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A "no-bubble" package for "cold form" chips: SIENOX protects critical layers in chip packaging
date:2026-11-10author:小施November 9th, the first day of the tenth lunar month, marks the Cold Clothes Festival.
When the cold weather arrives, people think of their departed loved ones. In ancient times, families would cut paper into clothes and burn them in front of their doors on this day, known as "sending cold clothes". May those in the other world also have extra garments to shield them from wind and frost. Together with the Qingming Festival and Zhongyuan Festival, the Cold Clothes Festival embodies the simple longing of the Chinese people: unspoken words are all sewn into the clothes.
Clothes serve as a barrier against cold and a close guardian. This logic also applies to the industrial world.
Chips and electronic components each have their own "clothes" — encapsulation adhesives and potting compounds. This adhesive layer blocks moisture, salt spray, dust and chemical corrosion, protecting the delicate circuits inside. Yet this "clothing" fears one thing most: air bubbles. Bubbles trapped inside the adhesive layer are just like holes and pinholes on the garment. Moisture seeps through these gaps, causing degraded insulation, metal corrosion and cracked solder joints. No matter how sophisticated the component is, it cannot withstand long-term erosion.

What SIENOX does is to stitch this "cold garment" tightly without gaps.
In a vacuum environment, bubbles inside the adhesive expand, rise and escape under pressure difference. Combined with planetary rotation and revolution stirring, high-viscosity adhesive is continuously turned and kneaded, leaving nowhere for bubbles to hide and delivering fine and uniform colloid. Bubble-free encapsulation adhesive cures into a seamless dense layer, which can effectively resist cold waves and moisture.
Semiconductor encapsulation adhesive: Thorough bubble removal for stable sealing and insulation reliability;
Epoxy resin potting: Denser adhesive layer with reliable cold resistance, moisture resistance and crack resistance;
Electronic adhesives: Fine bubble-free colloid for smooth dispensing and stronger bonding;
New energy battery pack potting: Comprehensive protection to guarantee safety and service life under low-temperature conditions.
The Cold Clothes Festival is about sending garments and cherishing memories; industrial potting is about applying adhesive and upholding quality. A bubble-free "cold garment" is the most practical protection we can provide for electronic components.
As the weather turns cold, remember to remind elderly family members to keep warm and give them a call. May every chip and battery be well protected this winter.
Wishing all customers, partners and your families peace and warmth in winter on the Cold Clothes Festival.
Guangzhou SIENOX Technology Co., Ltd.
November 9, 2026