Products

SIENOX phenolic resin defoaming solution is suitable for powder-resin systems such as bakelite powder, phenolic molding compounds, grinding wheel and brake pad binders, and refractory castables. Mixing and degassing are carried out at the same time under negative pressure to obtain homogeneous mixtures and dense green bodies, lowering pores, porosity and mechanical defects after curing or sintering.

SIENOX phenolic resin defoaming solution is applied to powder-resin systems including bakelite powder, phenolic molding compounds, grinding wheel and brake pad binders, refractory castables. Mixing and degassing are carried out simultaneously under negative pressure to realize uniform mixing and dense green bodies, and cut down pores, porosity and mechanical defects after sintering or curing.

SIENOX flexographic ink defoaming solution addresses the tendency of water-based flexographic ink with surfactants to generate foam. It adopts physical vacuum defoaming without adding defoamers to avoid impairing ink film adhesion and printability, ensuring uniform ink transfer on anilox rollers and distinct halftone dots.

SIENOX screen printing ink defoaming solution is designed for screen printing ink featuring high viscosity and rich pigment fillers, and air entrapment from scraping and stirring. It stirs and defoams under vacuum while breaking filler agglomerates, delivering uniform thick ink films and smooth mesh passing, and reducing screen clogging, pinholes and local ink shortage.

SIENOX UV ink defoaming solution solves the problem that bubbles turn into pinholes before curing for high-gloss and high-transparency UV ink. It adopts vacuum low-shear defoaming with low heat generation to avoid premature curing, creating glossy and defect-free UV ink films, which is suitable for high-quality printing such as cigarette package and label varnishing.

SIENOX conductive ink defoaming solution solves the issues of air entrapment and particle agglomeration during stirring of conductive ink with conductive particles. It realizes stirring, defoaming and dispersion simultaneously under vacuum, producing dense and uniform conductive circuits with stable printing performance, and reducing broken lines, pinholes and sheet resistance fluctuation.