Vacuum Defoaming Mixer
TEL:18925129293
SIENOX Vacuum Mixing‑Defoamer, SIE‑MIX60
Standard Vacuum Defoaming Module · Planetary Mixing Works With Vacuum Negative Pressure for Deep‑level Removal of Nano‑scale Bubbles
300 mL Laboratory Capacity + Standard Vacuum Function + 3000 RPM Stepless Adjustment
SIENOX SIE‑MIX60 is a 300 mL planetary mixing‑defoamer equipped with standard ‑98 kPa vacuum module, designed for laboratory R&D scenarios requiring vacuum‑assisted defoaming. Integrated with vacuum system based on planetary mixing‑defoaming principle of MIX60, mixing and vacuum defoaming run simultaneously to eliminate nano‑scale micro‑bubbles which centrifugal force alone cannot remove in one single treatment.
✓ CE Certification ✓ FC Certification ✓ ISO9001 Quality System ✓ RoHS Compliance ✓ Customizable Voltage (110V/220V)
Why Must Microbubbles in Materials Be Eliminated?
Residual micro‑bubbles in materials directly affect finished‑product yield and performance
Adhesive R&D & ProductionMicro‑bubbles inside epoxy structural adhesives reduce bonding strength and impair accuracy of mechanical performance test data. Bubbles in sealants cause sealing failure after curing and leakage during pressure resistance tests. In adhesive R&D, test deviations induced by bubbles lead to misjudgment in formula screening and extend R&D cycles. | Precision Electronics AssemblyMicro‑bubbles in chip underfill adhesives form voids after reflow soldering and compromise device reliability. Bubbles in conductive adhesives break conductive paths and cause electronic component failure. Bubbles in dispensing adhesives result in uneven glue volume and degrade assembly precision and product consistency. | Biosensor ManufacturingBubbles in biosensor encapsulation adhesives destabilize sensor signal transmission and cause fluctuating test data. Bubbles in reagent immobilization materials trigger uneven distribution of bio‑active substances and weaken sensor response consistency. Bubbles in microfluidic chip bonding adhesives lead to channel blockage or leakage and reduce detection accuracy. |
✨ Dilemma of conventional methods: Ordinary planetary mixing‑defoamers remove bubbles by centrifugal force yet show limited performance on nano‑scale and deep‑seated bubbles within high‑viscosity materials. Vacuum mixing‑defoaming solution applies ‑98 kPa negative vacuum pressure during planetary mixing, lowering pressure difference inside‑outside bubbles to expand and expel micro‑bubbles and achieve deep defoaming unavailable for standard mixing.
Why Choose SIE‑MIX60?
Three Core Advantages Tailored for Laboratory Vacuum Defoaming R&D Scenarios
In‑Depth Vacuum DefoamingMIX60ZK is equipped with standard ‑98 kPa vacuum system for immediate vacuum defoaming without extra option. On top of removing large bubbles via centrifugal force from planetary mixing, negative vacuum pressure further eliminates nano‑scale micro‑bubbles and deep‑seated bubbles that centrifugal force hardly removes. 3000 rpm high speed works together with vacuum negative pressure; mixing and defoaming proceed simultaneously to realize in‑depth defoaming in one single cycle, ideal for material R&D with strict bubble‑rate requirements. | Precision Small‑batch Sample Processing300 mL capacity fits regular lab R&D consumption, meeting sample preparation needs while avoiding material waste. Dual‑jar design enables simultaneous processing of two samples for comparative experiments and process verification. 100‑recipe storage function saves parameters such as vacuum degree, rotation speed and time with one click. Different vacuum defoaming processes for various materials can be recalled later to guarantee repeatable experimental data. | Reproducible Process ParametersTouch‑screen operation enables precise adjustment of vacuum degree, rotation speed, time and other parameters for consistent processing conditions each run. Optional MES network‑access function automatically uploads processing data to meet R&D traceability requirements. Full‑process from vacuum defoaming parameter setting to processing data recording is traceable and reproducible, suitable for R&D projects requiring strict process management. |
✨ MIX60 integrates three core capabilities of in-depth vacuum defoaming, precision sample processing and reproducible process parameters, serving as an ideal device for vacuum-assisted defoaming in laboratory R&D.
Working Principle
Dual synchronous revolution and rotation power, combined with vacuum negative pressure, achieves in-depth defoaming.
Step 1: Centrifugal Force Generated by Revolution The revolving plate rotates at high speed to generate strong centrifugal force on materials inside the container, driving full‑range material convection for macro‑mixing. Meanwhile, centrifugal force pushes low‑density bubbles toward the rotation axis, enabling large bubbles to gather and escape. Step 2: Shear Force Provided by Rotation The container spins around its own axis to generate directional shear force for breaking agglomerated particles and realizing micro‑dispersion. High speed up to 3000 RPM produces powerful shear force for efficient full‑range mixing; shear force also thins bubble membranes to accelerate bubble rupture. Step 3: Enhanced Defoaming via Vacuum Negative Pressure While revolution and rotation mixing proceeds, the vacuum system reduces chamber pressure to ‑98 kPa. Increased pressure difference inside and outside bubbles under low‑pressure environment makes nano‑scale micro‑bubbles expand, float up and escape faster. Vacuum defoaming compensates for centrifugal force’s limited effect on tiny bubbles, accomplishing full‑range defoaming from large bubbles down to nano‑sized ones. Revolution, rotation and vacuum work synchronously. Materials complete the whole process of "Mixing → Dispersion → In‑depth Defoaming" inside sealed containers. 3000 RPM high speed paired with ‑98 kPa vacuum balances mixing efficiency and defoaming depth. | ![]() |
Quick Overview of Technical Specifications
Complete Technical Specifications Overview, Customizable on Demand
| Model | SIE‑MIX60 |
| Mixing Capacity | 0‑300 mL (standard container) * Larger volume customizable |
| Container Type | Test tube / Jar / Cup; adapters for syringe & cartridge available |
| Container Quantity | 1 or 2 jars (user‑selectable) |
| Max Speed | 0‑3000 RPM (stepless adjustable) |
| Revolution / Rotation Ratio | Fixed planetary ratio |
| Vacuum Degree | Standard: –98 kPa / Optional: –100 kPa |
| Control System | Touch screen, stores up to 100 recipe sets |
| Power Supply | 220V, 50/60Hz (110V US/JP standard customizable) |
| Dimension(W×D×H) | 510 × 430 × 500 mm |
| Net Weight | Approx. 95 kg |
| Certifications | CE, FC, ISO9001, RoHS Compliance |
Our Partners
Trusted by leading industrial manufacturing clusters and advanced university laboratories worldwide
FAQ - Frequently Asked Questions
Answers to common questions about product performance and everyday process selection
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脱泡机的作用是什么?
脱泡机是一种用于去除液体中的气泡的设备。它的作用在于帮助生产过程中的液体混合、反应、涂布、印刷、灌注等工艺环节,避免气泡的产生和对最终产品的影响。在许多工业和实验室环境中,去除气泡是非常必要的,因为气泡可能会对产品质量产生负面影响,如影响表面张力和稳定性等问题。脱泡机通常采用各种不同的技术,如振动、超声波、离心等,以实现有效的气泡去除。它的应用领域广泛,包括但不限于半导体、太阳能、光学、生物技术、材料科学等。
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售后服务怎么样?
公司拥有专业的售后服务人员,24小时专人服务,一对一提供技术支持,解决您的后顾之忧。
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为什么要选择施诺斯?
选择施诺斯的原因有很多,以下是一些主要的原因:
1. 专业性:我们的团队由一群专业的人士组成,他们在各自的领域拥有丰富的经验和知识。我们不仅了解行业趋势和最佳实践,而且还能提供切实可行的解决方案。
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4. 创新性:我们不断探索新的方法和工具,以提供更好的服务并满足客户的需求。我们鼓励创新和实验,并愿意接受挑战和改变。
5. 成本效益:我们提供高性价比的服务,不仅能够帮助客户节省成本,而且还能提高效率和生产力。我们始终以客户的利益为出发点,为客户提供最优的解决方案。
6. 团队合作:我们相信团队的力量和合作的价值,我们的团队成员之间互相支持、协作和尊重。我们与客户、合作伙伴和其他利益相关者建立紧密的合作关系,以实现共同的目标。
以上只是选择我们的部分原因,我们相信还有很多其他的优点和价值可以为客户提供。如果您正在寻找一家专业、可靠、高质量的服务提供商,我们非常期待与您的合作。
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搅拌脱泡机的工作原理?
施诺斯搅拌脱泡机通过公转的离心力进行脱泡,通过公转与自转形成的剪切力进行搅拌,
再辅助以真空泵抽取气体以达到真空状态,去除纳米级微小气泡。 不接触物料,无二次污染,无二次浪费。
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施诺斯能提供工程咨询技术服务吗?
施诺斯能为广大客户提供全面的工程和现代化的咨询服务。施诺斯近二十年的搅拌经验,可以为你提供高效的咨询服务。
想要让搅拌机性能更上一层楼,提升系统的整体效能?我们有全面的咨询、工程以及现代化改造服务,为您量身打造解决方案。 在如今竞争激烈的全球化浪潮中,唯有不断创新、持续优化,才能始终跑在对手前面。您的生产工艺和产品日新月异,我们就为您提供最适配的混合技术。不管是新的产品参数,还是既有的工艺条件,我们都能对现有系统和搅拌设备进行全方位的检查与评估,挖掘其中潜藏的流程优化空间和机械性能提升潜力,并且帮您把这些改进切实落地。 要是您的搅拌设备已经跟不上时代步伐,能耗居高不下,或是维护成本让您头疼不已,那就别犹豫,我们的咨询、工程设计和现代化改造服务,就是为您排忧解难的良方。欢迎随时联系我们,携手开启高效生产新征程!
Technical Specification List
Full‑line standardized specifications for accurate process evaluation and equipment selection
| Model | SIE‑MIX60 | SIE‑MIXF301 | SIE‑MIX90 |
| Mixing Capacity | 0‑300 mL (standard container) * Customizable | 0‑300 mL (standard container) * Customizable | 0‑1000 mL (standard container) * Customizable |
| Container Type | Test tube / Jar / Cup; adapters for syringe & cartridge available | Test tube / Jar / Cup; adapters for syringe & cartridge available | Test tube / Jar / Cup; adapters for syringe & cartridge available |
| Container Quantity | 1 or 2 jars (user‑selectable) | 1 or 2 jars (user‑selectable) | 1 or 2 jars (user‑selectable) |
| Max Speed | 0‑3000 RPM (stepless adjustable) | 0‑2000 RPM (stepless adjustable) | 0‑2000 RPM (stepless adjustable) |
| Revolution / Rotation Ratio | Fixed planetary ratio | Freely adjustable | Fixed planetary ratio |
| Vacuum Degree | Standard: –98 kPa / Optional: –100 kPa | Standard: –98 kPa / Optional: –100 kPa | Standard: –98 kPa / Optional: –100 kPa |
| Control System | Touch screen, stores up to 100 recipe sets | Touch screen, stores up to 100 recipe sets | Touch screen, stores up to 100 recipe sets |
| Power Supply | 220V, 50/60Hz (110V US/JP standard customizable) | 220V, 50/60Hz (110V US/JP standard customizable) | 220V, 50/60Hz (110V US/JP standard customizable) |
| Dimension(W×D×H) | 510 × 430 × 500 mm | 510 × 430 × 500 mm | 610 × 560 × 780 mm |
| Net Weight | 95 kg | 115 kg | 153 kg |
| Certifications | CE, FC | CE, FC | CE, FC |
*** Above are typical models only. SIENOX provides customized solutions upon customer requirements. Contact sales for model selection: 189‑2512‑9293
Multi‑Industry Solutions
Covering stirring and debubbling applications of typical materials across six major industries
Adhesive R&DEpoxy structural adhesive, sealant, hot‑melt adhesive, pressure‑sensitive adhesive, modified adhesive |
Precision Electronics AssemblyUnderfill adhesive, conductive adhesive, die attach adhesive, dispensing adhesive, chip bonding adhesive |
BiosensorEncapsulation adhesive, reagent immobilization material, microfluidic bonding adhesive, biocompatible adhesive, sensor sealant |
Micro‑electronic PackagingPackaging epoxy adhesive, molding compound, lead bonding adhesive, substrate bonding adhesive, passivation layer material |
Functional CoatingHydrophobic coating, conductive coating, insulating coating, anti‑corrosion coating, wear‑resistant coating |
Electronic PasteSilver paste, copper paste, carbon paste, resistance paste, dielectric paste |
Comprehensive Equipment Operation Demo Videos
Gain intuitive, clear, dynamic insight into synchronous defoaming with planetary centrifugal force and high negative pressure.
Measured Defoaming‑Process Performance
Measured Processing Results for Six Typical Materials
Paste‑like Materials |
Glue With Powder Fillers |
Polymer Materials |
Pharmaceutical Gels |
Silver Paste Materials |
Battery Slurries |
Measured Data Comparison
Comparison of Defoaming Effects for Three Representative Materials
Material Type | Status Before Treatment | Status After MIX60 Treatment |
Silver Paste | Visible bubbles cover paste surface, uneven silver powder distribution with obvious agglomeration and sedimentation | Smooth and dense paste surface, silver powder uniformly dispersed without agglomeration, good fluidity and stable conductivity |
Battery Cathode Slurry | Massive internal bubbles, poor fluidity, streaks and pinholes appear during coating | Uniform and smooth slurry without residual bubbles, flat coating surface with consistent layer thickness |
Epoxy Adhesive (AB Glue) | Dense micro‑bubbles inside mixed adhesive, milky turbid appearance, uneven surface after curing | Transparent and clear adhesive without visible bubbles, smooth surface after curing, dense cross‑section free of voids |
* Internal lab test data, actual improvement varies with material formula. Contact sales for real customer cases.












