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Pressurized Debubbling Machine SIE‑RX6‑900


SMC Precision Pressure Control ±0.01MPa · Stable Batch Quality for Small-Scale Lamination

SMC Digital Pressure Gauge with Precision Control ±0.01MPa + Omron PID Temperature Control ±1°C + Audible, Visual & Light Alarm Microcomputer Fault Location

Schnos SIE-RX6-900 Pressure Defoaming Machine, φ600×900mm cylindrical chamber with approximately 255L capacity, SMC digital pressure gauge accuracy ±0.01MPa, Omron PID temperature control accuracy ±1.0°C. Three working modes available, resistive heating provides fast temperature rise and good uniformity, utilizing pressure and temperature to remove bubbles generated during the lamination process and enhance adhesion between materials.

✓ CE Certified ✓ FC Certified ✓ ISO9001 Quality System ✓ RoHS Compliant ✓ Custom Voltage Supported (110V/220V)

Online Message Free Sample Testing Engineer Hotline: 189-2512-9293

Why Must Microbubbles in Materials Be Eliminated?

Residual micro‑bubbles degrade end‑product quality directly

Touch‑Screen G+G Lamination Industry

During glass‑to‑glass touch‑screen lamination, residual bubbles inside OCA optical adhesive reduce touch sensitivity, cause mottled display and even delamination in severe cases. The pressurized debubbler compresses and dissolves interfacial bubbles by pressure, while temperature reduces OCA viscosity to facilitate bubble escape. The φ600 chamber fits small‑batch debubbling for medium‑small‑size touch screens. SMC precise pressure control guarantees consistent lamination quality across batches.

LED Packaging Industry

Bubbles in LED encapsulation adhesive trigger light scattering, accelerated light attenuation and premature device failure. Three selectable operation modes support simultaneous or step‑wise heating‑pressurization according to adhesive properties. Omron PID temperature control ensures proper fluidity for easy bubble removal. It suits small‑batch debubbling of LED encapsulation adhesive to secure LED luminous efficiency and service life.

Fine Chemical Material Industry

Bubbles inside fine chemicals and nano‑powder materials impair dispersion uniformity and material performance. Stable debubbling is required for quality assurance in small‑batch production. Precision filter prevents secondary material contamination. Microcomputer‑controlled storable & reproducible parameters enable pressurized debubbling for small‑batch fine chemicals and nano‑powders with stable and traceable batch quality.

✨ Traditional debubbling dilemmas: In R&D and trial production, the lack of professional pressurized debubbling equipment leads to low efficiency as bubbles can only escape naturally through long-time standing. Ordinary ovens only provide heating without pressurization, making interfacial bubbles difficult to remove. Inaccurate temperature control causes unstable fluidity of OCA adhesive, resulting in poor repeatability of process parameters.

Why Choose SIE‑RX6‑900

Solve quality consistency & safety pain points for small‑batch lamination production

Precise Pressure Control by SMC Digital Pressure Gauge

Adopted Japanese SMC digital pressure gauge with ±0.01 MPa pressure accuracy for intuitive digital readout. Precise pressure control is critical for batch consistency in small‑batch production. Featuring fast response and high stability, the SMC gauge keeps pressure deviation minimal to guarantee consistent lamination quality across batches.

Omron PID Temperature Control ±1℃

Equipped with Omron thermostat for automatic PID temperature adjustment, with temperature control accuracy of ±1.0℃ and internal temperature difference within ±3℃. Temperature directly affects fluidity of OCA adhesive and encapsulation adhesive. Accurate temperature control ensures debubbling under identical thermal conditions for each batch and prevents debubbling deviation caused by temperature fluctuation.

Audio‑Visual‑Light Alarm with Microcomputer Display

Synchronized audio‑visual‑light alarm with fault messages displayed on microcomputer for rapid fault diagnosis. Equipment failure may cause whole‑batch scrap in small‑batch production. This alarm system enables timely abnormality detection & handling to reduce losses.

✨ If your small‑batch lamination production demands consistent quality and safety, SMC precise pressure control and Omron PID temperature control of RX6‑900 ensure stable batch‑to‑batch quality.

Working Principle

Remove bubbles generated during lamination by pressure and temperature to enhance bonding strength between different materials.

Step 1: Pressurization & Heating (3 modes optional)
Select pressure‑first then heating, simultaneous heating‑pressurization, or heating‑first then pressure according to material properties. Resistive heating combined with pressure builds debubbling environment.

Step 2: Pressure‑holding Debubbling
Maintain constant pressure and temperature. Pressure compresses and dissolves lamination‑surface bubbles; temperature reduces material viscosity to facilitate bubble discharge.

Step 3: Pressure Relief & Stabilization
Slowly release pressure to atmospheric level. Material bonding strength improves and lamination‑surface bubbles are eliminated.


Three simple steps: Pressurize & Heat → Hold Pressure for Debubbling → Relieve Pressure & Stabilize. Remove lamination bubbles and strengthen bonding force.

Vacuum Mixer‑Debubbler Working Principle.jpg

Technical Specifications

Complete Technical Specifications Overview, Customizable on Demand

Equipment ModelSIE-RX6-900
Chamber Dimensionsφ400×600mm (Cylindrical)
Effective VolumeApprox. 255L
Working Pressure0~0.8MPa (Standard), 0~2.5MPa (Optional)
Working TemperatureRoom Temp~80°C (Standard), Room Temp~180°C (Optional)
Heating MethodResistive Heating
Working ModesA. Pressurize first then heat up B. Heat and pressurize simultaneously C. Heat up first then pressurize
Control MethodMicrocomputer Control
Tank MaterialS30408 Stainless Steel or Carbon Steel
Overall Dimensions (W×D×H)Approx. 900×1200×1500mm (Subject to actual product)
Net Weight500 kg
Certifications CE, FC, ISO9001, RoHS Compliant

Our Partners

Trusted by leading industrial manufacturing clusters and advanced university laboratories worldwide

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FAQ - Frequently Asked Questions

Answers to common questions about product performance and everyday process selection

  • 脱泡机的作用是什么?

    脱泡机是一种用于去除液体中的气泡的设备。它的作用在于帮助生产过程中的液体混合、反应、涂布、印刷、灌注等工艺环节,避免气泡的产生和对最终产品的影响。在许多工业和实验室环境中,去除气泡是非常必要的,因为气泡可能会对产品质量产生负面影响,如影响表面张力和稳定性等问题。脱泡机通常采用各种不同的技术,如振动、超声波、离心等,以实现有效的气泡去除。它的应用领域广泛,包括但不限于半导体、太阳能、光学、生物技术、材料科学等。

  • 售后服务怎么样?

    公司拥有专业的售后服务人员,24小时专人服务,一对一提供技术支持,解决您的后顾之忧。

  • 为什么要选择施诺斯?

    选择施诺斯的原因有很多,以下是一些主要的原因:

     1. 专业性:我们的团队由一群专业的人士组成,他们在各自的领域拥有丰富的经验和知识。我们不仅了解行业趋势和最佳实践,而且还能提供切实可行的解决方案。

     2. 服务质量:我们注重客户的需求和满意度,始终致力于提供高质量的服务。我们不仅快速响应客户需求,而且还能根据客户的要求进行定制化服务。 

    3. 可靠性:我们以诚信和专业精神为宗旨,始终遵守承诺和协议。我们的工作方法和交付成果均符合行业标准和最佳实践,使得我们的客户能够信任我们。 

    4. 创新性:我们不断探索新的方法和工具,以提供更好的服务并满足客户的需求。我们鼓励创新和实验,并愿意接受挑战和改变。 

    5. 成本效益:我们提供高性价比的服务,不仅能够帮助客户节省成本,而且还能提高效率和生产力。我们始终以客户的利益为出发点,为客户提供最优的解决方案。

     6. 团队合作:我们相信团队的力量和合作的价值,我们的团队成员之间互相支持、协作和尊重。我们与客户、合作伙伴和其他利益相关者建立紧密的合作关系,以实现共同的目标。 

    以上只是选择我们的部分原因,我们相信还有很多其他的优点和价值可以为客户提供。如果您正在寻找一家专业、可靠、高质量的服务提供商,我们非常期待与您的合作。

  • 搅拌脱泡机的工作原理?

    施诺斯搅拌脱泡机通过公转的离心力进行脱泡,通过公转与自转形成的剪切力进行搅拌,

    再辅助以真空泵抽取气体以达到真空状态,去除纳米级微小气泡。 不接触物料,无二次污染,无二次浪费。


  • 施诺斯能提供工程咨询技术服务吗?

    施诺斯能为广大客户提供全面的工程和现代化的咨询服务。施诺斯近二十年的搅拌经验,可以为你提供高效的咨询服务。

    想要让搅拌机性能更上一层楼,提升系统的整体效能?我们有全面的咨询、工程以及现代化改造服务,为您量身打造解决方案。 在如今竞争激烈的全球化浪潮中,唯有不断创新、持续优化,才能始终跑在对手前面。您的生产工艺和产品日新月异,我们就为您提供最适配的混合技术。不管是新的产品参数,还是既有的工艺条件,我们都能对现有系统和搅拌设备进行全方位的检查与评估,挖掘其中潜藏的流程优化空间和机械性能提升潜力,并且帮您把这些改进切实落地。 要是您的搅拌设备已经跟不上时代步伐,能耗居高不下,或是维护成本让您头疼不已,那就别犹豫,我们的咨询、工程设计和现代化改造服务,就是为您排忧解难的良方。欢迎随时联系我们,携手开启高效生产新征程!

Multi‑Model Specification Comparison Table

Compare Models in the Same Series for Accurate Selection

Equipment ModelSIE-RX4-600SIE-RX6-900SIE-RX8-1200
Chamber Dimensionsφ400×600mmφ600×900mmφ800×1200mm
Effective Volume75L255L600L
Pressure Range0~2.5MPa (Optional)0~2.5MPa (Optional)0~2.5MPa (Optional)
Temperature RangeRoom Temp~180°C (Optional)Room Temp~180°C (Optional)Room Temp~180°C (Optional)
Pressure Accuracy±0.01MPa±0.01MPa±0.01MPa
Temperature Control Accuracy±1.0°C±1.0°C±1.0°C
Power Supply220V, 50/60Hz (110V US/Japan standard customizable)220V, 50/60Hz (110V US/Japan standard customizable)220V, 50/60Hz (110V US/Japan standard customizable)
Overall Dimensions (W×D×H)510 × 430 × 500 mm610 × 560 × 780 mm610 × 560 × 780 mm
Net Weight95 kg153 kg163 kg
CertificationsCE, FCCE, FCCE, FC

***The above are only typical models. We can provide customized solutions based on customer requirements.

Multi‑Industry Solutions

Covering stirring and debubbling applications of typical materials across six major industries

Electronic Materials.jpg

LCD Polarizer Lamination

Small‑size polarizer OCA optical adhesive, LCD glass substrate lamination adhesive

New Energy.jpg

Electronic Component Encapsulation

Component encapsulation adhesive, chip potting adhesive

Advanced Materials.jpg

Medical Devices

Medical bonding adhesive, medical‑device lamination adhesive

Printing & Packaging.jpg

LED Packaging

LED encapsulation adhesive, phosphor adhesive

Cosmetics.jpg

Fine Chemicals

Fine chemical materials, nano‑powders

Ceramics.jpg

New Energy Materials

R&D samples of new‑energy materials, small‑batch battery slurries

Comprehensive Equipment Operation Demo Videos

Gain intuitive, clear, dynamic insight into synchronous defoaming with planetary centrifugal force and high negative pressure.

Actual‑test Performance Demonstration

Measured Processing Results for Six Typical Materials

Red Slurry Mixing & Debubbling.jpg

Slurries & Powders

Adhesive Before‑after Debubbling 02.jpg

Adhesives

Hydrogen‑Energy Materials.jpg

Hydrogen‑Energy Materials

Adhesive Before‑after Debubbling 01.jpg

Adhesives

Substrate & Filler Mixing‑Debubbling.jpg

Substrates & Fillers

Adhesive & Ceramic Powder Mixing‑Debubbling.jpg

Adhesive & Ceramic Powder

Actual‑test Effect Comparison

Comparison of Material Status Before and After Pressurized Debubbling

Material TypePre‑treatment StatusAfter SIE‑RX6‑900 Treatment
Polarizer OCA Optical AdhesiveRich internal bubbles, uneven light transmission & mottling after laminationBubble‑free transparent adhesive, uniform light transmission after lamination
LED Encapsulation AdhesiveDense internal bubbles, accelerated LED light attenuation after packagingDense bubble‑free adhesive, stable LED luminous efficiency & long service life
Fine Chemical MaterialsPlenty of internal bubbles, poor dispersion impairs material performanceUniform & dense material with qualified dispersion consistency

* Internal lab test data. Actual improvement varies with material formula. Contact sales for real‑world customer cases.

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