Temperature-Controlled Degasser
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Temperature‑controlled Vacuum Mixer‑Defoamer SIE‑MIX5000WK
5L Large‑capacity Temperature‑controlled Mass‑production Platform · Nano‑level Deep Vacuum‑temperature‑controlled Defoaming
5000mL Large‑capacity Dual Cups + Ambient‑range Heating/Cooling Temperature Control + ‑98kPa Deep Vacuum Defoaming
SIENOX SIE‑MIX5000WK is a temperature‑controlled vacuum mixer‑defoamer engineered for large‑batch production of temperature‑sensitive materials. Dual 5000 mL cups meet continuous inline processing demands. Dual‑mode temperature control precisely regulates material temperature. ‑98kPa vacuum defoaming works with dual‑power planetary mixing to finish mixing and defoaming in one single cycle.
✓ CE Certification ✓ FC Certification ✓ ISO9001 Quality System ✓ RoHS Compliance ✓ Customizable Voltage (110V/220V)
Why Must Microbubbles in Materials Be Eliminated?
Micro/nano residual bubbles in materials directly affect product yield and performance stability.
New Energy IndustryBubbles in lithium‑battery slurries impair coating uniformity and degrade consistency of battery capacity and cycle life. Bubbles in PV EVA films trigger lamination defects and delamination risks. Heat generated during new‑energy slurry mixing alters rheological properties. Temperature‑controlled defoaming stabilizes temperature window to guarantee coating quality. | Semiconductor IndustryBubbles in semiconductor encapsulants create internal voids and poor heat dissipation. Bubbles inside conductive silver adhesives cause circuit open‑points and resistance fluctuation. Semiconductor materials are temperature‑sensitive; excessive heat changes curing behavior. Temperature‑controlled defoaming balances defoaming efficiency and material safety. | Adhesive IndustryBubbles in structural adhesives lead to unstable bonding strength and discontinuous load‑bearing surfaces. Bubbles in sealants result in sealing leakage. Most adhesives cure via exothermic reactions; temperature rise accelerates curing and aggravates bubble formation. Temperature‑controlled mixing‑defoaming removes bubbles while maintaining proper temperature. |
✨ Traditional defoaming bottlenecks: Manual mixing causes uneven blending and air entrapment, while conventional equipment delivers limited centrifugal force and fails to eliminate microbubbles. Without precise temperature control, ordinary devices easily trigger thermal degradation of temperature-sensitive materials via simple heating. This integrated solution adopts centrifugal mixing, negative vacuum pressure and accurate temperature control to complete mixing, temperature regulation and defoaming in one step.
Why Choose MIX5000
Three Core Features Cover Full‑process Demands of Temperature‑controlled Vacuum Defoaming
5L Large‑capacity Temp‑controlled Production PlatformEquipped with dual 5000 mL cups, 0‑1200 rpm wide‑range speed adjustment covers low‑to‑high viscosity materials. 100‑recipe storage supports multi‑product switching. 550 kg rigid frame with 304‑stainless‑steel enclosure ensures stable long‑time temperature‑controlled operation. | Nano‑level Deep Vacuum‑temperature‑controlled DefoamingStandard‑98 kPa vacuum system. Centrifugal force removes large bubbles while vacuum eliminates nano‑microbubbles. Vacuum works synchronously with temperature control: heating reduces viscosity for faster bubble release; vacuum compensates low‑temperature defoaming efficiency loss for consistent results. | Precise Temperature Control Across Multiple Speed RangesSelectable fixed/adjustable planetary speed ratio. Fixed ratio guarantees production consistency; adjustable mode fits R‑D trials. Dual‑mode heating‑cooling reduces viscosity by heating and suppresses thermal degradation by cooling. One unit handles both heated mixing and low‑temperature defoaming processes. |
✨ MIX5000WK suits large‑capacity temperature‑controlled production and vacuum defoaming for temp‑sensitive materials including new energy, semiconductors, adhesives and advanced materials.
Working Principle
Adopts coordinated process of planetary revolution, container rotation, sealed vacuum defoaming and temperature control to realize one‑step mixing, temperature regulation and defoaming.
Planetary Revolution Centrifugal force generated by main‑plate revolution spreads materials toward vessel wall, breaks powder agglomerates and mitigates stratification. The temperature‑control system runs simultaneously to keep materials within target temperature range. Vessel Rotation Reverse vessel rotation creates 360° fluid turbulence for full‑range homogeneous mixing. No impeller contact avoids material contamination. Optional fixed/adjustable revolution‑rotation ratio adapts to various‑viscosity materials. Sealed Vacuum Defoaming Sealed chamber pulls negative pressure to ‑98 kPa. Pressure difference expands micro‑/nano‑bubbles for floating‑out removal. Mixing and defoaming are accomplished within one single process segment. Precise Temperature Control for Material Status Temperature control runs through the whole mixing‑defoaming cycle: heating reduces viscosity for better fluidity and faster bubble release; cooling suppresses thermal degradation and manages exothermic reactions. Temperature regulation works inline without separate thermal‑control steps. Coordinated planetary revolution, vessel rotation, sealed vacuum defoaming and dual‑mode temperature control complete the full workflow: mixing → dispersion → vacuum defoaming → thermal regulation in one step. |  |
Technical Specifications
Complete Technical Specifications Overview, Customizable on Demand
| Model | SIE‑MIX5000WK |
| Mixing Capacity | 0–5000 mL (standard vessel) * Customizable |
| Vessel Type | Tubes / Jars / Cups; adapters for syringes & cartridges available |
| Vessel Quantity | 1 or 2 jars (optional) |
| Max Speed | 0‑1200 RPM (stepless adjustable) |
| Temperature Mode | Cooling / Heating |
| Vacuum Level | Standard:‑98 kPa / Optional:‑100 kPa |
| Control System | Touch screen, stores 100 recipe sets |
| Power Supply | 220V, 50/60Hz (110V US/JP standard customizable) |
| Dimension(W×D×H) | 1370 × 1130 × 965 mm |
| Net Weight | 550 kg |
| Certifications | CE, FC, ISO9001, RoHS Compliance |
Our Partners
Trusted by leading industrial manufacturing clusters and advanced university laboratories worldwide
FAQ - Frequently Asked Questions
Answers to common questions about product performance and everyday process selection
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脱泡机的作用是什么？
脱泡机是一种用于去除液体中的气泡的设备。它的作用在于帮助生产过程中的液体混合、反应、涂布、印刷、灌注等工艺环节，避免气泡的产生和对最终产品的影响。在许多工业和实验室环境中，去除气泡是非常必要的，因为气泡可能会对产品质量产生负面影响，如影响表面张力和稳定性等问题。脱泡机通常采用各种不同的技术，如振动、超声波、离心等，以实现有效的气泡去除。它的应用领域广泛，包括但不限于半导体、太阳能、光学、生物技术、材料科学等。
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售后服务怎么样？
公司拥有专业的售后服务人员，24小时专人服务，一对一提供技术支持，解决您的后顾之忧。
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为什么要选择施诺斯？
选择施诺斯的原因有很多，以下是一些主要的原因：
1. 专业性：我们的团队由一群专业的人士组成，他们在各自的领域拥有丰富的经验和知识。我们不仅了解行业趋势和最佳实践，而且还能提供切实可行的解决方案。
2. 服务质量：我们注重客户的需求和满意度，始终致力于提供高质量的服务。我们不仅快速响应客户需求，而且还能根据客户的要求进行定制化服务。
3. 可靠性：我们以诚信和专业精神为宗旨，始终遵守承诺和协议。我们的工作方法和交付成果均符合行业标准和最佳实践，使得我们的客户能够信任我们。
4. 创新性：我们不断探索新的方法和工具，以提供更好的服务并满足客户的需求。我们鼓励创新和实验，并愿意接受挑战和改变。
5. 成本效益：我们提供高性价比的服务，不仅能够帮助客户节省成本，而且还能提高效率和生产力。我们始终以客户的利益为出发点，为客户提供最优的解决方案。
6. 团队合作：我们相信团队的力量和合作的价值，我们的团队成员之间互相支持、协作和尊重。我们与客户、合作伙伴和其他利益相关者建立紧密的合作关系，以实现共同的目标。
以上只是选择我们的部分原因，我们相信还有很多其他的优点和价值可以为客户提供。如果您正在寻找一家专业、可靠、高质量的服务提供商，我们非常期待与您的合作。
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搅拌脱泡机的工作原理？
施诺斯搅拌脱泡机通过公转的离心力进行脱泡，通过公转与自转形成的剪切力进行搅拌，
再辅助以真空泵抽取气体以达到真空状态，去除纳米级微小气泡。 不接触物料，无二次污染，无二次浪费。
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施诺斯能提供工程咨询技术服务吗？
施诺斯能为广大客户提供全面的工程和现代化的咨询服务。施诺斯近二十年的搅拌经验，可以为你提供高效的咨询服务。
想要让搅拌机性能更上一层楼，提升系统的整体效能？我们有全面的咨询、工程以及现代化改造服务，为您量身打造解决方案。 在如今竞争激烈的全球化浪潮中，唯有不断创新、持续优化，才能始终跑在对手前面。您的生产工艺和产品日新月异，我们就为您提供最适配的混合技术。不管是新的产品参数，还是既有的工艺条件，我们都能对现有系统和搅拌设备进行全方位的检查与评估，挖掘其中潜藏的流程优化空间和机械性能提升潜力，并且帮您把这些改进切实落地。 要是您的搅拌设备已经跟不上时代步伐，能耗居高不下，或是维护成本让您头疼不已，那就别犹豫，我们的咨询、工程设计和现代化改造服务，就是为您排忧解难的良方。欢迎随时联系我们，携手开启高效生产新征程！
Technical Specification List
Full‑line standardized specifications for accurate process evaluation and equipment selection
| Model | SIE‑MIX2000WK | SIE‑MIX5000WK | SIE‑MIX15LWK |
| Mixing Capacity | 0‑2000 mL (standard vessel) * Customizable | 0‑5000 mL (standard vessel) * Customizable | 0‑15L (standard vessel) * Customizable |
| Vessel Type | Tubes / Jars / Cups; adapters for syringes & cartridges available | Tubes / Jars / Cups; adapters for syringes & cartridges available | Tubes / Jars / Cups; adapters for syringes & cartridges available |
| Vessel Quantity | 1 or 2 jars (optional) | 1 or 2 jars (optional) | 1 or 2 jars (optional) |
| Max Speed | 0‑2000 RPM (stepless adjustable) | 0‑1200 RPM (stepless adjustable) | 100‑600 RPM (stepless adjustable) |
| Temperature Mode | Cooling / Heating | Cooling / Heating | Cooling / Heating |
| Vacuum Level | Standard:‑98 kPa / Optional:‑100 kPa | Standard:‑98 kPa / Optional:‑100 kPa | Standard:‑98 kPa / Optional:‑100 kPa |
| Control System | Touch screen, stores 100 recipe sets | Touch screen, stores 100 recipe sets | Touch screen, stores 100 recipe sets |
| Power Supply | 220V, 50/60Hz (110V US/JP standard customizable) | 220V, 50/60Hz (110V US/JP standard customizable) | 220V, 50/60Hz (110V US/JP standard customizable) |
| Dimension(W×D×H) | 1100 × 780 × 880 mm | 1370 ×1130 × 965 mm | 1735 × 1560 × 965 mm |
| Net Weight | 225 kg | 550 kg | 830 kg |
| Certifications | CE, FC | CE, FC | CE, FC |
***Above are typical models, customized solutions available upon customer requirements.
Multi‑Industry Solutions
Provide customized solutions to meet comprehensive demands from cutting‑edge R&D to large‑scale mass production
Lithium‑battery IndustryLithium‑battery cathode slurry, anode slurry, electrolyte, diaphragm coating liquid, conductive slurry |
PV & Energy Storage IndustryPV EVA film, energy‑storage electrode slurry, fuel‑cell catalyst‑layer slurry, proton‑exchange‑membrane slurry |
Encapsulation Material IndustrySemiconductor encapsulant, LED phosphor powder, insulating black glue, molding compound, underfill adhesive |
Conductive Material IndustryConductive silver adhesive, conductive silver paste, gold paste, electronic solder paste, conductive ceramic slurry |
Adhesive IndustryStructural adhesive, epoxy sealant, silicone sealant, hot‑melt adhesive, polyurethane adhesive |
Advanced‑material IndustryResin intermediate, catalyst slurry, functional coating liquid, ceramic slurry, nano‑composite material |
Comprehensive Equipment Operation Demo Videos
Gain intuitive, clear, dynamic insight into synchronous defoaming with planetary centrifugal force and high negative pressure.
Measured Defoaming‑Process Performance
Thoroughly eliminate material bubbles, voids and stratification
High‑viscosity Resin |
Optoelectronic Epoxy Resin |
Biogel |
High‑viscosity Adhesive |
Silver Paste |
Structural Adhesive |
Measured Data Comparison
Quantifiable Effects Validated by Test Data
| Material Type | Pre‑treatment Status | After MIX5000WK Treatment |
| Lithium‑battery Cathode Slurry | Heavy internal bubbles, ~6% coating pinhole rate, large thickness deviation | Bubbles removed, low pinhole rate, uniform coating thickness |
| Semiconductor Encapsulant | Dense internal bubbles, ~5% encapsulation void rate, unstable heat dissipation | Bubbles removed, low void rate, stable heat dissipation |
| Epoxy Structural Adhesive | Dense internal bubbles, ±25% bonding‑strength deviation, voids on load‑bearing surface | Bubbles removed, ±5% bonding‑strength deviation, continuous load‑bearing surface |
* Internal lab test data. Actual improvement varies with material formulation. Contact sales for real‑world customer cases.
