Pressure Degassing Autoclave
TEL:18925129293
Pressurized Debubbling Machine SIE‑RX13‑1500
Large‑diameter Chamber for Large‑size Panels · Uniform Pressure for Consistent Full‑surface Quality
Flat loading of large‑size panels into large‑diameter chamber + SMC precise pressure control for uniform full‑surface force + Double protection with complete pressure‑vessel safety certificates
SINOS SIE‑RX13‑1500 Pressurized Debubbling Machine features a φ1300×1500 mm large‑diameter cylindrical chamber with approx. 1990L volume. Large‑size panel products can be flat‑loaded as whole units. SMC digital pressure gauge delivers ±0.01 MPa accuracy, and Omron PID temperature control reaches ±1.0 ℃. Three operation modes are available. Complete pressure‑vessel safety certificates are provided. It removes bubbles generated during lamination by pressure and temperature to improve bonding strength between materials.
✓ CE Certification ✓ FC Certification ✓ ISO9001 Quality System ✓ RoHS Compliance ✓ Custom‑voltage support (110V/220V)
Why Must Microbubbles in Materials Be Eliminated?
Residual micro‑bubbles degrade end‑product quality directly
Large‑panel LCD Lamination IndustryDuring lamination of large‑panel LCD glass substrates and polarizers, large‑area OCA optical adhesive generates numerous bubbles, resulting in massive display defects, light leakage and chromatic aberration after lamination, bringing huge loss from whole‑panel scrapping. The φ1300 large‑diameter chamber of pressurized debubbling machine allows whole large‑panel LCD to be flat‑loaded. SMC precise pressure control ensures uniform force over large lamination area for thorough bubble removal, ideal for large‑panel LCD lamination and debubbling production. | Automotive Touch Screen IndustryAutomotive touch screens feature large sizes and special curvatures. Bubbles generated in lamination may cause touch failure and endanger driving safety, hence stringent quality requirements. The φ1300 large‑diameter chamber accommodates large‑size automotive touch screens. Three operation modes are selectable for OCA adhesive and lamination processes. Uniform pressure within large chamber delivers consistent full‑surface debubbling for automotive touch‑screen large‑panel lamination. | Printed Electronic Materials IndustryFor printed electronic materials such as conductive inks and printed circuits, bubbles formed after printing on large‑area substrates trigger circuit open‑circuits and uneven resistance. Stable debubbling is required for mass production. The 1990L large chamber of pressurized debubbling machine processes bulk printed electronic materials in one batch. Omron PID temperature control improves ink fluidity for easy bubble discharge, while precision filter avoids secondary material contamination, suitable for mass debubbling of printed electronic materials. |
✨ Dilemmas of conventional debubbling: Large‑panel products exceed chamber size of standard equipment, requiring split‑piece processing with extra procedures; uneven pressure distribution in large‑chamber devices causes inconsistent debubbling across panels; large‑volume pressure vessels lack safety certificates and alarm systems, posing safety risks for high‑value large‑panel products.
Why Choose SIE‑RX13‑1500
Solve size, quality and safety pain‑points in large‑panel product lamination
Large Diameter Adapted for Large PanelsAdopting a large-diameter cylindrical chamber, it allows large-sized products such as large-panel LCDs and automotive touch screens to be flat-loaded as a whole without splitting processing, avoiding secondary bubbles. The 1500mm chamber length balances loading depth and floor space, and the 1990L volume enables batch processing of multiple large panels or massive materials at one time, fully meeting the production capacity requirements of large-panel production lines. | Uniform Pressure for Consistent Chamber-wide PerformanceEquipped with SMC digital pressure gauge with an accuracy of ±0.01MPa, the large-diameter chamber paired with precise pressure control ensures uniform force on all positions of large panels. Uniform stress is the core of consistent quality for large-area lamination. The φ1300 large-diameter chamber features even internal pressure distribution, delivering consistent full-surface debubbling effects and eliminating debubbling differences between the center and edges of large panels. | Complete Certification for Pressure Vessel SafetyThe large-capacity pressure vessel is equipped with a full set of safety certificates, and the S30408 stainless steel tank features excellent pressure resistance and corrosion resistance. The acousto-optic alarm system triggers synchronous alerts for abnormalities with alarm details displayed via microcomputer. Given the high value of large-panel products where equipment faults may cause batch scrapping, the dual protection of official safety certifications and intelligent alarm system ensures safe and stable large-panel production. |
✨ If you need to process large‑panel products and require full‑surface debubbling consistency & safe production, RX13‑1500’s large‑diameter chamber and uniform pressure can meet your large‑panel requirements
Working Principle
Remove bubbles generated during lamination by pressure and temperature to enhance bonding strength between different materials.
Step 1: Pressurization & Temperature Rise (Three Modes Optional) Step 2: Pressure‑holding Debubbling Step 3: Pressure Relief & Stabilization Three simple steps: Pressurization & Temperature Rise → Pressure‑holding Debubbling → Pressure Relief & Stabilization, eliminate lamination bubbles and improve bonding strength. |  |
Technical Specifications
Complete Technical Specifications Overview, Customizable on Demand
| Model | SIE-RX13-1500 |
| Chamber Size | φ1300×1500mm (Cylindrical) |
| Effective Volume | Approx. 1990L |
| Working Pressure | 0~0.8MPa (Standard), 0~2.5MPa (Optional) |
| Working Temperature | Ambient ~80℃ (Standard), Ambient ~180℃ (Optional) |
| Heating Method | Resistive Heating |
| Operation Modes | A. Pressurize First Then Heat B. Simultaneous Heating & Pressurization C. Heat First Then Pressurize |
| Control Mode | Microcomputer Control |
| Vessel Material | S30408 Stainless Steel or Carbon Steel |
| Overall Dimension(W×D×H) | Approx. 1600×1800×2300mm (Subject to actual product) |
| Net Weight | 3000 kg |
| Certifications | CE, FC, ISO9001, RoHS Compliance |
Our Partners
Trusted by leading industrial manufacturing clusters and advanced university laboratories worldwide
FAQ - Frequently Asked Questions
Answers to common questions about product performance and everyday process selection
-
脱泡机的作用是什么？
脱泡机是一种用于去除液体中的气泡的设备。它的作用在于帮助生产过程中的液体混合、反应、涂布、印刷、灌注等工艺环节，避免气泡的产生和对最终产品的影响。在许多工业和实验室环境中，去除气泡是非常必要的，因为气泡可能会对产品质量产生负面影响，如影响表面张力和稳定性等问题。脱泡机通常采用各种不同的技术，如振动、超声波、离心等，以实现有效的气泡去除。它的应用领域广泛，包括但不限于半导体、太阳能、光学、生物技术、材料科学等。
-
售后服务怎么样？
公司拥有专业的售后服务人员，24小时专人服务，一对一提供技术支持，解决您的后顾之忧。
-
为什么要选择施诺斯？
选择施诺斯的原因有很多，以下是一些主要的原因：
1. 专业性：我们的团队由一群专业的人士组成，他们在各自的领域拥有丰富的经验和知识。我们不仅了解行业趋势和最佳实践，而且还能提供切实可行的解决方案。
2. 服务质量：我们注重客户的需求和满意度，始终致力于提供高质量的服务。我们不仅快速响应客户需求，而且还能根据客户的要求进行定制化服务。
3. 可靠性：我们以诚信和专业精神为宗旨，始终遵守承诺和协议。我们的工作方法和交付成果均符合行业标准和最佳实践，使得我们的客户能够信任我们。
4. 创新性：我们不断探索新的方法和工具，以提供更好的服务并满足客户的需求。我们鼓励创新和实验，并愿意接受挑战和改变。
5. 成本效益：我们提供高性价比的服务，不仅能够帮助客户节省成本，而且还能提高效率和生产力。我们始终以客户的利益为出发点，为客户提供最优的解决方案。
6. 团队合作：我们相信团队的力量和合作的价值，我们的团队成员之间互相支持、协作和尊重。我们与客户、合作伙伴和其他利益相关者建立紧密的合作关系，以实现共同的目标。
以上只是选择我们的部分原因，我们相信还有很多其他的优点和价值可以为客户提供。如果您正在寻找一家专业、可靠、高质量的服务提供商，我们非常期待与您的合作。
-
搅拌脱泡机的工作原理？
施诺斯搅拌脱泡机通过公转的离心力进行脱泡，通过公转与自转形成的剪切力进行搅拌，
再辅助以真空泵抽取气体以达到真空状态，去除纳米级微小气泡。 不接触物料，无二次污染，无二次浪费。
-
施诺斯能提供工程咨询技术服务吗？
施诺斯能为广大客户提供全面的工程和现代化的咨询服务。施诺斯近二十年的搅拌经验，可以为你提供高效的咨询服务。
想要让搅拌机性能更上一层楼，提升系统的整体效能？我们有全面的咨询、工程以及现代化改造服务，为您量身打造解决方案。 在如今竞争激烈的全球化浪潮中，唯有不断创新、持续优化，才能始终跑在对手前面。您的生产工艺和产品日新月异，我们就为您提供最适配的混合技术。不管是新的产品参数，还是既有的工艺条件，我们都能对现有系统和搅拌设备进行全方位的检查与评估，挖掘其中潜藏的流程优化空间和机械性能提升潜力，并且帮您把这些改进切实落地。 要是您的搅拌设备已经跟不上时代步伐，能耗居高不下，或是维护成本让您头疼不已，那就别犹豫，我们的咨询、工程设计和现代化改造服务，就是为您排忧解难的良方。欢迎随时联系我们，携手开启高效生产新征程！
Multi‑Model Specification Comparison Table
Compare Models in the Same Series for Accurate Selection
| Model | SIE-RX8-1200 | SIE-RX10-1800 | SIE-RX13-1500 |
| Chamber Size | φ800×1200mm | φ1000×1800mm | φ1300×1500mm |
| Effective Volume | 600L | 1410L | 1990L |
| Pressure Range | 0~2.5MPa(Optional) | 0~2.5MPa(Optional) | 0~2.5MPa(Optional) |
| Temperature Range | Ambient ~180℃(Optional) | Ambient ~180℃(Optional) | Ambient ~180℃(Optional) |
| Pressure Accuracy | ±0.01MPa | ±0.01MPa | ±0.01MPa |
| Temperature Control Accuracy | ±1.0℃ | ±1.0℃ | ±1.0℃ |
| Power Supply | 380V, 50/60Hz (Customizable for 110V US/JP standard) | 380V, 50/60Hz (Customizable for 110V US/JP standard) | 380V, 50/60Hz (Customizable for 110V US/JP standard) |
| Overall Dimension(W×D×H) | 610 × 560 × 780 mm | 1300×2100×2000mm | 1600×1800×2300mm |
| Net Weight | 163 kg | 2000 kg | 3000 kg |
| Certifications | CE, FC | CE, FC | CE, FC |
***The above are typical models only. Customized solutions are available upon customer requirements.
Multi‑Industry Solutions
Covering stirring and debubbling applications of typical materials across six major industries
LCD Polarizer LaminationSmall‑size polarizer OCA optical adhesive, lamination adhesive for LCD glass substrate |
Electronic Component EncapsulationComponent encapsulant, chip potting adhesive |
Medical DevicesMedical bonding adhesive, medical device lamination adhesive |
LED EncapsulationLED encapsulant, phosphor paste |
Fine ChemicalsFine chemical materials, nano‑powders |
New Energy MaterialsR&D samples of new energy materials, battery slurry samples |
Comprehensive Equipment Operation Demo Videos
Gain intuitive, clear, dynamic insight into synchronous defoaming with planetary centrifugal force and high negative pressure.
Actual‑test Performance Demonstration
Measured Processing Results for Six Typical Materials
Slurry + Powder |
Adhesive |
Hydrogen Energy Materials |
Adhesive |
Substrate + Filler |
Adhesive + Ceramic Powder |
Actual‑test Effect Comparison
Comparison of Material Status Before and After Pressurized Debubbling
| Material Type | Pre‑treatment Status | After SIE‑RX13‑1500 Treatment |
| Polarizer OCA Optical Adhesive | Numerous bubbles inside adhesive, uneven light transmission and mottling after lamination | Bubble‑free transparent adhesive with uniform light transmission after lamination |
| Component Encapsulant | Dense internal bubbles, voids formed in encapsulation layer after curing | Dense void‑free adhesive for complete and reliable encapsulation layer |
| Medical Bonding Adhesive | Internal bubbles cause bonding‑surface defects and impair biocompatibility | Dense adhesive with intact bonding surface and qualified biocompatibility |
* Internal lab test data. Actual improvement varies with material formulation. Contact sales for real‑world customer cases.
