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Pressure Defoaming Machine SIE-RX4-600
Fast Pressure Rise in Small Chamber · Three Modes for Flexible R&D Sample Switching
φ400 Small Chamber 5-Minute Fast Pressure Rise + Three Pressure & Heating Modes Flexible Switching + Precision Filter Prevents Sample Secondary Contamination
Schnos SIE-RX4-600 Pressure Defoaming Machine, φ400×600mm cylindrical chamber with approximately 75L capacity, pressure rises to 0.6MPa in 5 minutes. Three working modes available, SMC digital pressure gauge accuracy ±0.01MPa, Omron PID temperature control accuracy ±1.0°C. Utilizes pressure and temperature to remove bubbles generated during the lamination process and enhance adhesion between materials.
✓ CE Certified ✓ FC Certified ✓ ISO9001 Quality System ✓ RoHS Compliant ✓ Custom Voltage Supported (110V/220V)
Why Must Microbubbles in Materials Be Eliminated?
Residual micro‑bubbles degrade end‑product quality directly
LCD Polarizer Lamination IndustryDuring the lamination of LCD polarizers with glass substrates, residual bubbles in OCA optical adhesive cause uneven light transmission and display haze, affecting screen display quality. Pressure defoaming compresses and dissolves bubbles through pressure, while temperature reduces OCA adhesive viscosity to assist bubble expulsion. The φ400 small chamber is suitable for sample lamination defoaming of small-size polarizers during the R&D stage, enabling rapid verification of process parameters. | Electronic Component Packaging IndustryBubbles in electronic component packaging adhesive cause voids in the packaging layer, and moisture intrusion leads to device failure, requiring repeated process parameter adjustment during the R&D stage. The three working modes of pressure defoaming allow selection of pressurize-first-then-heat or simultaneous heating and pressurization based on packaging adhesive characteristics. The small chamber's rapid pressure rise shortens the prototyping cycle, helping R&D teams quickly determine the packaging defoaming process solution. | Medical Device IndustryBubbles in medical device bonding and lamination affect biocompatibility and structural strength, requiring small-batch verification of defoaming effectiveness during the prototyping stage. The pressure defoaming precision filter prevents secondary contamination of products, the φ400 chamber is suitable for sample lamination defoaming of small-size medical devices, and the audible-visual-light alarm ensures safe and controllable prototyping processes. |
✨ The dilemma of traditional defoaming: during the R&D prototyping stage, there is a lack of professional pressure defoaming equipment. Relying on standing still to wait for bubbles to escape naturally takes a long time and has low efficiency; ordinary ovens only heat without pressurizing, making it difficult to expel bubbles from the lamination surface; inaccurate temperature control causes large variations in OCA adhesive fluidity, making process parameters difficult to reproduce stably.
Why Choose SIE-RX4-600
Address the pain points of efficiency and quality in the R&D trial‑production phase from three dimensions: rapid pressure rise, flexible modes, and clean trial‑production.
Small‑chamber Rapid Pressure RiseThe φ400×600 mm cylindrical chamber has a volume of approximately 75 L. It reaches 0.6 MPa within 5 minutes, completes pressure relief in 2‑3 minutes, and enables fast cycle turnover of 35‑40 minutes per cycle. Thanks to fast pressure rise and drop in the small chamber, process parameters can be iterated rapidly during R&D trial‑production. Multiple sets of conditional tests can be finished within one day to shorten the R&D cycle. | Flexible Switching Among Three ModesThree working modes are available: A. Pressurize first, then heat up; B. Heat up and pressurize simultaneously; C. Heat up first, then pressurize. Different materials respond differently to pressure and temperature. The three modes can be flexibly selected according to material properties. Parameters controlled by the microcomputer can be stored and reproduced to assist R&D teams in identifying feasible process solutions. | Anti‑pollution by Precision FilterInlet air passes through a precision filter before entering the chamber, preventing dust and impurities in the air from contaminating trial‑production samples. Samples in R&D trial‑production are high‑value and low‑volume; a single contamination incident may waste the entire batch. Precision filtration ensures a clean trial‑production environment and improves trial‑production success rates. |
✨ If your scenarios include R&D trial‑production, small‑sample lamination verification and process‑parameter debugging, the rapid pressure rise of the RX4‑600 small chamber and flexible switching among three modes enable you to achieve rapid iteration.
Working Principle
Remove bubbles generated during lamination by pressure and temperature to enhance bonding strength between different materials.
Step 1: Pressurization and Heating (Three‑mode Optional) Step 2: Pressure‑holding Defoaming Step 3: Pressure Relief and Stabilization Three simple steps: Pressurization & Heating → Pressure‑holding Defoaming → Pressure Relief & Stabilization, to eliminate bonding bubbles and strengthen adhesive force. | ![]() |
Technical Specifications
Complete Technical Specifications Overview, Customizable on Demand
| Equipment Model | SIE‑RX4‑600 |
| Working Chamber Size | φ400×600mm (Cylindrical) |
| Effective Volume | Approx. 75L |
| Working Pressure | 0~0.8MPa (Standard), 0~2.5MPa (Optional) |
| Working Temperature | Ambient ~80℃ (Standard), Ambient ~180℃ (Optional) |
| Heating Method | Resistive Heating |
| Working Modes | A. Pressurize first then heat up B. Simultaneous heating and pressurization C. Heat up first then pressurize |
| Control Mode | Microcomputer Control |
| Vessel Material | S30408 Stainless Steel or Carbon Steel |
| Overall Dimension(W×D×H) | Approx. 700×900×1300mm (Subject to actual product) |
| Net Weight | 200 kg |
| Certifications | CE, FC, ISO9001, RoHS Compliance |
Our Partners
Trusted by leading industrial manufacturing clusters and advanced university laboratories worldwide
FAQ - Frequently Asked Questions
Answers to common questions about product performance and everyday process selection
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脱泡机的作用是什么?
脱泡机是一种用于去除液体中的气泡的设备。它的作用在于帮助生产过程中的液体混合、反应、涂布、印刷、灌注等工艺环节,避免气泡的产生和对最终产品的影响。在许多工业和实验室环境中,去除气泡是非常必要的,因为气泡可能会对产品质量产生负面影响,如影响表面张力和稳定性等问题。脱泡机通常采用各种不同的技术,如振动、超声波、离心等,以实现有效的气泡去除。它的应用领域广泛,包括但不限于半导体、太阳能、光学、生物技术、材料科学等。
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售后服务怎么样?
公司拥有专业的售后服务人员,24小时专人服务,一对一提供技术支持,解决您的后顾之忧。
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为什么要选择施诺斯?
选择施诺斯的原因有很多,以下是一些主要的原因:
1. 专业性:我们的团队由一群专业的人士组成,他们在各自的领域拥有丰富的经验和知识。我们不仅了解行业趋势和最佳实践,而且还能提供切实可行的解决方案。
2. 服务质量:我们注重客户的需求和满意度,始终致力于提供高质量的服务。我们不仅快速响应客户需求,而且还能根据客户的要求进行定制化服务。
3. 可靠性:我们以诚信和专业精神为宗旨,始终遵守承诺和协议。我们的工作方法和交付成果均符合行业标准和最佳实践,使得我们的客户能够信任我们。
4. 创新性:我们不断探索新的方法和工具,以提供更好的服务并满足客户的需求。我们鼓励创新和实验,并愿意接受挑战和改变。
5. 成本效益:我们提供高性价比的服务,不仅能够帮助客户节省成本,而且还能提高效率和生产力。我们始终以客户的利益为出发点,为客户提供最优的解决方案。
6. 团队合作:我们相信团队的力量和合作的价值,我们的团队成员之间互相支持、协作和尊重。我们与客户、合作伙伴和其他利益相关者建立紧密的合作关系,以实现共同的目标。
以上只是选择我们的部分原因,我们相信还有很多其他的优点和价值可以为客户提供。如果您正在寻找一家专业、可靠、高质量的服务提供商,我们非常期待与您的合作。
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搅拌脱泡机的工作原理?
施诺斯搅拌脱泡机通过公转的离心力进行脱泡,通过公转与自转形成的剪切力进行搅拌,
再辅助以真空泵抽取气体以达到真空状态,去除纳米级微小气泡。 不接触物料,无二次污染,无二次浪费。
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施诺斯能提供工程咨询技术服务吗?
施诺斯能为广大客户提供全面的工程和现代化的咨询服务。施诺斯近二十年的搅拌经验,可以为你提供高效的咨询服务。
想要让搅拌机性能更上一层楼,提升系统的整体效能?我们有全面的咨询、工程以及现代化改造服务,为您量身打造解决方案。 在如今竞争激烈的全球化浪潮中,唯有不断创新、持续优化,才能始终跑在对手前面。您的生产工艺和产品日新月异,我们就为您提供最适配的混合技术。不管是新的产品参数,还是既有的工艺条件,我们都能对现有系统和搅拌设备进行全方位的检查与评估,挖掘其中潜藏的流程优化空间和机械性能提升潜力,并且帮您把这些改进切实落地。 要是您的搅拌设备已经跟不上时代步伐,能耗居高不下,或是维护成本让您头疼不已,那就别犹豫,我们的咨询、工程设计和现代化改造服务,就是为您排忧解难的良方。欢迎随时联系我们,携手开启高效生产新征程!
Multi‑Model Specification Comparison Table
Compare Models in the Same Series for Accurate Selection
| Equipment Model | SIE‑RX4‑600 | SIE‑RX6‑900 | SIE‑RX8‑1200 |
| Working Chamber Size | φ400×600mm | φ600×900mm | φ800×1200mm |
| Effective Volume | 75L | 255L | 600L |
| Pressure Range | 0~2.5MPa(Optional) | 0~2.5MPa(Optional) | 0~2.5MPa(Optional) |
| Temperature Range | Ambient ~180℃(Optional) | Ambient ~180℃(Optional) | Ambient ~180℃(Optional) |
| Pressure Accuracy | ±0.01MPa | ±0.01MPa | ±0.01MPa |
| Temperature Control Accuracy | ±1.0℃ | ±1.0℃ | ±1.0℃ |
| Power Supply | 220V, 50/60Hz (110V US‑JP standard customizable) | 220V, 50/60Hz (110V US‑JP standard customizable) | 220V, 50/60Hz (110V US‑JP standard customizable) |
| Overall Dimension(W×D×H) | 510 × 430 × 500 mm | 610 × 560 × 780 mm | 610 × 560 × 780 mm |
| Net Weight | 95 kg | 153 kg | 163 kg |
| Certifications | CE, FC | CE, FC | CE, FC |
***The above are typical models only. Customized solutions are available according to customer requirements.
Multi‑Industry Solutions
Covering stirring and debubbling applications of typical materials across six major industries
LCD Polarizer LaminationSmall‑size polarizer OCA optical adhesive, lamination adhesive for LCD glass substrate |
Electronic Component EncapsulationComponent encapsulant, chip potting adhesive |
Medical DevicesMedical bonding adhesive, medical device lamination adhesive |
LED EncapsulationLED encapsulant, phosphor paste |
Fine ChemicalsFine chemical materials, nano‑powders |
New Energy MaterialsR&D samples of new energy materials, small‑lot battery slurry |
Comprehensive Equipment Operation Demo Videos
Gain intuitive, clear, dynamic insight into synchronous defoaming with planetary centrifugal force and high negative pressure.
Actual‑test Performance Demonstration
Measured Processing Results for Six Typical Materials
Slurry + Powder |
Adhesive |
Hydrogen‑energy Materials |
Adhesive |
Substrate + Filler |
Adhesive + Ceramic Powder |
Actual‑test Effect Comparison
Comparison of Material Status Before and After Pressurized Debubbling
| Material Type | Pre‑treatment Status | After RX4‑600 Treatment |
| Polarizer OCA Optical Adhesive | Numerous bubbles inside adhesive, uneven light transmission and mottling after lamination | Transparent bubble‑free adhesive with uniform light transmission after lamination |
| Component Encapsulant | Dense bubbles inside adhesive, voids formed in encapsulation layer after curing | Dense void‑free adhesive for complete and reliable encapsulation layer |
| Medical Bonding Adhesive | Internal bubbles, bonding‑surface defects impairing biocompatibility | Dense adhesive with intact bonding surface and qualified biocompatibility |
* Internal laboratory test data. Actual improvement varies with material formulation. Contact sales for real‑world customer cases.












