Products

SIENOX underfill defoaming solution addresses air entrapment when CSP/BGA underfill adhesive flows to fill beneath chips. Vacuum defoaming enables complete void-free filling, relieves thermal stress and protects solder joints.

SIENOX OCA optically clear adhesive defoaming solution targets bubbles and white spots generated after full lamination of optically clear adhesives. It performs defoaming in a clean vacuum environment to achieve void-free lamination, clear light transmission and reduce rework costs

SIENOX conductive adhesive defoaming solution addresses the problem of air entrapment and agglomeration of silver/nickel-silver fillers in conductive epoxy and conductive bonding adhesives. It realizes mixing, defoaming and dispersion at the same time under vacuum, creating dense adhesive layers with continuous conductivity and stable low contact resistance.

SIENOX silicone sealant defoaming solution addresses air entrapment and void defects during filling and dispensing of one-component glass glue and silicone sealants. After vacuum defoaming, the sealant beads are full and continuous with reliable weather-resistant sealing performance.

For R&D lamination trials, fast pressure, 3 modes & clean small samples.

High-capacity 4×1000mL jar, dry/wet ultra-fine milling for pilot batches.