Dispensing Machine

TEL:18925129293

SIENOX Automatic Dispenser SIE‑301


Four‑axis Linked Multi‑dimensional Dispensing for Precision Dispensing of Small Electronic Parts

Precision Dispensing for Small Parts + ±0.02mm Accuracy + Cost‑effective Entry‑level Model

SIENOX SIE‑301 automatic dispenser adopts four‑axis linkage for precise glue control. Working travel: 400×400×100mm, repeat accuracy ±0.02mm, max load 10kg. It supports programming via teach pendant and CAD import, compatible with UV glue, red glue, solder paste and other fluids for precision dispensing of small electronic components.

✓ ISO9001 Quality System ✓ RoHS Compliance ✓ Customizable Voltage (110V/220V)

Online Message Free Sample Testing Engineer Hotline: 189-2512-9293

Why is precision dispensing required

Manual dispensing relies on operator experience, resulting in unstable glue volume, common issues such as glue accumulation, missing dispensing and stringing, and low yield consistency.

Higher Precision Requirements for Electronic Manufacturing

Processes such as PCB dispensing, component fixing and SMT patch glue repair require dispensing accuracy up to millimeter or even micron level. Manual dispensing cannot guarantee consistent glue volume, which may cause glue overflow contaminating pads or insufficient glue resulting in poor bonding. SIE‑301 delivers repeat accuracy of ±0.02mm to ensure consistent dispensing position and glue volume. Compatible with electronic‑grade materials including UV glue, red glue and solder paste, it improves yield of PCB dispensing.

Miniaturization Challenges for Semiconductor Packaging

Semiconductor processes such as chip underfill, lead packaging and conductive connection impose strict requirements on dispensing accuracy and glue volume control. Small‑sized chips and limited dispensing space may cause packaging defects with slight deviations. SIE‑301 with 400×400mm working travel fits chip‑scale packaging. ±0.02mm repeat accuracy ensures precise micron‑level dispensing position, compatible with packaging materials like epoxy adhesive, silver adhesive and conductive adhesive.

Precision Bonding Demands for Medical Devices

Medical devices feature compact size and high‑precision requirements, such as micro‑component bonding, needle dispensing and catheter coating. UV glue and medical‑grade adhesives shall be applied accurately at target positions. Excessive glue impairs product functions while insufficient glue reduces bonding strength. The single‑head precise positioning mode of SIE‑301 suits micro‑component dispensing. ±0.02mm accuracy guarantees consistent dispensing quality for medical devices.

✨ Dilemmas of traditional dispensing: Manual dispensing features low efficiency, poor consistency and unstable yield; semi‑automatic dispensers only support planar dispensing and cannot handle 3D curved surfaces; ordinary dispensers require complicated programming and long change‑over time, not suitable for multi‑variety small‑batch production.

Why Choose SIE‑301

Solve Pain Points of Model Selection for Precision Dispensing of Small‑sized Products

400×400mm Precision Working Travel

Working travel designed for small‑sized products, 400×400×100mm covers typical small‑size products such as PCB boards, chip packages and micro‑components. Well‑matched travel delivers higher positioning accuracy without sacrificing dispensing precision for small parts due to excessive working range. Max load 10kg, compatible with most small‑size workpieces and fixtures. Timing‑belt plus linear‑guide drive, moving speed 0.1‑500mm/s, balancing efficiency and stability.

Stable Quality with Single‑head Precise Glue Control

Single‑head dispensing mode focuses on high precision. Equipped with glue delay and advance glue‑off functions to precisely control glue output timing and volume for fluids of different viscosities. Uniform dispensed surface effectively avoids glue accumulation and dead glue. Precise positioning and accurate glue control prevent stringing, glue leakage and dripping. ±0.02mm repeat positioning accuracy ensures consistent dispensing quality for every small‑size product.

Cost‑effective Entry‑level with Fast ROI

SIE‑301 is positioned as entry‑level precision model. It lowers investment threshold with economical price while maintaining ±0.02mm accuracy and four‑axis linkage capability. Suitable for start‑ups, laboratory R&D and small‑batch production lines. Compact footprint, installable on desktop or workbench without extra workshop space. Fast return on investment, ideal starter equipment for automated dispensing.

✨ If you mainly dispense for small‑size products (PCB boards, chips, micro‑components) and pursue precise quality with cost‑effective entry‑level performance, SIE‑301 is your ideal choice.

Product Features

Based on planetary motion principle

Four‑axis Linked Multi‑dimensional Motion

Four‑axis linkage design supports front‑back, left‑right movement as well as dispensing on 3D inclined and curved surfaces. It can perform rapid dot dispensing, line drawing, circle drawing and dispensing / coating / spraying of various irregular patterns on product surfaces, outer walls, vertical planes and gaps. 

Precise Glue Control System 

Equipped with glue delay and advance glue‑off functions to precisely control glue output timing and volume. Uniform dispensing surface effectively avoids glue accumulation, dead glue, stringing, leakage and dripping. Repeat positioning accuracy: ±0.02mm. 

Dual‑mode Programming 

Supports on‑site programming via teach pendant and PC‑based programming with CAD / CORELDRAW. Programs can be saved and recalled for quick product changeover, suitable for multi‑variety small‑batch production. 

Timing‑belt & Linear‑guide Transmission 

Adopts timing‑belt plus linear‑guide transmission. Travel speed adjustable from 0.1 to 500mm/s, balancing high‑speed efficiency and motion stability. 

Three Working Modes 

Three working modes: dot dispensing, spray dispensing and coating to meet diverse process requirements. Controlled via hand‑held controller or PC for flexible operation. 

Wide Compatibility for Liquids 

Compatible with various solvents, adhesives, paints and chemical materials, including dozens of industrial fluids such as UV glue, red glue, solder paste, silver glue, epoxy glue, instant glue and sealant.

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Quick View of Technical Specifications

Complete Technical Specifications Overview, Customizable on Demand

Equipment ModelSIE‑301
Working Travel400×400×100
Control ModeHand Controller / PC
Nozzle ConfigurationSingle‑head
Working ModesDot Dispensing / Spray Dispensing / Coating
Glue Delay FunctionYes
Advance Glue‑off FunctionYes
Max Load (kg)10
Moving Speed (mm/s)0.1~500
Repeat Accuracy (mm)±0.02
Overall Dimension(W×D×H)500×600×500mm

Our Partners

Trusted by leading industrial manufacturing clusters and advanced university laboratories worldwide

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FAQ - Frequently Asked Questions

Answers to common questions about product performance and everyday process selection

  • What is the working principle of a centrifugal defoaming machine?

    Principle of centrifugal defoaming machine: The bubbles are released by the downward principle of gravity.

  • How is the after-sales service?

    The company has professional after-sales service personnel, 24-hour dedicated service, and one-on-one technical support to solve your worries.

  • Why choose SIENOX?

    There are many reasons for choosing SIENOX, and the following are some of the main reasons:

    1. Professionalism: Our team consists of a group of professional individuals with rich experience and knowledge in their respective fields. We not only understand industry trends and best practices, but also provide practical and feasible solutions.

    2. Service quality: We focus on customer needs and satisfaction, and are always committed to providing high-quality services. We not only respond quickly to customer needs, but also provide customized services according to their requirements.

    3. Reliability: We adhere to the principles of integrity and professionalism, always adhering to commitments and agreements. Our work methods and deliverables comply with industry standards and best practices, enabling our clients to trust us.

    4. Innovation: We continuously explore new methods and tools to provide better services and meet customer needs. We encourage innovation and experimentation, and are willing to accept challenges and change.

    5. Cost effectiveness: We provide cost-effective services that not only help customers save costs, but also improve efficiency and productivity. We always prioritize the interests of our customers and provide them with the best solutions.

    6. Teamwork: We believe in the power and value of teamwork, and our team members support, collaborate, and respect each other. We establish close cooperative relationships with customers, partners, and other stakeholders to achieve common goals.

    The above are just some of the reasons for choosing us. We believe there are many other advantages and values that can be provided to customers. If you are looking for a professional, reliable, and high-quality service provider, we look forward to working with you.


  • How does the stirring and defoaming machine work?

    The SIENOX stirring and defoaming machine performs defoaming through centrifugal force at revolution and stirring through shear force formed by revolution and rotation,

    Assisted by a vacuum pump to extract gas and achieve a vacuum state, removing nanoscale tiny bubbles. No contact with materials, no secondary pollution, and no secondary waste.

  • What is the function of a defoaming machine?

    A defoaming machine is a device used to remove bubbles from liquids. Its function is to assist in the liquid mixing, reaction, coating, printing, infusion and other process steps in the production process, avoiding the generation of bubbles and their impact on the final product. In many industrial and laboratory environments, removing bubbles is essential as they may have a negative impact on product quality, such as affecting surface tension and stability. Defoaming machines typically use various techniques such as vibration, ultrasound, centrifugation, etc. to achieve effective bubble removal. It has a wide range of applications, including but not limited to semiconductors, solar energy, optics, biotechnology, materials science, etc.

Technical Specification List

Full‑line standardized specifications for accurate process evaluation and equipment selection

Equipment ModelSIE‑301SIE‑302SIE‑303
Working Travel400×400×100600×600×1001000×1000×200
Control ModeHand Controller / PCHand Controller / PCHand Controller / PC
Nozzle ConfigurationSingle‑headSingle‑head / Multi‑headSingle‑head / Multi‑head
Working ModesDot Dispensing / Spray Dispensing / CoatingDot Dispensing / Spray Dispensing / CoatingDot Dispensing / Spray Dispensing / Coating
Glue Delay FunctionYesYesYes
Advance Glue‑off FunctionYesYesYes
Max Load (kg)101010
Moving Speed (mm/s)0.1~5000.1~5000.1~500
Repeat Accuracy (mm)±0.02±0.02±0.02
Overall Dimension(W×D×H)500×600×500mm700×800×500mm1300×1100×1600mm

Multi‑Industry Solutions

Covering stirring and debubbling applications of typical materials across six major industries

Adhesives.jpg

Adhesive R&D

Epoxy structural adhesive, sealant, hot‑melt adhesive, pressure‑sensitive adhesive, modified adhesive

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Precision Electronic Assembly

Underfill adhesive, conductive adhesive, SMT adhesive, dispensing adhesive, chip bonding adhesive

Electronic Materials.jpg

Biosensors

Encapsulation adhesive, reagent immobilization material, microfluidic bonding adhesive, biocompatible adhesive, sensor sealant

Thermal Conductive Silicone.jpg

Microelectronic Packaging

Packaging epoxy adhesive, molding compound, lead bonding adhesive, substrate bonding adhesive, passivation layer material

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Functional Coatings

Hydrophobic coating, conductive coating, insulating coating, anti‑corrosion coating, wear‑resistant coating

Photosensitive Materials.jpg

Electronic Pastes

Silver paste, copper paste, carbon paste, resistance paste, dielectric paste

Comprehensive Equipment Operation Demo Videos

Gain intuitive, clear, dynamic insight into synchronous defoaming with planetary centrifugal force and high negative pressure.

Measured Defoaming‑Process Performance

Measured Processing Results for Six Typical Materials

Lubricant Mixing & Defoaming.jpg

Paste‑like Materials

Photoresist Mixing & Defoaming.jpg

Glue with Powder

Polymer Materials.jpg

Polymer Materials

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Pharmaceutical Gel

Silver Paste Mixing & Defoaming.jpg

Silver Paste Materials

Battery Slurry & Adhesive Mixing & Defoaming.jpg

Battery Slurry

Precautions for Use

Comparison of Material State Before and After Three-Roll Milling

PrecautionsDescription
Liquid Viscosity MatchingAdjust dispensing parameters (speed / delay / glue‑off time) for liquids of different viscosities. Trial adjustment is recommended for first‑time use.
Needle SelectionSelect proper needle specifications according to glue volume and liquid viscosity. Needle inner diameter affects dispensing performance.
Cleaning & MaintenanceClean dispensing valve and needle regularly to prevent clogging by cured glue. Flush pipelines when changing liquids.
Program ManagementBuild product program library with marked product names and parameters for quick recall.
Environmental RequirementsKeep working environment clean to avoid dust affecting dispensing quality. UV glue shall be stored away from light.
Safe OperationDo not put hands into working area while equipment is running. Press stop button in case of emergency.

* Internal laboratory test data. Actual improvement varies with material formulas. Contact sales for real‑world customer cases.

Customer Delivery & Application Cases

Rooted in manufacturing frontlines, empowering benchmark production lines and key national research institutions across diverse industries.


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Stirring‑Defoaming Solution for Glue Materials in Consumer‑Electronics Industry


施诺斯真空脱泡搅拌机在胶粘剂中的解决方案.jpg

Vacuum Defoaming Solution for Consumer Electronics Adhesives


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Industrial University Solves Bubble Challenges of Coating‑Film Materials with SIENOX Defoaming Machine

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