feasible solutions.

    2. Service quality: We focus on customer needs and satisfaction, and are always committed to providing high-quality services. We not only respond quickly to customer needs, but also provide customized services according to their requirements.

    3. Reliability: We adhere to the principles of integrity and professionalism, always adhering to commitments and agreements. Our work methods and deliverables comply with industry standards and best practices, enabling our clients to trust us.

    4. Innovation: We continuously explore new methods and tools to provide better services and meet customer needs. We encourage innovation and experimentation, and are willing to accept challenges and change.

    5. Cost effectiveness: We provide cost-effective services that not only help customers save costs, but also improve efficiency and productivity. We always prioritize the interests of our customers and provide them with the best solutions.

    6. Teamwork: We believe in the power and value of teamwork, and our team members support, collaborate, and respect each other. We establish close cooperative relationships with customers, partners, and other stakeholders to achieve common goals.

    The above are just some of the reasons for choosing us. We believe there are many other advantages and values that can be provided to customers. If you are looking for a professional, reliable, and high-quality service provider, we look forward to working with you.


  • How does the stirring and defoaming machine work?

    The SIENOX stirring and defoaming machine performs defoaming through centrifugal force at revolution and stirring through shear force formed by revolution and rotation,

    Assisted by a vacuum pump to extract gas and achieve a vacuum state, removing nanoscale tiny bubbles. No contact with materials, no secondary pollution, and no secondary waste.

  • What is the function of a defoaming machine?

    A defoaming machine is a device used to remove bubbles from liquids. Its function is to assist in the liquid mixing, reaction, coating, printing, infusion and other process steps in the production process, avoiding the generation of bubbles and their impact on the final product. In many industrial and laboratory environments, removing bubbles is essential as they may have a negative impact on product quality, such as affecting surface tension and stability. Defoaming machines typically use various techniques such as vibration, ultrasound, centrifugation, etc. to achieve effective bubble removal. It has a wide range of applications, including but not limited to semiconductors, solar energy, optics, biotechnology, materials science, etc.

Technical Specification List

Full‑line standardized specifications for accurate process evaluation and equipment selection

Underfill Adhesive TypeTypical StateRecommended Defoaming MethodRecommended Equipment
R&D SamplingSmall volume adhesiveCentrifugal / Vacuum DefoamingC Series / ZK Series
Capillary Flow UnderfillLow to Medium ViscosityVacuum DefoamingZK Series / MIX60
Fast-cure UnderfillMedium ViscosityVacuum Mixing & DefoamingMIX60 / MIX80
Mass Packaging DispensingMedium ViscosityVacuum Mixing & DefoamingMIX1000plus

Multi‑Industry Solutions

Covering stirring and debubbling applications of typical materials across six major industries

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BGA Packaging

BGA/CSP Underfill

Mobile Chip.jpg

Mobile Chips

Chip packaging for mobile phones and tablets

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Memory Chips

Underfill for memory devices and modules

Automotive Electronics.jpg

Automotive Electronics

Underfill for automotive modules

Camera Module.jpg

Camera Modules

Filling and reinforcement for image modules

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Underfill Manufacturers

R&D and filling of underfill adhesives

Full-range Equipment Operation Demo Videos

Measured Defoaming‑Process Performance

Measured Processing Results for Six Typical Materials

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Paste Materials

Photoresist Mixing & Defoaming.jpg

Adhesives & Powders

Polymer Materials.jpg

Polymer Materials

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Pharmaceutical Gels

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Silver Paste Materials

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Battery Slurries



Precautions for Use

PrecautionsOperating Instructions
Preheating for Viscosity ReductionHigh-viscosity underfill can be preheated to reduce viscosity before defoaming according to process requirements to improve fluidity.
Slow Pressure ReliefRelease pressure slowly after defoaming to prevent re-foaming which adversely affects dispensing.
Precision Volume ControlVerify sufficient defoaming before dispensing to avoid voids caused by microbubbles.
Timely DispensingComplete dispensing and filling promptly after defoaming to prevent air re-entrapment during standing.

* Internal laboratory test data. Actual results vary depending on adhesive formulation and dispensing process. Contact sales for real customer cases.

Customer Delivery & Application Cases

Rooted in manufacturing frontlines, empowering benchmark production lines and key national research institutions across diverse industries.


真空脱泡搅拌机:彻底解决UV胶固化难题01.jpg

Stirring‑Defoaming Solution for Glue Materials in Consumer‑Electronics Industry


施诺斯真空脱泡搅拌机在胶粘剂中的解决方案.jpg

Vacuum Defoaming Solution for Consumer Electronics Adhesives


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Industrial University Solves Bubble Challenges of Coating‑Film Materials with SIENOX Defoaming Machine

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