Kingboard Laminates completed its seventh price increase of copper clad laminates for the year at the end of August. Prices of FR-4 products of various thicknesses rose by approximately 10% on average, and some thin prepreg (PP) materials saw a 20% price hike. The price surge of electronic fabrics and copper clad laminates has spread from leading manufacturers to second and third-tier PCB enterprises, greatly raising attention to material processing equipment such as epoxy resin vacuum defoaming mixers.

Demand for AI servers and high-speed high-frequency boards fuels the demand for high-grade electronic fabrics and copper clad laminates. Upstream raw materials including copper foil, fiberglass and resin have witnessed successive price increases. Kingboard has raised prices seven times within the year, with some products surging more than 100%, kicking off price transmission along the industrial chain. The production of copper clad laminates and prepregs relies heavily on the formulation of epoxy resin adhesive systems, and the quality of adhesive directly determines the dielectric properties and appearance consistency of boards.

Epoxy resin systems feature high solid content and high viscosity. Resin, curing agents and fillers require thorough mixing. If air bubbles remain inside the boards, voids or delamination will form during lamination, impairing dielectric performance and reliability. For high-speed high-frequency boards, medium inhomogeneity caused by air bubbles will further amplify signal loss. SIENOX epoxy resin vacuum defoaming mixer combines planetary revolution and rotation motion with vacuum environment. Materials are subjected to revolutionary centrifugal force and rotational shear force inside the container simultaneously. Vacuum negative pressure facilitates bubble removal. It is suitable for dispersion and defoaming of high-viscosity resin systems such as epoxy resin, helping CCL and material manufacturers stabilize batch consistency of adhesive liquid.

In terms of supply and demand, price hikes of upstream copper foil and resin are expected to continue, and CCL enterprises have growing demands for capacity expansion and technical transformation. As a critical front-end procedure in CCL production, adhesive formulation will see rising supporting equipment demand alongside capacity construction and product upgrading.

The CCL price hike keeps spreading, and equipment demand for material preparation maintains growth. Defoaming equipment capable of stably handling high-viscosity resin systems will be more widely adopted in the production of copper clad laminates and prepregs. Equipment manufacturers with planetary vacuum defoaming technology are expected to capture more supporting opportunities amid this round of industrial chain expansion.