Taiwan broke ground on a new advanced packaging industrial park in Kaohsiung in the south. TSMC will build technology verification laboratories and talent training centers within the park, and 2.5D and 3D advanced packaging production lines will be deployed in the park in the future. The concentrated construction of advanced packaging capacity has significantly raised attention to the demand for packaging material processing equipment such as silver paste defoaming machines.

AI computing power demand drives continuous expansion of advanced packaging capacity, and TSMC’s advanced packaging capacity such as CoWoS has been in long-term shortage. The centralized construction of packaging infrastructure in the form of industrial parks can not only accelerate capacity rollout, but also facilitate the matching of materials, equipment and human resources. For packaging material suppliers, the capacity release of the park means more predictable order expectations, while requirements for batch consistency and process stability of materials will also increase accordingly.

Silver paste and underfill are high-viscosity packaging materials. Bubble control before application is directly related to packaging yield. Residual bubbles in the adhesive layer may expand into voids during subsequent thermal cycles, resulting in interconnection failure or delamination. Larger-area 2.5D and 3D packaging impose higher requirements on adhesive layer uniformity, so the material defoaming step has become an indispensable part of the packaging process. SIENOX silver paste defoaming machine combines planetary revolution & rotation motion with vacuum environment. Materials obtain revolutionary centrifugal force and rotational shear force inside the container at the same time. Combined with vacuum negative pressure to facilitate bubble discharge, it is suitable for mixing and defoaming treatment of high-viscosity packaging materials such as silver paste and underfill, covering multiple stages from laboratory formula verification to pilot production.

From the perspective of industrial rhythm, the capacity expansion of advanced packaging is a global trend. Amkor has multiple layouts in the United States and South Korea, and advanced packaging projects of domestic packaging and testing enterprises are also being launched one after another. The construction cycle of packaging capacity is relatively long, and the supporting demand for material processing equipment will be gradually released along with production line commissioning and mass production ramp-up.

The park-based construction of advanced packaging is accelerating, and the importance of the packaging material processing segment keeps rising. With the launch of projects including TSMC Kaohsiung Packaging Park, the defoaming demand for high-viscosity materials such as silver paste and underfill will grow further. Equipment manufacturers with planetary vacuum defoaming capability will gain more opportunities in the process upgrade of packaging materials.