浆料脱泡机
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焊锡膏脱泡机
解决焊锡膏气泡与飞溅・焊点饱满、少锡珠、印刷稳定
真空脱泡减少印刷气泡 + 不改变助焊剂体系 + 小批量灵活
施诺斯焊锡膏脱泡方案针对 SMT 焊锡膏搅拌后裹气、印刷塌陷、焊接飞溅锡珠的问题,在真空下脱泡,让焊锡膏印刷稳定、焊点饱满,减少锡珠与虚焊。
✓ CE认证 ✓ ISO9001质量体系 ✓ RoHS符合性 ✓ 支持电压定制(110V/220V)
为什么需要焊锡膏脱泡机
SMT 印刷焊锡膏搅拌后裹气,印刷到 PCB 上出现塌陷、拉丝、针孔,影响印刷图形完整性与贴片良率。 | 焊接飞溅锡珠回流焊时膏体气泡受热膨胀炸裂,产生锡珠飞溅,造成短路、立碑等焊接缺陷,返修成本高。 | 精密电子组装精密 SMT、底部填充对焊点一致性要求高,气泡与膏体不均直接影响焊点可靠性。 |
✨ 传统困境:锡膏搅拌后裹气,回流炸锡珠;手工脱泡又怕改变助焊剂活性——需要温和真空脱泡。
为何选择施诺斯焊锡膏脱泡方案
减少锡珠飞溅真空脱除膏体气泡,回流时减少炸锡、锡珠飞溅,焊点饱满。 | 不变助焊剂体系温和非接触脱泡,不改变助焊剂活性与锡膏印刷性能。 | 小批量灵活C/ZK 支持小批量打样与换色,批量用 MIX 系列,印刷稳定复现。 |
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设备配套说明
设备配套工艺链路 树脂 + 粉体称量 → 真空搅拌混合脱气 → 出料压坯 / 浇注 → 固化 / 烧结。 | ![]() |
规格参数
选型指南
| 焊锡膏应用 | 典型状态 | 推荐脱泡方式 | 推荐设备 |
| 小批量 / 打样 | 少量锡膏 | 离心 / 真空脱泡 | C系列 / ZK系列 |
| 常规 SMT 锡膏 | 高粘度膏状 | 真空脱泡 | MIX60 |
| 精密组装 / 底部填充 | 高粘度膏状 | 真空搅拌脱泡 | MIX系列 / MIX1000plus |
| 高要求焊点 | 高粘度 | 真空搅拌+加压精脱 | MIX1000plus / RX系列 |
Our Partners
Trusted by leading industrial manufacturing clusters and advanced university laboratories worldwide
FAQ - Frequently Asked Questions
Answers to common questions about product performance and everyday process selection
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What is the working principle of a centrifugal defoaming machine?
Principle of centrifugal defoaming machine: The bubbles are released by the downward principle of gravity.
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How is the after-sales service?
The company has professional after-sales service personnel, 24-hour dedicated service, and one-on-one technical support to solve your worries.
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Why choose SIENOX?
There are many reasons for choosing SIENOX, and the following are some of the main reasons:
1. Professionalism: Our team consists of a group of professional individuals with rich experience and knowledge in their respective fields. We not only understand industry trends and best practices, but also provide practical and feasible solutions.
2. Service quality: We focus on customer needs and satisfaction, and are always committed to providing high-quality services. We not only respond quickly to customer needs, but also provide customized services according to their requirements.
3. Reliability: We adhere to the principles of integrity and professionalism, always adhering to commitments and agreements. Our work methods and deliverables comply with industry standards and best practices, enabling our clients to trust us.
4. Innovation: We continuously explore new methods and tools to provide better services and meet customer needs. We encourage innovation and experimentation, and are willing to accept challenges and change.
5. Cost effectiveness: We provide cost-effective services that not only help customers save costs, but also improve efficiency and productivity. We always prioritize the interests of our customers and provide them with the best solutions.
6. Teamwork: We believe in the power and value of teamwork, and our team members support, collaborate, and respect each other. We establish close cooperative relationships with customers, partners, and other stakeholders to achieve common goals.
The above are just some of the reasons for choosing us. We believe there are many other advantages and values that can be provided to customers. If you are looking for a professional, reliable, and high-quality service provider, we look forward to working with you.
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How does the stirring and defoaming machine work?
The SIENOX stirring and defoaming machine performs defoaming through centrifugal force at revolution and stirring through shear force formed by revolution and rotation,
Assisted by a vacuum pump to extract gas and achieve a vacuum state, removing nanoscale tiny bubbles. No contact with materials, no secondary pollution, and no secondary waste.
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What is the function of a defoaming machine?
A defoaming machine is a device used to remove bubbles from liquids. Its function is to assist in the liquid mixing, reaction, coating, printing, infusion and other process steps in the production process, avoiding the generation of bubbles and their impact on the final product. In many industrial and laboratory environments, removing bubbles is essential as they may have a negative impact on product quality, such as affecting surface tension and stability. Defoaming machines typically use various techniques such as vibration, ultrasound, centrifugation, etc. to achieve effective bubble removal. It has a wide range of applications, including but not limited to semiconductors, solar energy, optics, biotechnology, materials science, etc.
技术指标一览表
同系列型号参数对比,助力精准选型
| 焊锡膏应用 | 典型状态 | 推荐脱泡方式 | 推荐设备 |
| 小批量 / 打样 | 少量锡膏 | 离心 / 真空脱泡 | C系列 / ZK系列 |
| 常规 SMT 锡膏 | 高粘度膏状 | 真空脱泡 | MIX60 |
| 精密组装 / 底部填充 | 高粘度膏状 | 真空搅拌脱泡 | MIX系列 / MIX1000plus |
| 高要求焊点 | 高粘度 | 真空搅拌+加压精脱 | MIX1000plus / RX系列 |
多行业解决方案
覆盖六大行业典型材料搅拌脱泡应用
SMT 贴片PCB 贴片焊接 |
锡膏印刷钢网印刷、锡膏脱泡 |
精密组装精密电子、模组组装 |
底部填充Underfill 填充胶 |
锡膏生产焊锡膏研发、灌装 |
电子制造消费电子、汽车电子 |
全方位设备操作演示视频
脱泡工艺实测效果
六种典型材料实测处理效果
膏状材料 |
胶水+粉体 |
高分子材料 |
医药凝胶 |
银浆材料 |
电池浆料 |
使用注意事项
| 注意事项 | 操作说明 |
| 冷链回温 | 锡膏按工艺低温保存,使用前充分回温后再脱泡搅拌。 |
| 温和脱泡 | 控制转速与真空度,避免过度搅拌影响锡膏印刷性与助焊剂活性。 |
| 缓慢泄压 | 脱泡后缓慢开盖泄压,防止膏体反泡。 |
| 及时使用 | 脱泡后尽快印刷,避免锡膏重新吸潮或返粗。 |
* 内部实验室测试数据,具体效果因锡膏配方与焊接工艺而异。真实客户案例可联系销售获取。
客户交付与应用案例
扎根制造一线,赋能各大行业标杆产线与国家重点研究机构
消费电子行业胶水材料解决方案 |
广东某电子企业采购施诺斯真空斯搅拌脱泡机 |
工业大学涂膜材料脱泡解决方案 |















