Vacuum Defoaming Mixer

TEL:18925129293

Planetary Centrifugal Vacuum Mixer SIE‑MIX5000


Online Message Free Sample Testing Engineer Hotline: 189-2512-9293

Why Must Microbubbles in Materials Be Eliminated?

Residual nano‑microbubbles in materials directly affect product yield and performance stability

Semiconductor Packaging Industry

Micro‑bubbles inside chip‑packaging adhesives create voids in insulating layers, triggering partial breakdown and electric leakage after power‑on. Bubbles degrade thermal conductivity of adhesives, causing excessive temperature rise for chips and shortening component service life. Pits and pinholes appear on packaging surfaces and fail visual inspection.

Nano‑conductive Slurry Industry

Bubbles within silver nanowires and nano‑conductive pastes break conductive paths and cause drastic resistance fluctuation. Bubbles lead to uneven coating thickness, weaken circuit conduction stability and disperse batch‑product parameters, raising testing and screening costs.

Optical Phosphor Industry

Bubbles trapped in phosphor colloids induce light scattering, resulting in uneven brightness and obvious chromatic aberration for lamps and display devices. Bubbles reduce colloid light transmittance, make optical indexes substandard and lower finished‑product yield.

✨ Limitations of conventional defoaming methods**: Ordinary planetary mixing defoamers rely solely on centrifugal force to remove bubbles, delivering limited efficacy on nano-scale microbubbles trapped in high-viscosity materials. Standing defoaming is time-consuming and incomplete. Vacuum mixing defoaming applies a -98kPa negative vacuum pressure during planetary mixing, reducing the pressure difference inside and outside microbubbles to expand and release them, achieving in-depth defoaming results unattainable by conventional mixing methods.

Why Choose MIX5000

Tailored for vacuum defoaming in small‑batch production scenarios

5L Standard Large Capacity

Standard dual‑station design handles 5L materials per cycle with adjustable loading volume. Wide speed range of 0‑1200 rpm adapts to medium‑high viscosity pastes and nano‑powder slurries for continuous processing of medium‑scale production lines.

Centrifugal‑Planetary Synergy

High‑speed revolution generates strong centrifugal force while container rotation creates three‑dimensional shear flow for improved powder dispersion. Fixed / free planetary speed ratios are optional for precision material formulas of varying viscosities.

Precision Optional Modules

Negative pressure, heating‑cooling and MES system are retrofittable. Hundreds of process recipes can be stored. Built‑in inertial stop and multi‑safety locks support standardized production control for precision electronics.

✨ When vacuum defoaming is required with production capacity up to 5000 mL, MIX5000 serves as the small‑batch pilot‑scale option within the planetary vacuum mixer‑defoamer series.

Working Principle

Adopt collaborative process of planetary revolution, container rotation and high‑vacuum sealing

Planetary Revolution: High‑speed revolution of material‑holding turntable generates steady centrifugal force, spreading materials against vessel sidewalls, breaking nano‑powder agglomerates and mitigating solid‑liquid delamination. 

Container Rotation: Material cups rotate synchronously in reverse direction to produce 360° three‑dimensional turbulent flow inside. No mixing impeller contacts materials to lower risk of metallic impurity contamination. 

Synergistic Vacuum Defoaming: Negative pressure is built inside sealed chamber to enlarge pressure difference across materials. Deep‑seated micro‑ and nano‑bubbles rise and separate. Centrifugal force accelerates bubble migration toward material surface. Homogenization mixing and bubble separation are accomplished simultaneously, suitable for high‑precision processing of precision‑electronic materials.

Working Principle of Vacuum Mixer‑Defoamer.jpg


Technical Specifications

Rigorous Equipment Performance Index Data Alignment

ModelSIE‑MIX5000
Mixing Capacity0‑5000 mL (standard vessel) * Customizable
Vessel TypeTubes / Jars / Cups; adapters for syringes and cartridges available
Number of Vessels1 or 2 jars (user‑selectable)
Max Speed0‑1200 RPM (stepless adjustable)
Revolution / Rotation RatioFixed planetary ratio
Vacuum DegreeStandard: ‑98 kPa / Optional: ‑100 kPa
Control SystemTouch screen, stores up to 100 recipe sets
Power Supply220V, 50/60Hz (110V US/JP standard customizable)
Dimensions(W×D×H)1370 × 1130 × 965 mm
Net Weight550kg
Certifications CE, FC, ISO9001, RoHS Compliance


Our Partners

Trusted by leading industrial manufacturing clusters and advanced university laboratories worldwide

Partner Showcase

FAQ - Frequently Asked Questions

Answers to common questions about product performance and everyday process selection

  • 脱泡机的作用是什么?

    脱泡机是一种用于去除液体中的气泡的设备。它的作用在于帮助生产过程中的液体混合、反应、涂布、印刷、灌注等工艺环节,避免气泡的产生和对最终产品的影响。在许多工业和实验室环境中,去除气泡是非常必要的,因为气泡可能会对产品质量产生负面影响,如影响表面张力和稳定性等问题。脱泡机通常采用各种不同的技术,如振动、超声波、离心等,以实现有效的气泡去除。它的应用领域广泛,包括但不限于半导体、太阳能、光学、生物技术、材料科学等。

  • 售后服务怎么样?

    公司拥有专业的售后服务人员,24小时专人服务,一对一提供技术支持,解决您的后顾之忧。

  • 为什么要选择施诺斯?

    选择施诺斯的原因有很多,以下是一些主要的原因:

     1. 专业性:我们的团队由一群专业的人士组成,他们在各自的领域拥有丰富的经验和知识。我们不仅了解行业趋势和最佳实践,而且还能提供切实可行的解决方案。

     2. 服务质量:我们注重客户的需求和满意度,始终致力于提供高质量的服务。我们不仅快速响应客户需求,而且还能根据客户的要求进行定制化服务。 

    3. 可靠性:我们以诚信和专业精神为宗旨,始终遵守承诺和协议。我们的工作方法和交付成果均符合行业标准和最佳实践,使得我们的客户能够信任我们。 

    4. 创新性:我们不断探索新的方法和工具,以提供更好的服务并满足客户的需求。我们鼓励创新和实验,并愿意接受挑战和改变。 

    5. 成本效益:我们提供高性价比的服务,不仅能够帮助客户节省成本,而且还能提高效率和生产力。我们始终以客户的利益为出发点,为客户提供最优的解决方案。

     6. 团队合作:我们相信团队的力量和合作的价值,我们的团队成员之间互相支持、协作和尊重。我们与客户、合作伙伴和其他利益相关者建立紧密的合作关系,以实现共同的目标。 

    以上只是选择我们的部分原因,我们相信还有很多其他的优点和价值可以为客户提供。如果您正在寻找一家专业、可靠、高质量的服务提供商,我们非常期待与您的合作。

  • 搅拌脱泡机的工作原理?

    施诺斯搅拌脱泡机通过公转的离心力进行脱泡,通过公转与自转形成的剪切力进行搅拌,

    再辅助以真空泵抽取气体以达到真空状态,去除纳米级微小气泡。 不接触物料,无二次污染,无二次浪费。


  • 施诺斯能提供工程咨询技术服务吗?

    施诺斯能为广大客户提供全面的工程和现代化的咨询服务。施诺斯近二十年的搅拌经验,可以为你提供高效的咨询服务。

    想要让搅拌机性能更上一层楼,提升系统的整体效能?我们有全面的咨询、工程以及现代化改造服务,为您量身打造解决方案。 在如今竞争激烈的全球化浪潮中,唯有不断创新、持续优化,才能始终跑在对手前面。您的生产工艺和产品日新月异,我们就为您提供最适配的混合技术。不管是新的产品参数,还是既有的工艺条件,我们都能对现有系统和搅拌设备进行全方位的检查与评估,挖掘其中潜藏的流程优化空间和机械性能提升潜力,并且帮您把这些改进切实落地。 要是您的搅拌设备已经跟不上时代步伐,能耗居高不下,或是维护成本让您头疼不已,那就别犹豫,我们的咨询、工程设计和现代化改造服务,就是为您排忧解难的良方。欢迎随时联系我们,携手开启高效生产新征程!

Technical Specification List

Full‑line parameter specifications to assist your accurate process‑model selection:

ModelSIE‑MIX2000SIE‑MIX5000SIE‑MIX15L
Mixing Capacity0‑2000 mL (standard vessel) * Customizable0‑5000 mL (standard vessel) * Customizable0‑15L (standard vessel) * Customizable
Vessel TypeTubes / Jars / Cups; adapters for syringes and cartridges availableTubes / Jars / Cups; adapters for syringes and cartridges availableTubes / Jars / Cups; adapters for syringes and cartridges available
Number of Vessels1 or 2 jars (user‑selectable)1 or 2 jars (user‑selectable)1 or 2 jars (user‑selectable)
Max Speed0‑2000 RPM (stepless adjustable)0‑1200 RPM (stepless adjustable)100‑600 RPM (stepless adjustable)
Revolution / Rotation RatioFreely AdjustableFixed Planetary RatioFixed Planetary Ratio
Vacuum DegreeStandard: ‑98 kPa / Optional: ‑100 kPaStandard: ‑98 kPa / Optional: ‑100 kPaStandard: ‑98 kPa / Optional: ‑100 kPa
Control SystemTouch screen, stores up to 100 recipe setsTouch screen, stores up to 100 recipe setsTouch screen, stores up to 100 recipe sets
Power Supply220V, 50/60Hz (110V US/JP standard customizable)220V, 50/60Hz (110V US/JP standard customizable)220V, 50/60Hz (110V US/JP standard customizable)
Dimensions(W×D×H)1100 × 780 × 880 mm1370 × 1130 × 965 mm1735 × 1560 × 965 mm
Net Weight225kg550kg830 kg
CertificationsCE, FCCE, FCCE, FC

***Above are typical models only. Customized solutions are available per‑customer requirements.


Multi‑Industry Solutions

Provide customized solutions to meet comprehensive demands from cutting‑edge R&D to large‑scale mass production

Thermal‑conductive Silicone Gel.jpg

Semiconductor & Electronics Industry

Chip packaging adhesive, UV underfill, nano‑silver paste, LED phosphor colloid

New‑energy.jpg

New‑energy Manufacturing Industry

Lithium‑battery cathode‑anode slurry, photovoltaic conductive silver‑aluminum paste, thermal‑conductive filling paste

Ink & Coating.jpg

Fine Chemical Industry

High‑viscosity epoxy, silicone, industrial ink, anti‑corrosion adhesive

Semiconductor Packaging.jpg

Optical Display Industry

Optical phosphor, light‑transmissive silicone, optical coating, LCD auxiliary materials

Metal Powder Metallurgy.jpg

Advanced‑material R&D Industry

Nano‑dispersion liquid, ceramic conductive slurry, high‑filler polymer paste

University Research.jpg

Medical & Biological Industry

Medical bonding adhesive, dental resin, sterile pharmaceutical paste, raw materials for biological dressings

Comprehensive Equipment Operation Demo Videos

Gain intuitive, clear, dynamic insight into synchronous defoaming with planetary centrifugal force and high negative pressure.

Measured Defoaming‑Process Performance

Thoroughly eliminate material bubbles, voids and stratification

Resin‑powder Defoaming Comparison 01.jpg

Resin & Powder

Ceramic Slurry Defoaming.jpg

Ceramic Slurry

Biogel Mixing‑Defoaming.jpg

Biological Gel

High‑viscosity Adhesive Before‑after Defoaming 01.jpg

High‑viscosity Adhesive

Lubricant Mixing‑Defoaming 02.jpg

Lubricant

Tricolor Ink Mixing‑Defoaming.jpg

Ink


Measured Data Comparison

Quantifiable Effects Validated by Test Data

Material TypeStatus Before TreatmentAfter MIX5000 Treatment
Semiconductor Packaging AdhesivePlenty of micro‑bubbles trapped inside colloid, voids formed after curing with degraded insulation and thermal conductivitySmooth homogeneous colloid with no visible bubbles, flat cured surface for stable chip insulation protection
Nano‑conductive Silver PasteBubbles block conductive medium, causing uneven coating and large fluctuation of circuit resistancePaste free of obvious micro‑bubbles with continuous flat coating, lowering parameter dispersion of electronic component conduction
Optical Phosphor ColloidBubbles cause light scattering, resulting in uneven brightness and obvious chromatic aberration of finished productsUniform light transmission of colloid with greatly reduced scattering points for better luminous consistency of optical devices

* Internal laboratory test data. Actual improvement varies with material formulas. Contact sales for real‑world customer cases.

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