Adhesive Degasser
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AB Glue Defoaming Machine
Solve Bubble Difficulties of Two‑Component AB Glue After Mixing · Dense Potting Layer Without Voids
Two‑component mixing & defoaming integration + Dual defoaming by stirring and vacuum + Full coverage from laboratory to mass production
SIENOX AB‑glue defoaming solutions cover three technical routes: centrifugal defoaming, vacuum defoaming, and stirring‑vacuum defoaming. It provides full‑phase solutions from laboratory R&D to mass production for bubble issues of mixed two‑component AB glue. From several‑milliliter formula verification to dozens‑of‑liter batch potting, every batch of AB‑glue potting products achieves bubble‑free dense structure.
✓ CE Certification ✓ FC Certification ✓ ISO9001 Quality System ✓ RoHS Compliance ✓ Custom voltage available (110V/220V)
Why Do You Need an AB Glue Defoaming Machine?
Bubbles entrapped during mixing greatly impair potting quality
Electronic Component Potting IndustryElectronic components such as power modules, transformers and sensors are commonly protected by epoxy AB‑glue potting. Bubbles form voids inside potting layers, causing uneven electrical insulation. Breakdown tends to occur at bubble positions under high‑voltage conditions, resulting in direct component scrapping. | LED Lighting Industry | Automotive Electronics IndustryPotting requirements are stricter for vehicle‑mounted ECUs, wire‑harness connectors, sensors and other parts. Cracks and liquid ingress easily emerge around bubbles under vibration, temperature cycling and humid‑hot conditions. Automotive‑grade products demand strict potting compactness for every unit in mass production. Stirring‑vacuum defoaming machines match production‑line tact time to guarantee consistent potting quality for each batch. |
✨ Traditional Dilemma: After manual stirring of AB glue, pour it into a container and let it stand for half an hour. Though no bubbles appear on the surface, numerous tiny holes turn up once the potted part is cured and cut open. Bubbles inside high‑viscosity AB glue cannot escape merely by vacuum chamber pumping. Even if defoaming is finished, new bubbles get entrapped again during potting. What you need is not more expensive glue, but a stirring‑vacuum defoaming solution that completes mixing and defoaming simultaneously.
Why Choose SIENOX AB‑Glue Defoaming Solution
Solve Core Challenges of AB‑Glue Mixing and Defoaming
Simultaneous Mixing and DefoamingThe biggest pain point of AB glue is bubbles entrapped during mixing. SIENOX MIX‑series stirring‑vacuum defoaming machines blend A and B glue under vacuum atmosphere. Bubbles generated during stirring are extracted synchronously under vacuum. Mixing and defoaming are accomplished in one single process, eliminating separate steps of stirring, material transfer and defoaming. It improves efficiency and prevents new bubbles caused by secondary material transfer. | Full‑phase Application CoverageC‑series centrifugal defoaming machines (0‑12mL) for lab small‑sample verification for efficient defoaming of several‑milliliter AB‑glue samples; ZK‑series vacuum defoaming machines (50‑500mL) for pilot scale‑up; MIX‑series stirring‑vacuum defoaming machines (50mL‑20L) for mass production. Process parameters can be smoothly scaled up from R&D formula validation to batch potting. | For Thin to Paste‑Like AdhesivesSIENOX equipment series covers full viscosity range, from low‑viscosity epoxy AB glue (good fluidity, handled by centrifugal defoaming) to medium‑high‑viscosity thermal‑conductive AB glue (paste‑type, requiring combined stirring and vacuum). Corresponding defoaming modes are matched for different viscosities to guarantee satisfactory defoaming performance. |
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Equipment Supporting Instructions
SIENOX AB‑glue defoaming solution can cooperate with other equipment to form a complete potting process chain
SIENOX AB‑glue defoaming solution can cooperate with other equipment to form a complete potting process chain: Integrated stirring & defoaming: MIX‑series stirring defoaming machines mix AB glue and perform synchronous defoaming under vacuum, finishing mixing and debubbling in one procedure. Temperature‑controlled defoaming: WK‑series temperature‑controlled defoaming machines conduct defoaming at set temperatures. Suitable for high‑viscosity AB glue to reduce viscosity by heating for higher defoaming efficiency. Defoaming & dispensing linkage: Connect directly to SIE‑301/302/303 dispensing machines for potting after defoaming, reducing new bubbles introduced by intermediate transfer steps. Pressurized fine defoaming: For scenarios requiring high defoaming rate, perform secondary fine defoaming with RX pressurized defoaming machine after stirring‑vacuum defoaming for higher defoaming efficiency. | ![]() |
Specifications
AB‑Glue Types and Equipment Selection Guide
| AB‑Glue Type | Typical Viscosity | Recommended Defoaming Method | Recommended Equipment |
| Low‑viscosity Epoxy AB Glue | 500‑3000cP | Centrifugal Defoaming / Vacuum Defoaming | C‑Series / ZK‑Series |
| Medium‑viscosity Epoxy AB Glue | 3000‑15000cP | Vacuum Defoaming / Vacuum Stirring‑Defoaming | ZK‑Series / MIX‑Series |
| High‑viscosity Thermal‑conductive AB Glue | 15000‑80000cP | Vacuum Stirring‑Defoaming | MIX‑Series |
| Paste‑like Thermal‑conductive AB Glue | >80000cP | Vacuum Stirring‑Defoaming + Pressurized Defoaming | MIX‑Series / RX‑Series |
| Transparent Potting AB Glue | 800‑5000cP | Vacuum Defoaming / Vacuum Stirring‑Defoaming | ZK‑Series / MIX‑Series |
| High‑temperature‑resistant AB Glue | Medium‑to‑high Viscosity | Vacuum Stirring‑Defoaming | MIX‑Series |
Our Partners
Trusted by leading industrial manufacturing clusters and advanced university laboratories worldwide
FAQ - Frequently Asked Questions
Answers to common questions about product performance and everyday process selection
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脱泡机的作用是什么?
脱泡机是一种用于去除液体中的气泡的设备。它的作用在于帮助生产过程中的液体混合、反应、涂布、印刷、灌注等工艺环节,避免气泡的产生和对最终产品的影响。在许多工业和实验室环境中,去除气泡是非常必要的,因为气泡可能会对产品质量产生负面影响,如影响表面张力和稳定性等问题。脱泡机通常采用各种不同的技术,如振动、超声波、离心等,以实现有效的气泡去除。它的应用领域广泛,包括但不限于半导体、太阳能、光学、生物技术、材料科学等。
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售后服务怎么样?
公司拥有专业的售后服务人员,24小时专人服务,一对一提供技术支持,解决您的后顾之忧。
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为什么要选择施诺斯?
选择施诺斯的原因有很多,以下是一些主要的原因:
1. 专业性:我们的团队由一群专业的人士组成,他们在各自的领域拥有丰富的经验和知识。我们不仅了解行业趋势和最佳实践,而且还能提供切实可行的解决方案。
2. 服务质量:我们注重客户的需求和满意度,始终致力于提供高质量的服务。我们不仅快速响应客户需求,而且还能根据客户的要求进行定制化服务。
3. 可靠性:我们以诚信和专业精神为宗旨,始终遵守承诺和协议。我们的工作方法和交付成果均符合行业标准和最佳实践,使得我们的客户能够信任我们。
4. 创新性:我们不断探索新的方法和工具,以提供更好的服务并满足客户的需求。我们鼓励创新和实验,并愿意接受挑战和改变。
5. 成本效益:我们提供高性价比的服务,不仅能够帮助客户节省成本,而且还能提高效率和生产力。我们始终以客户的利益为出发点,为客户提供最优的解决方案。
6. 团队合作:我们相信团队的力量和合作的价值,我们的团队成员之间互相支持、协作和尊重。我们与客户、合作伙伴和其他利益相关者建立紧密的合作关系,以实现共同的目标。
以上只是选择我们的部分原因,我们相信还有很多其他的优点和价值可以为客户提供。如果您正在寻找一家专业、可靠、高质量的服务提供商,我们非常期待与您的合作。
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搅拌脱泡机的工作原理?
施诺斯搅拌脱泡机通过公转的离心力进行脱泡,通过公转与自转形成的剪切力进行搅拌,
再辅助以真空泵抽取气体以达到真空状态,去除纳米级微小气泡。 不接触物料,无二次污染,无二次浪费。
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施诺斯能提供工程咨询技术服务吗?
施诺斯能为广大客户提供全面的工程和现代化的咨询服务。施诺斯近二十年的搅拌经验,可以为你提供高效的咨询服务。
想要让搅拌机性能更上一层楼,提升系统的整体效能?我们有全面的咨询、工程以及现代化改造服务,为您量身打造解决方案。 在如今竞争激烈的全球化浪潮中,唯有不断创新、持续优化,才能始终跑在对手前面。您的生产工艺和产品日新月异,我们就为您提供最适配的混合技术。不管是新的产品参数,还是既有的工艺条件,我们都能对现有系统和搅拌设备进行全方位的检查与评估,挖掘其中潜藏的流程优化空间和机械性能提升潜力,并且帮您把这些改进切实落地。 要是您的搅拌设备已经跟不上时代步伐,能耗居高不下,或是维护成本让您头疼不已,那就别犹豫,我们的咨询、工程设计和现代化改造服务,就是为您排忧解难的良方。欢迎随时联系我们,携手开启高效生产新征程!
Technical Specification List
Full‑line standardized specifications for accurate process evaluation and equipment selection
| AB‑Glue Type | Typical Viscosity | Recommended Defoaming Method | Recommended Equipment |
| Low‑viscosity Epoxy AB Glue | 500‑3000cP | Centrifugal Defoaming / Vacuum Defoaming | C‑Series / ZK‑Series |
| Medium‑viscosity Epoxy AB Glue | 3000‑15000cP | Vacuum Defoaming / Vacuum Stirring‑Defoaming | ZK‑Series / MIX‑Series |
| High‑viscosity Thermal‑conductive AB Glue | 15000‑80000cP | Vacuum Stirring‑Defoaming | MIX‑Series |
| Paste‑like Thermal‑conductive AB Glue | >80000cP | Vacuum Stirring‑Defoaming + Pressurized Defoaming | MIX‑Series / RX‑Series |
| Transparent Potting AB Glue | 800‑5000cP | Vacuum Defoaming / Vacuum Stirring‑Defoaming | ZK‑Series / MIX‑Series |
| High‑temperature‑resistant AB Glue | Medium‑to‑high Viscosity | Vacuum Stirring‑Defoaming | MIX‑Series |
Multi‑Industry Solutions
Covering stirring and debubbling applications of typical materials across six major industries
Adhesive R&DEpoxy structural adhesives, sealants, hot‑melt adhesives, pressure‑sensitive adhesives, modified adhesives |
Precision Electronic AssemblyUnderfill adhesives, conductive adhesives, die‑attach adhesives, dispensing adhesives, chip bonding adhesives |
BiosensorsPotting adhesives, reagent immobilization materials, microfluidic bonding adhesives, biocompatible adhesives, sensor sealants |
Microelectronic PackagingPackaging epoxy adhesives, molding compounds, lead bonding adhesives, substrate bonding adhesives, passivation layer materials |
Functional CoatingsHydrophobic coatings, conductive coatings, insulating coatings, anti‑corrosion coatings, wear‑resistant coatings |
Electronic PastesSilver paste, copper paste, carbon paste, resistor paste, dielectric paste |
Comprehensive Equipment Operation Demo Videos
Gain intuitive, clear, dynamic insight into synchronous defoaming with planetary centrifugal force and high negative pressure.
Measured Defoaming‑Process Performance
Measured Processing Results for Six Typical Materials
Paste‑Like Materials |
Adhesive with Powder Fillers |
Polymer Materials |
Pharmaceutical Gels |
Silver Paste Materials |
Battery Slurries |
Operating Precautions
| Material Type | Pre‑treatment Status |
| Silver Paste | Weigh A/B components of AB glue accurately by ratio before mixing and defoaming. Incorrect ratio will impair curing performance. |
| Stirring Speed | Control stirring speed during vacuum stirring‑defoaming. Excessively high speed may generate new vortex bubbles. |
| Time Control | Complete defoaming and dispensing within pot‑life after AB‑glue mixing. Adhesive will thicken and cure beyond time limit. |
| Vacuum Defoaming | Release pressure slowly after vacuum defoaming to prevent adhesive foaming caused by rapid decompression. |
| Temperature Control | For higher efficiency, heat high‑viscosity AB glue to 40‑60℃ properly to reduce viscosity before defoaming. |
* Internal lab test data. Actual improvement varies with material formula. Contact sales for real customer cases.












