Slurry Degasser

SIENOX conductive silver paste defoaming solution tackles air entrapment and agglomeration for high-solid silver paste loaded with silver powder. Synchronous stirring, defoaming and dispersion under vacuum delivers dense printed circuits with consistent sheet resistance, lowering open circuits, pinholes and scrap rates.

SIENOX conductive carbon paste defoaming solution solves the problem of agglomeration and air entrapment for carbon paste filled with graphite and carbon black. Synchronous stirring, defoaming and dispersion under vacuum achieves uniform thickness of printed carbon films and consistent resistance, and minimizes pinholes and resistance drift.

SIENOX thermally conductive slurry defoaming solution tackles air entrapment and agglomeration for thermal grease, thermal gel and thermal interface materials filled with high-thermal-conductivity fillers including aluminum oxide and boron nitride. Synchronous stirring, defoaming and dispersion under vacuum delivers dense thermal conductive layers with reduced thermal resistance.

SIENOX lithium battery slurry defoaming solution targets air entrapment generated while stirring cathode and anode slurries with active materials, conductive agents and binders. Vacuum defoaming cuts coating pinholes and dark stains, and improves electrode density and cell consistency.

SIENOX solder paste defoaming solution tackles air entrapment generated during SMT solder paste stirring, printing slumping, solder splashing and solder bead defects. Vacuum defoaming ensures stable solder paste printing and plump solder joints while lowering the occurrence of solder beads and cold solder joints.

SIENOX ceramic slurry defoaming solution is designed for high-solid and high-viscosity slurries such as alumina, zirconia and MLCC ceramic dielectrics. It realizes stirring, defoaming and dispersion simultaneously under vacuum to obtain dense green bodies and cut down pinholes and cracking after sintering.