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Pressurized Debubbling Machine SIE‑RX10‑1800
Extended‑length Chamber for Bulk Loading · Stable Temperature for Non‑stop Production Without Capacity Loss
50% Higher Loading Capacity Than Standard Model + 5‑min Heating for Continuous Operation with ±3℃ Temp Deviation + Three Modes & Precision Filtration for Clean Processing
SINOS SIE‑RX10‑1800 Pressurized Debubbling Machine adopts φ1000×1800 mm extended cylindrical chamber of approx.1410L, delivering 50% higher loading capacity versus standard version. It reaches 60℃ within 5 min during continuous operation with internal temperature deviation of ±3℃. Three selectable operation modes. SMC digital pressure gauge achieves ±0.01 MPa accuracy, and Omron PID temperature control reaches ±1.0 ℃. It eliminates lamination‑induced bubbles by pressure and temperature to strengthen interfacial bonding force.
✓ CE Certification ✓ FC Certification ✓ ISO9001 Quality System ✓ RoHS Compliance ✓ Custom‑voltage support (110V/220V)
Why Must Microbubbles in Materials Be Eliminated?
Residual micro‑bubbles degrade end‑product quality directly
Large‑size Touch Screen Lamination IndustryDuring full lamination of large‑size touch screens, large‑area OCA optical adhesive generates massive bubbles, resulting in large‑area display defects and high return‑loss risks. The 1800 mm extended chamber of pressurized debubbler accommodates larger touch screens and processes multiple medium‑to‑large‑size panels in one batch. SMC precise pressure control ensures uniform stress across large lamination areas, ideal for mass‑production debubbling of large‑size touch‑screen lamination. | Battery Slurry IndustryBubbles in lithium‑battery slurry impair coating uniformity and battery safety performance. Stable debubbling is required for consistent batch quality in continuous mass production. The 1800 mm extended chamber processes large quantities of battery‑slurry containers in a single run. Resistive heating reaches 60 ℃ within 5 minutes during continuous operation with ±3 ℃ internal temperature deviation for long‑run thermal stability, suitable for continuous mass debubbling of battery slurry. | Conductive Silver Paste IndustryBubbles inside conductive silver paste break conductive paths and raise resistance. Stable debubbling is essential to guarantee conductivity for mass production. Three selectable operation modes support simultaneous or sequential heating‑pressurization based on silver paste properties. The extended chamber boosts throughput by processing multiple barrels of conductive silver paste at once, and the precision filter prevents secondary contamination, perfect for continuous mass debubbling of conductive silver paste. |
✨ Standard chambers feature insufficient loading capacity for continuous mass production, requiring frequent batch processing and queuing that reduce overall throughput. Ordinary devices suffer from slow temperature recovery after long‑time operation, resulting in unstable debubbling performance. Without stable temperature and precise pressure control, conventional equipment fails to deliver consistent quality across batches during continuous production.
Why Choose SIE‑RX10‑1800
Solve Capacity & Quality Pain Points for Mass Continuous Production
Extended Chamber for Bulk‑volume LoadingThe extended cylindrical chamber delivers approx. 1410L capacity, with 50% longer chamber length compared with the standard 1200 mm model for higher loading capacity. For continuous mass‑production tasks, the extended chamber processes more products or larger‑size workpieces in one cycle to reduce batch‑splitting times and greatly improve throughput. It fits continuous debubbling for large‑size touch screens, multi‑barrel slurries and bulk conductive silver paste. | Stable Temperature Control for Continuous OperationResistive heating reaches 60℃ within about 5 minutes under continuous operation, with an internal temperature deviation of ±3℃ (empty‑chamber test after stabilization). During continuous mass production, chamber temperature recovers rapidly after each loading‑unloading cycle. Debubbling performance of subsequent batches will not be compromised by temperature drop, ensuring stable quality for long‑run continuous production. | Multi‑mode Compatibility & Precision FiltrationThree operation modes adapt to diverse material processes. One single machine handles multiple materials including touch‑screen OCA adhesive, battery slurry and conductive silver paste. The precision filter avoids secondary material contamination and maintains product cleanliness during mass processing. Multi‑mode compatibility enables one equipment to serve multiple production lines and boost equipment utilization rate. |
✨ If you require an extended‑length chamber for higher throughput and stable temperature control for continuous mass production, RX10‑1800’s extended chamber and consistent thermal performance enable your high‑efficiency volume manufacturing
Working Principle
Remove bubbles generated during lamination by pressure and temperature to enhance bonding strength between different materials.
Step 1: Pressurization & Temperature Rise (Three Modes Optional) Step 2: Pressure‑holding Debubbling Step 3: Pressure Relief & Stabilization Three simple steps: Pressurization & Temperature Rise → Pressure‑holding Debubbling → Pressure Relief & Stabilization, eliminate lamination bubbles and improve bonding strength. |  |
Technical Specifications
Complete Technical Specifications Overview, Customizable on Demand
| Model | SIE‑RX10‑1800 |
| Chamber Size | φ1000×1800mm (Cylindrical) |
| Effective Volume | Approx. 1410L |
| Working Pressure | 0~0.8MPa (Standard), 0~2.5MPa (Optional) |
| Working Temperature | Ambient ~80℃ (Standard), Ambient ~180℃ (Optional) |
| Heating Method | Resistive Heating |
| Operation Modes | A. Pressurize First Then Heat B. Simultaneous Heating & Pressurization C. Heat First Then Pressurize |
| Control Mode | Microcomputer Control |
| Vessel Material | S30408 Stainless Steel or Carbon Steel |
| Overall Dimension(W×D×H) | Approx. 1300×2100×2000mm (Subject to actual product) |
| Net Weight | 2000 kg |
| Certifications | CE, FC, ISO9001, RoHS Compliance |
Our Partners
Trusted by leading industrial manufacturing clusters and advanced university laboratories worldwide
FAQ - Frequently Asked Questions
Answers to common questions about product performance and everyday process selection
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脱泡机的作用是什么？
脱泡机是一种用于去除液体中的气泡的设备。它的作用在于帮助生产过程中的液体混合、反应、涂布、印刷、灌注等工艺环节，避免气泡的产生和对最终产品的影响。在许多工业和实验室环境中，去除气泡是非常必要的，因为气泡可能会对产品质量产生负面影响，如影响表面张力和稳定性等问题。脱泡机通常采用各种不同的技术，如振动、超声波、离心等，以实现有效的气泡去除。它的应用领域广泛，包括但不限于半导体、太阳能、光学、生物技术、材料科学等。
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售后服务怎么样？
公司拥有专业的售后服务人员，24小时专人服务，一对一提供技术支持，解决您的后顾之忧。
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为什么要选择施诺斯？
选择施诺斯的原因有很多，以下是一些主要的原因：
1. 专业性：我们的团队由一群专业的人士组成，他们在各自的领域拥有丰富的经验和知识。我们不仅了解行业趋势和最佳实践，而且还能提供切实可行的解决方案。
2. 服务质量：我们注重客户的需求和满意度，始终致力于提供高质量的服务。我们不仅快速响应客户需求，而且还能根据客户的要求进行定制化服务。
3. 可靠性：我们以诚信和专业精神为宗旨，始终遵守承诺和协议。我们的工作方法和交付成果均符合行业标准和最佳实践，使得我们的客户能够信任我们。
4. 创新性：我们不断探索新的方法和工具，以提供更好的服务并满足客户的需求。我们鼓励创新和实验，并愿意接受挑战和改变。
5. 成本效益：我们提供高性价比的服务，不仅能够帮助客户节省成本，而且还能提高效率和生产力。我们始终以客户的利益为出发点，为客户提供最优的解决方案。
6. 团队合作：我们相信团队的力量和合作的价值，我们的团队成员之间互相支持、协作和尊重。我们与客户、合作伙伴和其他利益相关者建立紧密的合作关系，以实现共同的目标。
以上只是选择我们的部分原因，我们相信还有很多其他的优点和价值可以为客户提供。如果您正在寻找一家专业、可靠、高质量的服务提供商，我们非常期待与您的合作。
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搅拌脱泡机的工作原理？
施诺斯搅拌脱泡机通过公转的离心力进行脱泡，通过公转与自转形成的剪切力进行搅拌，
再辅助以真空泵抽取气体以达到真空状态，去除纳米级微小气泡。 不接触物料，无二次污染，无二次浪费。
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施诺斯能提供工程咨询技术服务吗？
施诺斯能为广大客户提供全面的工程和现代化的咨询服务。施诺斯近二十年的搅拌经验，可以为你提供高效的咨询服务。
想要让搅拌机性能更上一层楼，提升系统的整体效能？我们有全面的咨询、工程以及现代化改造服务，为您量身打造解决方案。 在如今竞争激烈的全球化浪潮中，唯有不断创新、持续优化，才能始终跑在对手前面。您的生产工艺和产品日新月异，我们就为您提供最适配的混合技术。不管是新的产品参数，还是既有的工艺条件，我们都能对现有系统和搅拌设备进行全方位的检查与评估，挖掘其中潜藏的流程优化空间和机械性能提升潜力，并且帮您把这些改进切实落地。 要是您的搅拌设备已经跟不上时代步伐，能耗居高不下，或是维护成本让您头疼不已，那就别犹豫，我们的咨询、工程设计和现代化改造服务，就是为您排忧解难的良方。欢迎随时联系我们，携手开启高效生产新征程！
Multi‑Model Specification Comparison Table
Compare Models in the Same Series for Accurate Selection
| Model | SIE‑RX6‑900 | SIE‑RX8‑1200 | SIE‑RX10‑1800 |
| Chamber Size | φ600×900mm | φ800×1200mm | φ1000×1800mm |
| Effective Volume | 255L | 600L | 1410L |
| Pressure Range | 0~2.5MPa(Optional) | 0~2.5MPa(Optional) | 0~2.5MPa(Optional) |
| Temperature Range | Ambient ~180℃(Optional) | Ambient ~180℃(Optional) | Ambient ~180℃(Optional) |
| Pressure Accuracy | ±0.01MPa | ±0.01MPa | ±0.01MPa |
| Temperature Control Accuracy | ±1.0℃ | ±1.0℃ | ±1.0℃ |
| Power Supply | 380V, 50/60Hz (Customizable for 110V US/JP standard) | 380V, 50/60Hz (Customizable for 110V US/JP standard) | 380V, 50/60Hz (Customizable for 110V US/JP standard) |
| Overall Dimension(W×D×H) | 610 × 560 × 780 mm | 610 × 560 × 780 mm | 1300×2100×2000mm |
| Net Weight | 163 kg | 2000 kg | 3000 kg |
| Certifications | CE, FC | CE, FC | CE, FC |
***Above are typical models. Customized solutions are available upon customer requirements.
Multi‑Industry Solutions
Covering stirring and debubbling applications of typical materials across six major industries
LCD Polarizer LaminationSmall‑size polarizer OCA optical adhesive, lamination adhesive for LCD glass substrate |
Electronic Component EncapsulationComponent encapsulant, chip potting adhesive |
Medical DevicesMedical bonding adhesive, medical device lamination adhesive |
LED EncapsulationLED encapsulant, phosphor paste |
Fine ChemicalsFine chemical materials, nano‑powders |
New Energy MaterialsR&D samples of new energy materials, battery slurry samples |
Comprehensive Equipment Operation Demo Videos
Gain intuitive, clear, dynamic insight into synchronous defoaming with planetary centrifugal force and high negative pressure.
Actual‑test Performance Demonstration
Measured Processing Results for Six Typical Materials
Slurry + Powder |
Adhesive |
Hydrogen Energy Materials |
Adhesive |
Substrate + Filler |
Adhesive + Ceramic Powder |
Actual‑test Effect Comparison
Comparison of Material Status Before and After Pressurized Debubbling
| Material Type | Pre‑treatment Status | After SIE‑RX10‑1800 Treatment |
| Polarizer OCA Optical Adhesive | Plenty of internal bubbles, mottling & uneven light transmission after lamination | Bubble‑free transparent adhesive with uniform light transmission after lamination |
| Component Encapsulant | Dense inner bubbles, voids occur in encapsulation layer after curing | Dense void‑free adhesive for complete and reliable encapsulation layer |
| Medical Bonding Adhesive | Internal bubbles cause bonding‑surface defects and degrade biocompatibility | Dense adhesive with intact bonding surface and qualified biocompatibility |
* Internal lab test data. Actual improvement varies with material formulation. Contact sales for real‑world customer cases.
