Dispensing Machine

TEL:18925129293

SIENOX Automatic Dispenser SIE‑301


Four‑axis Linked Multi‑dimensional Dispensing for Precision Dispensing of Small Electronic Parts

Precision Dispensing for Small Parts + ±0.02mm Accuracy + Cost‑effective Entry‑level Model

SIENOX SIE‑301 automatic dispenser adopts four‑axis linkage for precise glue control. Working travel: 400×400×100mm, repeat accuracy ±0.02mm, max load 10kg. It supports programming via teach pendant and CAD import, compatible with UV glue, red glue, solder paste and other fluids for precision dispensing of small electronic components.

✓ CE Certification  ✓ FC Certification ✓ ISO9001 Quality System ✓ RoHS Compliance ✓ Customizable Voltage (110V/220V)

Online Message Free Sample Testing Engineer Hotline: 189-2512-9293

Why is precision dispensing required

Manual dispensing relies on operator experience, resulting in unstable glue volume, common issues such as glue accumulation, missing dispensing and stringing, and low yield consistency.

Higher Precision Requirements for Electronic Manufacturing

Processes such as PCB dispensing, component fixing and SMT patch glue repair require dispensing accuracy up to millimeter or even micron level. Manual dispensing cannot guarantee consistent glue volume, which may cause glue overflow contaminating pads or insufficient glue resulting in poor bonding. SIE‑301 delivers repeat accuracy of ±0.02mm to ensure consistent dispensing position and glue volume. Compatible with electronic‑grade materials including UV glue, red glue and solder paste, it improves yield of PCB dispensing.

Miniaturization Challenges for Semiconductor Packaging

Semiconductor processes such as chip underfill, lead packaging and conductive connection impose strict requirements on dispensing accuracy and glue volume control. Small‑sized chips and limited dispensing space may cause packaging defects with slight deviations. SIE‑301 with 400×400mm working travel fits chip‑scale packaging. ±0.02mm repeat accuracy ensures precise micron‑level dispensing position, compatible with packaging materials like epoxy adhesive, silver adhesive and conductive adhesive.

Precision Bonding Demands for Medical Devices

Medical devices feature compact size and high‑precision requirements, such as micro‑component bonding, needle dispensing and catheter coating. UV glue and medical‑grade adhesives shall be applied accurately at target positions. Excessive glue impairs product functions while insufficient glue reduces bonding strength. The single‑head precise positioning mode of SIE‑301 suits micro‑component dispensing. ±0.02mm accuracy guarantees consistent dispensing quality for medical devices.

✨ Dilemmas of traditional dispensing: Manual dispensing features low efficiency, poor consistency and unstable yield; semi‑automatic dispensers only support planar dispensing and cannot handle 3D curved surfaces; ordinary dispensers require complicated programming and long change‑over time, not suitable for multi‑variety small‑batch production.

Why Choose SIE‑301

Solve Pain Points of Model Selection for Precision Dispensing of Small‑sized Products

400×400mm Precision Working Travel

Working travel designed for small‑sized products, 400×400×100mm covers typical small‑size products such as PCB boards, chip packages and micro‑components. Well‑matched travel delivers higher positioning accuracy without sacrificing dispensing precision for small parts due to excessive working range. Max load 10kg, compatible with most small‑size workpieces and fixtures. Timing‑belt plus linear‑guide drive, moving speed 0.1‑500mm/s, balancing efficiency and stability.

Stable Quality with Single‑head Precise Glue Control

Single‑head dispensing mode focuses on high precision. Equipped with glue delay and advance glue‑off functions to precisely control glue output timing and volume for fluids of different viscosities. Uniform dispensed surface effectively avoids glue accumulation and dead glue. Precise positioning and accurate glue control prevent stringing, glue leakage and dripping. ±0.02mm repeat positioning accuracy ensures consistent dispensing quality for every small‑size product.

Cost‑effective Entry‑level with Fast ROI

SIE‑301 is positioned as entry‑level precision model. It lowers investment threshold with economical price while maintaining ±0.02mm accuracy and four‑axis linkage capability. Suitable for start‑ups, laboratory R&D and small‑batch production lines. Compact footprint, installable on desktop or workbench without extra workshop space. Fast return on investment, ideal starter equipment for automated dispensing.

✨ If you mainly dispense for small‑size products (PCB boards, chips, micro‑components) and pursue precise quality with cost‑effective entry‑level performance, SIE‑301 is your ideal choice.

Product Features

Four‑axis Linked Multi‑dimensional Motion

Four‑axis linkage design supports front‑back, left‑right movement as well as dispensing on 3D inclined and curved surfaces. It can perform rapid dot dispensing, line drawing, circle drawing and dispensing / coating / spraying of various irregular patterns on product surfaces, outer walls, vertical planes and gaps. 

Precise Glue Control System 

Equipped with glue delay and advance glue‑off functions to precisely control glue output timing and volume. Uniform dispensing surface effectively avoids glue accumulation, dead glue, stringing, leakage and dripping. Repeat positioning accuracy: ±0.02mm. 

Dual‑mode Programming 

Supports on‑site programming via teach pendant and PC‑based programming with CAD / CORELDRAW. Programs can be saved and recalled for quick product changeover, suitable for multi‑variety small‑batch production. 

Timing‑belt & Linear‑guide Transmission 

Adopts timing‑belt plus linear‑guide transmission. Travel speed adjustable from 0.1 to 500mm/s, balancing high‑speed efficiency and motion stability. 

Three Working Modes 

Three working modes: dot dispensing, spray dispensing and coating to meet diverse process requirements. Controlled via hand‑held controller or PC for flexible operation. 

Wide Compatibility for Liquids 

Compatible with various solvents, adhesives, paints and chemical materials, including dozens of industrial fluids such as UV glue, red glue, solder paste, silver glue, epoxy glue, instant glue and sealant.

Vacuum Mixer‑Defoamer Working Principle.jpg

Quick View of Technical Specifications

Complete Technical Specifications Overview, Customizable on Demand

Equipment ModelSIE‑301
Working Travel400×400×100
Control ModeHand Controller / PC
Nozzle ConfigurationSingle‑head
Working ModesDot Dispensing / Spray Dispensing / Coating
Glue Delay FunctionYes
Advance Glue‑off FunctionYes
Max Load (kg)10
Moving Speed (mm/s)0.1~500
Repeat Accuracy (mm)±0.02
Overall Dimension(W×D×H)500×600×500mm
Certifications CE, FC, ISO9001, RoHS Compliance

Our Partners

Trusted by leading industrial manufacturing clusters and advanced university laboratories worldwide

Partner Showcase

FAQ - Frequently Asked Questions

Answers to common questions about product performance and everyday process selection

  • 脱泡机的作用是什么?

    脱泡机是一种用于去除液体中的气泡的设备。它的作用在于帮助生产过程中的液体混合、反应、涂布、印刷、灌注等工艺环节,避免气泡的产生和对最终产品的影响。在许多工业和实验室环境中,去除气泡是非常必要的,因为气泡可能会对产品质量产生负面影响,如影响表面张力和稳定性等问题。脱泡机通常采用各种不同的技术,如振动、超声波、离心等,以实现有效的气泡去除。它的应用领域广泛,包括但不限于半导体、太阳能、光学、生物技术、材料科学等。

  • 售后服务怎么样?

    公司拥有专业的售后服务人员,24小时专人服务,一对一提供技术支持,解决您的后顾之忧。

  • 为什么要选择施诺斯?

    选择施诺斯的原因有很多,以下是一些主要的原因:

     1. 专业性:我们的团队由一群专业的人士组成,他们在各自的领域拥有丰富的经验和知识。我们不仅了解行业趋势和最佳实践,而且还能提供切实可行的解决方案。

     2. 服务质量:我们注重客户的需求和满意度,始终致力于提供高质量的服务。我们不仅快速响应客户需求,而且还能根据客户的要求进行定制化服务。 

    3. 可靠性:我们以诚信和专业精神为宗旨,始终遵守承诺和协议。我们的工作方法和交付成果均符合行业标准和最佳实践,使得我们的客户能够信任我们。 

    4. 创新性:我们不断探索新的方法和工具,以提供更好的服务并满足客户的需求。我们鼓励创新和实验,并愿意接受挑战和改变。 

    5. 成本效益:我们提供高性价比的服务,不仅能够帮助客户节省成本,而且还能提高效率和生产力。我们始终以客户的利益为出发点,为客户提供最优的解决方案。

     6. 团队合作:我们相信团队的力量和合作的价值,我们的团队成员之间互相支持、协作和尊重。我们与客户、合作伙伴和其他利益相关者建立紧密的合作关系,以实现共同的目标。 

    以上只是选择我们的部分原因,我们相信还有很多其他的优点和价值可以为客户提供。如果您正在寻找一家专业、可靠、高质量的服务提供商,我们非常期待与您的合作。

  • 搅拌脱泡机的工作原理?

    施诺斯搅拌脱泡机通过公转的离心力进行脱泡,通过公转与自转形成的剪切力进行搅拌,

    再辅助以真空泵抽取气体以达到真空状态,去除纳米级微小气泡。 不接触物料,无二次污染,无二次浪费。


  • 施诺斯能提供工程咨询技术服务吗?

    施诺斯能为广大客户提供全面的工程和现代化的咨询服务。施诺斯近二十年的搅拌经验,可以为你提供高效的咨询服务。

    想要让搅拌机性能更上一层楼,提升系统的整体效能?我们有全面的咨询、工程以及现代化改造服务,为您量身打造解决方案。 在如今竞争激烈的全球化浪潮中,唯有不断创新、持续优化,才能始终跑在对手前面。您的生产工艺和产品日新月异,我们就为您提供最适配的混合技术。不管是新的产品参数,还是既有的工艺条件,我们都能对现有系统和搅拌设备进行全方位的检查与评估,挖掘其中潜藏的流程优化空间和机械性能提升潜力,并且帮您把这些改进切实落地。 要是您的搅拌设备已经跟不上时代步伐,能耗居高不下,或是维护成本让您头疼不已,那就别犹豫,我们的咨询、工程设计和现代化改造服务,就是为您排忧解难的良方。欢迎随时联系我们,携手开启高效生产新征程!

Technical Specification List

Full‑line standardized specifications for accurate process evaluation and equipment selection

Equipment ModelSIE‑301SIE‑302SIE‑303
Working Travel400×400×100600×600×1001000×1000×200
Control ModeHand Controller / PCHand Controller / PCHand Controller / PC
Nozzle ConfigurationSingle‑headSingle‑head / Multi‑headSingle‑head / Multi‑head
Working ModesDot Dispensing / Spray Dispensing / CoatingDot Dispensing / Spray Dispensing / CoatingDot Dispensing / Spray Dispensing / Coating
Glue Delay FunctionYesYesYes
Advance Glue‑off FunctionYesYesYes
Max Load (kg)101010
Moving Speed (mm/s)0.1~5000.1~5000.1~500
Repeat Accuracy (mm)±0.02±0.02±0.02
Overall Dimension(W×D×H)500×600×500mm700×800×500mm1300×1100×1600mm
Certifications CE, FC, ISO9001, RoHS Compliance CE, FC, ISO9001, RoHS Compliance CE, FC, ISO9001, RoHS Compliance

Multi‑Industry Solutions

Covering stirring and debubbling applications of typical materials across six major industries

Adhesives.jpg

Adhesive R&D

Epoxy structural adhesive, sealant, hot‑melt adhesive, pressure‑sensitive adhesive, modified adhesive

Precision Optics.jpg

Precision Electronic Assembly

Underfill adhesive, conductive adhesive, SMT adhesive, dispensing adhesive, chip bonding adhesive

Electronic Materials.jpg

Biosensors

Encapsulation adhesive, reagent immobilization material, microfluidic bonding adhesive, biocompatible adhesive, sensor sealant

Thermal Conductive Silicone.jpg

Microelectronic Packaging

Packaging epoxy adhesive, molding compound, lead bonding adhesive, substrate bonding adhesive, passivation layer material

Medical Devices 02.jpg

Functional Coatings

Hydrophobic coating, conductive coating, insulating coating, anti‑corrosion coating, wear‑resistant coating

Photosensitive Materials.jpg

Electronic Pastes

Silver paste, copper paste, carbon paste, resistance paste, dielectric paste

Comprehensive Equipment Operation Demo Videos

Gain intuitive, clear, dynamic insight into synchronous defoaming with planetary centrifugal force and high negative pressure.

Measured Defoaming‑Process Performance

Measured Processing Results for Six Typical Materials

Lubricant Mixing & Defoaming.jpg

Paste‑like Materials

Photoresist Mixing & Defoaming.jpg

Glue with Powder

Polymer Materials.jpg

Polymer Materials

Gel Defoaming 02.jpg

Pharmaceutical Gel

Silver Paste Mixing & Defoaming.jpg

Silver Paste Materials

Battery Slurry & Adhesive Mixing & Defoaming.jpg

Battery Slurry

Precautions for Use

PrecautionsDescription
Liquid Viscosity MatchingAdjust dispensing parameters (speed / delay / glue‑off time) for liquids of different viscosities. Trial adjustment is recommended for first‑time use.
Needle SelectionSelect proper needle specifications according to glue volume and liquid viscosity. Needle inner diameter affects dispensing performance.
Cleaning & MaintenanceClean dispensing valve and needle regularly to prevent clogging by cured glue. Flush pipelines when changing liquids.
Program ManagementBuild product program library with marked product names and parameters for quick recall.
Environmental RequirementsKeep working environment clean to avoid dust affecting dispensing quality. UV glue shall be stored away from light.
Safe OperationDo not put hands into working area while equipment is running. Press stop button in case of emergency.

* Internal laboratory test data. Actual improvement varies with material formulas. Contact sales for real‑world customer cases.

Online submission of requirements


Get Information About Sienox's Centrifuge Mixer Machine

Kindly share a little information about your areas oooooooof interest below, we’ll email you a brochure tailored just for you about our home healthcare mobile services.



A Message From Our CEO
A special message from our CEO about Sienox’s measures to support customers during the COVID-19 outbreak.

Read the Letter
Back to Top