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Pressurized Debubbling Machine SIE‑RX16‑2600
Oversized Chamber for Whole‑panel Loading · Fully‑automatic Production‑grade Control with Redundant Safety Design
Oversized chamber and large‑size panel whole‑unit loading without batch processing + Fully‑automatic microcomputer production‑grade control with MES system connection support
SIENOX SIE‑RX16‑2600 Pressurized Debubbling Machine supports whole‑panel loading. Adopting fully‑automatic microcomputer control compatible with MES system connection, it is equipped with SMC digital pressure gauge with accuracy of ±0.01MPa and OMRON PID temperature control with accuracy of ±1.0℃. Multiple redundant safety measures include pressure vessel safety certificate, audio‑visual alarm and precision filter. It removes bubbles generated during laminating process by pressure and temperature to improve bonding strength between materials.
✓ CE Certification ✓ FC Certification ✓ ISO9001 Quality Management System ✓ RoHS Compliance ✓ Customizable voltage (110V/220V)
Why Must Microbubbles in Materials Be Eliminated?
Residual micro‑bubbles degrade end‑product quality directly
Large‑Panel Lamination IndustryDuring lamination of large‑size LCD, commercial display and touch panels, large‑area OCA adhesive generates abundant bubbles. Batch‑split processing raises working steps and secondary‑bubble risks, bringing high loss from full‑panel scrapping. The 5230L large‑chamber pressurized debubbler realizes one‑shot debubbling for whole panels without splitting. Precise SMC pressure control ensures uniform force across full panel surface, ideal for mass‑production debubbling of large‑panel lamination. | New‑Energy Battery Slurry IndustryBubbles in high‑volume battery slurry impair coating uniformity and battery safety. Mass production demands stable large‑volume debubbling for consistent batch quality. Its 5230L large chamber processes massive slurry containers in one run. Resistive heating reaches 60 ℃ within 5 min with internal temperature deviation of ±3 ℃. Fully‑automatic microcomputer control stores and reproduces process parameters, suitable for high‑volume debubbling of battery slurry. | Semiconductor Packaging IndustryBubbles in packaging adhesive cause voids and chip failure from moisture intrusion. High‑volume packaging requires stable debubbling for reliability. Three operating modes are selectable for different adhesives. Precision filters avoid secondary material contamination. The 5230L large chamber handles numerous packaging components per cycle. Audio‑visual alarm ensures long‑term safe mass‑production operation for high‑volume semiconductor packaging debubbling. |
✨ Dilemmas of traditional debubbling: Oversized‑panel products exceed regular‑equipment chamber size and have to be processed in split batches, bringing extra procedures and high secondary‑bubble risks. Mass‑volume production requires repeated batch processing, and long queuing time delays delivery. Large‑volume pressure vessels lack multi‑redundant safety systems, posing major risks for large‑scale production. Equipment failures may cause extremely high losses for high‑value products.
Why Choose SIE‑RX16‑2600
Solve capacity, management and safety pain points for large‑panel and high‑volume mass production
5230L Oversized ChamberThe oversized cylindrical chamber reaches a capacity of 5230L, more than doubling the volume from the 1990L of RX13-1500 model. It supports one-time processing of oversized panels and mass-volume products without batch splitting. Ideal for one-step debubbling of large-size LCD panels, commercial display screens, high-volume battery slurries and semiconductor packaging components, it avoids efficiency loss and secondary bubble risks caused by batch processing. | Fully-automatic Production-grade Microcomputer ControlAdopting fully-automatic microcomputer control and supporting MES system docking, the equipment enables storage and traceability of process parameters, with one-click parameter invocation for mass production without manual intervention. In high-volume production, the automatic control eliminates manual operation errors. MES connection realizes traceable and manageable batch parameters, meeting factory audit and quality management requirements and supporting production data analysis and optimization. | Multiple Safety Redundancies & Complete CertificationsEquipped with complete pressure vessel safety certifications, audio-visual alarm system, precision filter and microcomputer fault display & alarm functions, the machine features a multi-redundancy safety design. Safety is the top priority for large-capacity pressure vessels. Complete certifications and multi-level alarms ensure long-term safe operation in large-scale mass production, effectively reducing safety risks for high-value oversized panels and mass-volume products. |
✨ If you need to process oversized‑panel products, conduct high‑volume mass production, or require high‑level safety redundancy and automation, the RX16‑2600’s oversized chamber and production‑grade control can meet your large‑scale production requirements.
Working Principle
Remove bubbles generated during lamination by pressure and temperature to enhance bonding strength between different materials.
Step 1: Pressurization & Temperature Rise (Three Modes Optional) Step 2: Pressure‑holding Debubbling Step 3: Pressure Relief & Stabilization Three simple steps: Pressurization & Temperature Rise → Pressure‑holding Debubbling → Pressure Relief & Stabilization, to eliminate lamination bubbles and strengthen bonding force. | ![]() |
Technical Specifications
Complete Technical Specifications Overview, Customizable on Demand
| Model | SIE‑RX16‑2600 |
| Chamber Size | φ1600×2600mm (Cylindrical) |
| Effective Volume | Approx. 5230L |
| Working Pressure | 0~0.8MPa (Standard), 0~2.5MPa (Optional) |
| Working Temperature | Ambient ~80℃ (Standard), Ambient ~180℃ (Optional) |
| Heating Method | Resistive Heating |
| Operation Modes | A. Pressurize First Then Heat B. Simultaneous Heating & Pressurization C. Heat First Then Pressurize |
| Control Mode | Microcomputer Control |
| Vessel Material | S30408 Stainless Steel or Carbon Steel |
| Overall Dimension(W×D×H) | Approx. 2000×2900×2600mm (Subject to actual product) |
| Net Weight | 5000 kg |
| Certifications | CE, FC, ISO9001, RoHS Compliance |
Our Partners
Trusted by leading industrial manufacturing clusters and advanced university laboratories worldwide
FAQ - Frequently Asked Questions
Answers to common questions about product performance and everyday process selection
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脱泡机的作用是什么?
脱泡机是一种用于去除液体中的气泡的设备。它的作用在于帮助生产过程中的液体混合、反应、涂布、印刷、灌注等工艺环节,避免气泡的产生和对最终产品的影响。在许多工业和实验室环境中,去除气泡是非常必要的,因为气泡可能会对产品质量产生负面影响,如影响表面张力和稳定性等问题。脱泡机通常采用各种不同的技术,如振动、超声波、离心等,以实现有效的气泡去除。它的应用领域广泛,包括但不限于半导体、太阳能、光学、生物技术、材料科学等。
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售后服务怎么样?
公司拥有专业的售后服务人员,24小时专人服务,一对一提供技术支持,解决您的后顾之忧。
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为什么要选择施诺斯?
选择施诺斯的原因有很多,以下是一些主要的原因:
1. 专业性:我们的团队由一群专业的人士组成,他们在各自的领域拥有丰富的经验和知识。我们不仅了解行业趋势和最佳实践,而且还能提供切实可行的解决方案。
2. 服务质量:我们注重客户的需求和满意度,始终致力于提供高质量的服务。我们不仅快速响应客户需求,而且还能根据客户的要求进行定制化服务。
3. 可靠性:我们以诚信和专业精神为宗旨,始终遵守承诺和协议。我们的工作方法和交付成果均符合行业标准和最佳实践,使得我们的客户能够信任我们。
4. 创新性:我们不断探索新的方法和工具,以提供更好的服务并满足客户的需求。我们鼓励创新和实验,并愿意接受挑战和改变。
5. 成本效益:我们提供高性价比的服务,不仅能够帮助客户节省成本,而且还能提高效率和生产力。我们始终以客户的利益为出发点,为客户提供最优的解决方案。
6. 团队合作:我们相信团队的力量和合作的价值,我们的团队成员之间互相支持、协作和尊重。我们与客户、合作伙伴和其他利益相关者建立紧密的合作关系,以实现共同的目标。
以上只是选择我们的部分原因,我们相信还有很多其他的优点和价值可以为客户提供。如果您正在寻找一家专业、可靠、高质量的服务提供商,我们非常期待与您的合作。
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搅拌脱泡机的工作原理?
施诺斯搅拌脱泡机通过公转的离心力进行脱泡,通过公转与自转形成的剪切力进行搅拌,
再辅助以真空泵抽取气体以达到真空状态,去除纳米级微小气泡。 不接触物料,无二次污染,无二次浪费。
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施诺斯能提供工程咨询技术服务吗?
施诺斯能为广大客户提供全面的工程和现代化的咨询服务。施诺斯近二十年的搅拌经验,可以为你提供高效的咨询服务。
想要让搅拌机性能更上一层楼,提升系统的整体效能?我们有全面的咨询、工程以及现代化改造服务,为您量身打造解决方案。 在如今竞争激烈的全球化浪潮中,唯有不断创新、持续优化,才能始终跑在对手前面。您的生产工艺和产品日新月异,我们就为您提供最适配的混合技术。不管是新的产品参数,还是既有的工艺条件,我们都能对现有系统和搅拌设备进行全方位的检查与评估,挖掘其中潜藏的流程优化空间和机械性能提升潜力,并且帮您把这些改进切实落地。 要是您的搅拌设备已经跟不上时代步伐,能耗居高不下,或是维护成本让您头疼不已,那就别犹豫,我们的咨询、工程设计和现代化改造服务,就是为您排忧解难的良方。欢迎随时联系我们,携手开启高效生产新征程!
Multi‑Model Specification Comparison Table
Compare Models in the Same Series for Accurate Selection
| Model | SIE-RX10-1800 | SIE-RX13-1500 | SIE-RX16-2600 |
| Chamber Size | φ1000×1800mm | φ1300×1500mm | φ1600×2600mm |
| Effective Volume | 1410L | 1990L | 5230L |
| Pressure Range | 0~2.5MPa(Optional) | 0~2.5MPa(Optional) | 0~2.5MPa(Optional) |
| Temperature Range | Ambient ~180℃(Optional) | Ambient ~180℃(Optional) | Ambient ~180℃(Optional) |
| Pressure Accuracy | ±0.01MPa | ±0.01MPa | ±0.01MPa |
| Temperature Control Accuracy | ±1.0℃ | ±1.0℃ | ±1.0℃ |
| Power Supply | 380V, 50/60Hz (Customizable for 110V US/JP standard) | 380V, 50/60Hz (Customizable for 110V US/JP standard) | 380V, 50/60Hz (Customizable for 110V US/JP standard) |
| Overall Dimension(W×D×H) | 1300×2100×2000mm | 1600×1800×2300mm | 2000×2900×2600mm |
| Net Weight | 2000 kg | 3000 kg | 5000 kg |
| Certifications | CE, FC | CE, FC | CE, FC |
***The above are typical models only. Customized solutions are available upon customer requirements.
Multi‑Industry Solutions
Covering stirring and debubbling applications of typical materials across six major industries
LCD Polarizer LaminationOCA optical adhesive for small‑size polarizers, lamination adhesive for LCD glass substrates |
Electronic Component PackagingComponent encapsulant, chip potting adhesive |
Medical DevicesMedical bonding adhesive, medical‑device lamination adhesive |
LED PackagingLED encapsulant, phosphor paste |
Fine ChemicalsFine chemical materials, nano‑powders |
New‑Energy MaterialsR&D samples of new‑energy materials, battery slurry samples |
Comprehensive Equipment Operation Demo Videos
Gain intuitive, clear, dynamic insight into synchronous defoaming with planetary centrifugal force and high negative pressure.
Actual‑test Performance Demonstration
Measured Processing Results for Six Typical Materials
Slurry & Powder |
Adhesive |
Hydrogen‑Energy Materials |
Adhesive |
Substrate & Filler |
Adhesive & Ceramic Powder |
Actual‑test Effect Comparison
Comparison of Material Status Before and After Pressurized Debubbling
| Material Type | Pre‑processing Status | After Processed by SIE‑RX16‑2600 |
| Polarizer OCA Optical Adhesive | Plenty of internal bubbles causing uneven light transmission and mottling after lamination | Bubble‑free transparent adhesive with uniform light transmission after lamination |
| Electronic Component Encapsulant | Dense internal bubbles leading to voids in cured encapsulation layer | Dense void‑free adhesive for complete and reliable encapsulation layer |
| Medical Bonding Adhesive | Internal bubbles cause bonding‑surface defects and compromise biocompatibility | Dense adhesive with intact bonding surface and qualified biocompatibility |
* Internal lab test data. Actual improvement varies with material formulations. Contact sales for real‑world customer cases.












