In high‑end electronic encapsulation and precision manufacturing industries, the reliability of BOX single‑component epoxy adhesive directly determines the service life of end‑products. Micro‑scale bubbles trapped inside high‑viscosity colloid will form stress‑concentration points after curing, which act as hidden hazards leading to component desoldering and thermal conduction failure. Conventional defoaming processes cannot handle thixotropic colloids, and the industry is calling for disruptive solutions.

Industry Pain Points: Product Failures Triggered by Micro‑Bubbles

Strength Deterioration: 50 μm bubbles reduce bonding strength by 40 % and raise vibration‑test failure probability by 8 times.

Process Deviation: Sedimentation of metallic fillers causes ±30 % resistance fluctuation and a 50 % drop in thermal conductivity.

Escalated Costs: Manual defoaming achieves only 65 % yield, with scrap losses exceeding CNY 120,000 per ton of material.

Application Risks: Bubble rupture during dispensing results in glue interruption, and SMT mounting accuracy drops to ±0.3 mm.

Solution: Vacuum Planetary Defoaming System

Planetary Motion Mechanism: Combined revolution and rotation of materials generate high‑speed shear force and centrifugal force.

Centrifugal Separation Effect: High centrifugal force drives bubbles to converge toward the center and form defoaming channels.

Shear Disintegration: Rotation delivers high shear force to efficiently break bubble agglomerates.

Vacuum‑boosted Defoaming: With vacuum degree above ‑100 kPa, defoaming efficiency increases by 3‑5 times.

Application Industries

Chip Encapsulation

Aerospace

Power Batteries

Optical Components

SIENOX Planetary Defoaming Machine:

Efficient Mixing & Dispersion: Epoxy adhesives are mixed rapidly and thoroughly, greatly cutting processing time versus traditional methods.

Micro‑bubble Elimination: Blade‑free centrifugal processing ensures bubble‑free mixtures, which is critical for epoxy adhesive performance.

Contamination‑free Process: Disposable mixing containers prevent cross‑contamination and eliminate inter‑batch cleaning.

Multi‑batch Compatibility: Capable of small‑lab and large‑volume production, covering from R&D formulation to full‑scale manufacturing.

Consistent & Reproducible Output: Precisely controlled mixing parameters guarantee batch‑to‑batch consistency for better product quality and reliability.

Planetary mixing‑defoaming technology enables BOX single‑component epoxy adhesive to reach new quality benchmarks. SIENOX equipment provides nationally‑standard‑certified hardware and supports access to an intelligent formula management platform. It realizes seamless parameter migration from R&D to mass production and helps build core technical competitiveness in high‑end electronic adhesive markets.