JCET recently announced a plan to issue shares to specific targets to raise no more than 6.5 billion yuan, ramping up investment in high-performance computing advanced packaging. The four fundraising projects plus supplementary working capital involve a total investment exceeding 9.5 billion yuan. Meanwhile, ASE has raised its 2026 capital expenditure to approximately 10.5 billion US dollars, of which around 6.5 billion US dollars will be allocated to advanced packaging-related equipment. The intensive expansion of advanced packaging capacity is boosting procurement demand for upstream material processing equipment, and vacuum degassing mixers for semiconductor packaging have become key supporting equipment in packaging line expansion.

In advanced packaging processes, residual bubbles in high-viscosity materials such as silver adhesive, red adhesive, underfill and solder paste before coating and bonding will directly create void defects and compromise packaging reliability. With rising penetration of Chiplet and 2.5D/3D packaging, packaging factories keep tightening requirements on degassing precision and batch consistency for equipment including silver glue degassing machines and solder paste mixing degassing machines. Vacuum degassing has become standard configuration for capacity expansion.

JCET’s Lingang automotive electronics factory was put into production in March this year, and another 7.8 billion-yuan new construction project in Lingang is planned. This round of 6.5 billion-yuan private placement further clarifies the capacity expansion direction for high-performance computing advanced packaging. Rising capital expenditure by leading packaging and testing factories usually triggers equipment procurement cycles across the whole supply chain. As one of the core equipment for packaging material processing, vacuum degassing mixers directly benefit from demand elasticity.

For packaging factories and upstream material enterprises, when selecting vacuum degassing mixers for semiconductor packaging, comprehensive evaluation shall be conducted on vacuum degree, rotational speed control precision, explosion-proof and cleanliness grades, programmed formula management and other factors, together with verification linked to packaging process yield data. Sinos provides the MIX1000 vacuum degassing mixer tailored for semiconductor packaging scenarios, capable of meeting degassing requirements of high-viscosity materials such as silver glue and solder paste. For information about vacuum degassing mixer manufacturers and vacuum degassing mixer prices, inquiries are recommended to manufacturers according to specific capacity specifications.

Advanced packaging expansion is one of the relatively certain capital expenditure themes in the semiconductor equipment chain in 2026. Though vacuum degassing mixers are auxiliary equipment, they directly affect packaging yield and reliability. As high-performance computing and AI chips rely more heavily on advanced packaging, demand in this segment is expected to shift from capacity-expansion-driven to process-upgrade-driven. Products with cleanliness adaptability, high-viscosity processing and digital capabilities will become mainstream choices for packaging production line renewal and upgrading.