Solutions

SIENOX brings 20‑year expertise in semiconductor packaging adhesive mixing‑defoaming.
Our vacuum defoaming solutions remove nano‑scale micro‑bubbles for uniform die attach, molding compound, underfill and dam‑fill materials.
Boost chip packaging reliability and yield; free sample testing & trial‑test services offered.

SIENOX has 20‑year expertise in defoaming for high‑viscosity gels, providing centrifugal defoaming solutions for gel materials including 90,000‑cps high‑viscosity gels, sealants, silicone gels and polyurethane gels.

LED raw materials are mainly applied in lighting, electronics, automotive, home appliance, advertising, interior decoration, smart grid and other industries.

SIENOX planetary mixing‑defoaming machine applies non‑contact planetary mixing and nanoscale vacuum deaeration for zero‑contamination, consistent processing of EMC, DAF and photoresist to realize semiconductor micron‑level defect control.

SIENOX has 20‑year expertise in mixing and deaeration for ink materials, delivering vacuum mixing‑deaeration solutions for UV ink, water‑based ink, solvent‑based ink, offset ink, flexographic ink, gravure ink and screen‑printing ink.

Planetary mixing and defoaming technology pushes the quality limits of BOX single‑component epoxy adhesive. SIENOX equipment features nationally certified hardware and supports connection to an intelligent formula management platform. It enables seamless parameter migration from R&D to mass production, helping enterprises build core technical advantages in the high‑end electronic adhesive industry.