SIENOX conductive silver paste defoaming solution tackles air entrapment and agglomeration for high-solid silver paste loaded with silver powder. Synchronous stirring, defoaming and dispersion under vacuum delivers dense printed circuits with consistent sheet resistance, lowering open circuits, pinholes and scrap rates.
SIENOX conductive carbon paste defoaming solution solves the problem of agglomeration and air entrapment for carbon paste filled with graphite and carbon black. Synchronous stirring, defoaming and dispersion under vacuum achieves uniform thickness of printed carbon films and consistent resistance, and minimizes pinholes and resistance drift.
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