According to data from 100ppi.com, the benchmark price of epoxy resin stood at 15,650 yuan per ton on September 28, representing an 8.12% increase within 20 days, with continuous price hikes from manufacturers. As a key raw material for electronic packaging, composite materials and adhesives, the rising price of epoxy resin prompts downstream enterprises to re-examine their glue mixing processes, and epoxy resin vacuum defoaming mixers have attracted growing attention accordingly.

The price fluctuation of epoxy resin stems from rising prices of upstream raw materials such as bisphenol A and epichlorohydrin coupled with recovering downstream demand. For glue-using enterprises, higher resin costs make loss control in the glue mixing stage more critical. Insufficient stirring or excessive gas content of adhesive liquid will not only cause material waste, but also may generate bubble defects after curing, bringing rework costs. The viscosity of epoxy resin varies greatly with molecular weight. Some systems have poor fluidity at room temperature, making bubbles hard to remove. Traditional stirring and static standing methods cannot balance efficiency and defoaming effect well.

Solution Background

Take the epoxy resin mixing procedure of a composite product enterprise in South China as an example. Its single batch glue mixing amount is about 900 grams. The viscosity rises rapidly after the resin is mixed with curing agent. Bubbles trapped during stirring are difficult to eliminate after pouring, leading to a high rate of bubble defects on product surfaces.

Processing Challenges

The viscosity of epoxy resin rises rapidly along with the curing reaction, resulting in a short mixing window. Trapped bubbles are hard to discharge after pouring, directly affecting the surface quality of finished products. Against the backdrop of rising resin prices, glue mixing loss and rework costs are further amplified.

Why Choose SIENOX Equipment

SIENOX adopted the MIX1000PLUS model for this solution, with a processing volume of 1000ml, working vacuum degree of -98KPa and revolution speed of 2000rpm. It adopts planetary revolution and rotation combined with vacuum defoaming to complete sufficient mixing and defoaming before the resin viscosity increases.

Processing Procedure

After the resin and curing agent are loaded into the container according to the proportion, the equipment starts planetary revolution and rotation movement under vacuum environment. The centrifugal force from revolution keeps the adhesive rolling along the container wall, and the shear force from rotation ensures thorough mixing of resin and curing agent. Vacuum negative pressure accelerates bubble precipitation and rupture. A temperature control module can be optionally equipped for temperature-sensitive systems. This customized function needs to be confirmed during model selection.

Processing Results

Single-batch processing is finished within several minutes. Bubbles in the discharged adhesive liquid are greatly reduced, the surface defect rate of cast products declines, material loss is cut down, and the batch consistency of glue mixing is improved.

From the industry perspective, the rising price of epoxy resin together with growing demand for high-end applications speeds up the trend of equipment utilization and standardization in glue mixing. Fields including copper clad laminates, semiconductor packaging and composite materials put forward higher requirements for epoxy resin treatment, and vacuum defoaming equipment is changing from an optional item to standard configuration for glue mixing processes.

The upward price trend of epoxy resin is driving downstream enterprises to optimize glue mixing processes. As key equipment to reduce loss and stabilize batch quality, vacuum defoaming equipment will see sustained growth in supporting demand. Equipment manufacturers with planetary vacuum defoaming capability will further expand application scope in resin glue mixing.