The silver glue degassing machine is evolving from auxiliary equipment in packaging and testing lines into a quality checkpoint that determines product yield. On the evening of September 9, Kaifa disclosed that its subsidiary, Peiton Technology, plans to invest 1.85 billion yuan in an expansion project for high-end memory chip packaging and testing capacity, marking its first entry into the field of 2.5D/3DS advanced packaging. Calculations show the new plant can support a monthly capacity of 90,000 wafers for traditional packaging and testing and 10,000 wafers for 2.5D advanced packaging. The project is scheduled to be completed in December 2028. This large investment in packaging and testing highlights the link between advanced packaging expansion and material processing technology.

One key difference between advanced packaging and traditional packaging lies in the complexity of material systems. 2.5D/3DS packaging extensively uses conductive adhesives such as silver glue and underfill, which provide electrical connection and stress buffering. Residual bubbles in the adhesive layer will form voids, directly impairing interconnection reliability and even causing delamination failure of chips during operating temperature cycling. Therefore, degassing treatment of adhesives before dispensing directly determines the long-term stability of packages.

The degassing performance depends on whether the stirring method can enable tiny bubbles within high-viscosity adhesives to fully rise and escape. A common industrial solution is planetary stirring combined with vacuum conditions: materials are subjected to uniform shear under the combined motion of revolution and rotation, while vacuum negative pressure reduces internal pressure of bubbles for easier rupture and release. Sinos vacuum degassing mixer is designed following this technical route. By combining planetary revolution and rotation with vacuum environment, it achieves more uniform dispersion and lower gas content when processing high-viscosity materials like silver glue and underfill, suitable for small-batch laboratory verification and production pilot tests.

Signals from the demand side are equally clear. Kaifa’s project plan includes a monthly capacity of 10,000 wafers for 2.5D advanced packaging, and advanced packaging has significantly higher requirements for adhesive consumption and quality than traditional packaging. It can be anticipated that as more packaging and testing factories expand production, the processing volume of silver glue degassing will increase accordingly. For material suppliers and packaging & testing enterprises, selecting equipment with stable degassing performance is often more cost-effective than repairing bubble defects afterwards.

The capacity expansion pace of the packaging and testing industry is accelerating, driving upgrades in material processing techniques. The degassing process is growing more critical for silver glue, underfill and other high-viscosity packaging materials. Equipment suppliers that closely match practical process requirements and deliver reliable planetary vacuum degassing solutions will have opportunities to capture more supporting market share in this capacity expansion cycle.