Resin Degasser
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Epoxy Resin Defoaming Machine
Eliminate Bubbles in Epoxy AB Adhesive After Mixing and Curing · Dense Potting Layer Without Voids, No Breakdown Under High Voltage
Simultaneous Defoaming with Vacuum & Mixing · Full Coverage from Milliliter-scale Samples to Mass Potting · Non-contact Mixing Without Altering Epoxy Ratio or Curing Performance
SIENOX epoxy resin defoaming solution covers three technical routes: centrifugal defoaming, vacuum defoaming, and vacuum mixing & defoaming. Targeting bubbles entrapped during mixing, potting and pouring of two-component epoxy AB adhesives, it delivers full-stage solutions from laboratory formula verification to mass potting, ensuring dense, uniform and reliable insulation for every batch of epoxy potting parts.
✓ CE Certification ✓ ISO9001 Quality System ✓ RoHS Compliance ✓ Custom Voltage Available (110V/220V)
Why an Epoxy Resin Defoaming Machine Is Required
Bubbles entrapped after epoxy mixing are a critical threat to potting reliability.
Electronic & Electrical Potting IndustryPower modules, transformers, current transformers, sensors and other components are commonly potted and cast with epoxy resin. Air bubbles form voids within the epoxy potting layer, resulting in uneven insulation thickness. Bubble zones are prone to breakdown and heat generation under high voltage, which directly renders the devices scrapped. | LED & Optoelectronic Packaging IndustryLED strips, modules, driving power supplies and phosphor adhesives are mostly encapsulated with transparent or light-colored epoxy. Bubbles are highly visible inside transparent adhesive layers, directly ruining appearance and light uniformity. More importantly, poor heat dissipation at bubble sites drastically shortens LED chip service life. Properly defoamed epoxy layers are clear, uniform and thermally reliable. | Automotive Electronics IndustryVehicle ECUs, wiring harness connectors, sensors and other parts adopt epoxy potting. Under vibration, thermal cycling and humid-heat conditions, cracks and liquid ingress tend to occur at bubble locations. Automotive-grade products impose strict requirements on epoxy potting density. Vacuum mixing defoamers match production line tact time to ensure consistent potting quality across batches. |
✨ Traditional Dilemma: Manual stirring inevitably entraps air; vacuum chambers cannot fully remove bubbles from medium and high-viscosity epoxy. Even after successful defoaming, new bubbles are introduced again during pouring and transfer. What you need is not more expensive adhesive, but a vacuum mixing & defoaming solution that accomplishes mixing and bubble removal simultaneously.
Why Choose SIENOX Epoxy Defoaming Solution
SIENOX MIX series serves as the ideal defoaming equipment for epoxy potting from R&D to mass production.
Simultaneous Mixing and DefoamingThe biggest pain point in epoxy resin batching is air entrapment during stirring. SIENOX MIX series vacuum mixing defoamers blend epoxy resin and curing agent under vacuum. Bubbles generated by stirring are extracted at the same time. Mixing and defoaming are completed in one single process. There is no need to stir first, transfer materials and then perform defoaming. It improves efficiency and prevents new bubbles brought in during secondary transfer. | Full-stage CoverageC series centrifugal defoamers (0–12 mL) are used for laboratory small sample validation, achieving efficient defoaming even for epoxy samples of only a few milliliters. ZK vacuum defoamers (50–500 mL) are adopted for pilot scale-up. MIX series vacuum mixing defoamers (50 mL–20 L) are available for mass production. Process parameters can be scaled smoothly from formula development to mass potting. | For Thin to Paste-like AdhesivesSIENOX equipment series covers the full viscosity range, from low-viscosity free-flowing epoxy (suitable for centrifugal defoaming) to medium & high-viscosity thermal conductive epoxy potting compound (paste type requiring vacuum mixing & defoaming). Different defoaming methods are matched for different viscosities to guarantee thorough bubble removal. |
✨ The MIX60 integrates three core capabilities: deep vacuum defoaming, precision small sample processing, and reproducible process parameters. It is an ideal device for laboratory R&D requiring vacuum-assisted defoaming.
Equipment Supporting Description
SIENOX A/B adhesive defoaming solution can be combined with other equipment to form a complete potting process chain.
Equipment Supporting Process Chain Integrated Mixing & Defoaming: MIX Series mixes A/B adhesives and defoams synchronously under vacuum. Temperature-controlled Defoaming: Heat high-viscosity epoxy to reduce viscosity (40–60℃) before defoaming for higher efficiency. Defoaming & Potting Linkage: Cast directly after defoaming to minimize air entrapment during transfer. Pressurized Fine Defoaming: For components with high reliability requirements, transfer to RX for secondary pressurized fine defoaming after primary defoaming. | ![]() |
Specifications & Parameters
Selection Guide
| Epoxy Resin Type | Typical Viscosity | Recommended Defoaming Method | Recommended Equipment |
| Low-viscosity Epoxy Potting Compound | 500-3000cP | Centrifugal Defoaming / Vacuum Defoaming | C Series / ZK Series |
| Medium-viscosity Epoxy Potting Compound | 3000-15000cP | Vacuum Defoaming / Vacuum Mixing & Defoaming | ZK Series / MIX Series |
| High-viscosity Thermal Conductive Epoxy | 15000-80000cP | Vacuum Mixing & Defoaming | MIX Series |
| Paste-like Thermal Conductive Epoxy | >80000cP | Vacuum Mixing & Defoaming + Pressurized Defoaming | MIX Series / RX Series |
| Transparent Epoxy Potting Compound | 800-5000cP | Vacuum Defoaming / Vacuum Mixing & Defoaming | ZK Series / MIX Series |
| High-temperature Resistant Epoxy | Medium-High Viscosity | Vacuum Mixing & Defoaming | MIX Series |
Our Partners
Trusted by leading industrial manufacturing clusters and advanced university laboratories worldwide
FAQ - Frequently Asked Questions
Answers to common questions about product performance and everyday process selection
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What is the working principle of a centrifugal defoaming machine?
Principle of centrifugal defoaming machine: The bubbles are released by the downward principle of gravity.
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How is the after-sales service?
The company has professional after-sales service personnel, 24-hour dedicated service, and one-on-one technical support to solve your worries.
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Why choose SIENOX?
There are many reasons for choosing SIENOX, and the following are some of the main reasons:
1. Professionalism: Our team consists of a group of professional individuals with rich experience and knowledge in their respective fields. We not only understand industry trends and best practices, but also provide practical and feasible solutions.
2. Service quality: We focus on customer needs and satisfaction, and are always committed to providing high-quality services. We not only respond quickly to customer needs, but also provide customized services according to their requirements.
3. Reliability: We adhere to the principles of integrity and professionalism, always adhering to commitments and agreements. Our work methods and deliverables comply with industry standards and best practices, enabling our clients to trust us.
4. Innovation: We continuously explore new methods and tools to provide better services and meet customer needs. We encourage innovation and experimentation, and are willing to accept challenges and change.
5. Cost effectiveness: We provide cost-effective services that not only help customers save costs, but also improve efficiency and productivity. We always prioritize the interests of our customers and provide them with the best solutions.
6. Teamwork: We believe in the power and value of teamwork, and our team members support, collaborate, and respect each other. We establish close cooperative relationships with customers, partners, and other stakeholders to achieve common goals.
The above are just some of the reasons for choosing us. We believe there are many other advantages and values that can be provided to customers. If you are looking for a professional, reliable, and high-quality service provider, we look forward to working with you.
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How does the stirring and defoaming machine work?
The SIENOX stirring and defoaming machine performs defoaming through centrifugal force at revolution and stirring through shear force formed by revolution and rotation,
Assisted by a vacuum pump to extract gas and achieve a vacuum state, removing nanoscale tiny bubbles. No contact with materials, no secondary pollution, and no secondary waste.
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What is the function of a defoaming machine?
A defoaming machine is a device used to remove bubbles from liquids. Its function is to assist in the liquid mixing, reaction, coating, printing, infusion and other process steps in the production process, avoiding the generation of bubbles and their impact on the final product. In many industrial and laboratory environments, removing bubbles is essential as they may have a negative impact on product quality, such as affecting surface tension and stability. Defoaming machines typically use various techniques such as vibration, ultrasound, centrifugation, etc. to achieve effective bubble removal. It has a wide range of applications, including but not limited to semiconductors, solar energy, optics, biotechnology, materials science, etc.
Technical Specification List
Full‑line standardized specifications for accurate process evaluation and equipment selection
| Epoxy Resin Type | Typical Viscosity | Recommended Defoaming Method | Recommended Equipment |
| Low-viscosity Epoxy Potting Compound | 500-3000cP | Centrifugal Defoaming / Vacuum Defoaming | C Series / ZK Series |
| Medium-viscosity Epoxy Potting Compound | 3000-15000cP | Vacuum Defoaming / Vacuum Mixing & Defoaming | ZK Series / MIX Series |
| High-viscosity Thermal Conductive Epoxy | 15000-80000cP | Vacuum Mixing & Defoaming | MIX Series |
| Paste-like Thermal Conductive Epoxy | >80000cP | Vacuum Mixing & Defoaming + Pressurized Defoaming | MIX Series / RX Series |
| Transparent Epoxy Potting Compound | 800-5000cP | Vacuum Defoaming / Vacuum Mixing & Defoaming | ZK Series / MIX Series |
| High-temperature Resistant Epoxy | Medium-High Viscosity | Vacuum Mixing & Defoaming | MIX Series |
Multi‑Industry Solutions
Covering stirring and debubbling applications of typical materials across six major industries
Electronic PottingEpoxy Potting & Casting for Power Modules, Transformers, Current Transformers, Sensors |
LED & Optoelectronic PackagingEncapsulation for LED Strips, Modules, Driver Power Supplies, Phosphor Epoxy |
Automotive ElectronicsEpoxy Potting for Vehicle ECUs, Wiring Harness Connectors, On-board Sensors |
Thermal Conductive PottingThermal Conductive Epoxy Compounds for Power Devices, New Energy Power Supplies, Inverters |
Epoxy Casting & CompositesInsulating Cast Parts, Carbon Fiber Composites, Sports Equipment, Artwork Casting |
Structural Bonding & Anti-corrosionEpoxy Structural Adhesives, Anti-corrosion Linings, Floor & Insulating Coatings |
Comprehensive Equipment Operation Demo Videos
Gain intuitive, clear, dynamic insight into synchronous defoaming with planetary centrifugal force and high negative pressure.
Measured Defoaming‑Process Performance
Measured Processing Results for Six Typical Materials
Paste Materials |
Adhesive & Powder Mixtures |
Polymer Materials |
Pharmaceutical Gels |
Silver Paste Materials |
Battery Slurries |
Precautions for Use
| Precautions | Operating Instructions |
| Weighing & Proportioning | Accurately weigh epoxy resin and curing agent according to the specified ratio before mixing and defoaming. Incorrect ratio will affect curing performance. |
| Stirring Speed | Control stirring speed during vacuum mixing & defoaming. Excessively fast speed may generate new vortex bubbles. |
| Time Control | Complete defoaming and potting within the pot life after epoxy mixing. The material will thicken and cure once the time limit is exceeded. |
| Vacuum Defoaming | Release pressure slowly before opening the lid after vacuum defoaming to prevent epoxy expansion and bubbling caused by rapid pressure reduction. |
| Temperature Control | High-viscosity epoxy can be heated moderately to 40–60℃ to reduce viscosity before defoaming for higher efficiency. |
* Internal laboratory test data. Actual results vary with material formulation and process. Contact sales for real customer cases.
Customer Delivery & Application Cases
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