Samsung Electronics expects the production capacity of HBM4 and HBM4E to double next year, with continuous capacity expansion for high-bandwidth memory advanced packaging. The large-scale capacity expansion of memory advanced packaging has significantly raised attention to the demand for packaging material processing equipment such as silver paste defoaming machines.

Demand for high-bandwidth memory from AI accelerator cards is growing rapidly, and HBM4 has entered the window for mass production rollout. The three major memory manufacturers are expanding production simultaneously. Compared with conventional packaging, HBM packaging involves advanced processes including TSV, underfill and multi-layer stacking. With more stacked chip layers and a more complex structure, it imposes greatly higher requirements on the consistency and reliability of packaging materials.

Materials used in HBM packaging such as underfill and silver paste feature high solid content and high viscosity. Residual bubbles in the materials may expand into voids during thermal cycles, directly affecting the interconnection reliability of stacked chips. Once interlayer failure occurs in the multi-layer stacked structure, the repair cost will be extremely high. Therefore, the material defoaming step has become an indispensable part of the HBM packaging process. SIENOX silver paste defoaming machine combines planetary revolution and rotation motion with vacuum environment. Materials receive centrifugal force from revolution and shear force from rotation inside the container at the same time. Vacuum negative pressure helps discharge air bubbles. It is suitable for mixing and defoaming treatment of high-viscosity packaging materials such as silver paste and underfill, covering multiple stages from laboratory formula verification to production line pilot test, helping packaging enterprises stabilize material batch consistency.

From the perspective of industrial progress, the doubling of HBM capacity means a corresponding increase in capital expenditure for advanced packaging production lines. Memory manufacturers and packaging & testing companies are expanding their 2.5D and 3D packaging capabilities. Supporting demands for packaging material suppliers are gradually released along with production line commissioning and mass production ramp-up, and the verification window for material defoaming equipment also concentrates in this period.

HBM capacity expansion is accelerating, and the importance of the packaging material processing segment keeps rising. As memory manufacturers such as Samsung push forward capacity doubling plans, the defoaming demand for high-viscosity materials including underfill and silver paste will grow further. Equipment manufacturers with planetary vacuum defoaming capability will gain more opportunities in the upgrade of memory advanced packaging.