Products

SIENOX unsaturated polyester defoaming solution targets trapped air in filled resin systems such as FRP, cast crafts and artificial stone during batching and curing. It adopts vacuum mixing and defoaming after powder pre-mixing to eliminate bubbles generated in the blending of resin and fillers, producing products with dense surfaces and reduced pinholes and interlayer voids.

SIENOX phenolic resin defoaming solution targets "powder + resin" systems such as bakelite powder, phenolic molding compounds, grinding wheel/brake pad binders and refractory castables. It enables synchronous mixing and degassing under negative pressure to achieve homogeneous mixtures and dense green bodies, reducing pores, porosity and mechanical defects after sintering or curing.

SIENOX structural adhesive defoaming solution addresses air entrapment and void formation in adhesive layers after mixing structural adhesives such as acrylic and modified epoxy. It performs mixing and defoaming synchronously under vacuum to produce dense and uniform adhesive layers with stable and reliable bonding strength.

Why Anaerobic Adhesive Defoaming Machine Is Needed

SIENOX OCA optically clear adhesive defoaming solution targets bubbles and white spots generated after full lamination of optically clear adhesives. It performs defoaming in a clean vacuum environment to achieve void-free lamination, clear light transmission and reduce rework costs

SIENOX conductive adhesive defoaming solution addresses the problem of air entrapment and agglomeration of silver/nickel-silver fillers in conductive epoxy and conductive bonding adhesives. It realizes mixing, defoaming and dispersion at the same time under vacuum, creating dense adhesive layers with continuous conductivity and stable low contact resistance.