Applied Materials recently discussed the challenges of large-size panel-level packaging with China Electronics News, stating that glass-based panel-level packaging is expected to boost substrate area utilization from approximately 45% for 300 mm wafers to 81%. However, three hurdles — process stability, defect detection sensitivity and heterogeneous material compatibility — must be overcome to achieve large-scale commercialization. Advances in the industrialization of panel-level packaging are raising process requirements for packaging material processing equipment such as silver glue degassing machines.

Compared with traditional wafer-level packaging, panel-level packaging uses square glass substrates instead of round silicon wafers. Featuring larger substrate dimensions and lower cost per unit area, it is regarded as a key direction for the iteration of advanced packaging. Nevertheless, glass substrates are inherently brittle, and there are substantial differences in thermal expansion coefficients among glass, organic films and copper wiring, imposing stricter requirements on the compatibility of packaging materials. Industry forecasts indicate that the next three to five years will constitute a critical window for panel-level packaging to transition from concept to mass production.

The processing precision of packaging materials directly affects the reliability of panel-level packages. High-viscosity materials including silver glue and underfill serve for electrical interconnection and stress buffering. Residual air bubbles inside the adhesive layer may expand into voids during thermal cycling, resulting in interconnection failure or delamination. Larger substrate areas mean greater losses caused by bubble defects, which places more stringent demands on material degassing. The silver glue degassing machine from Sinos adopts planetary motion combining revolution and rotation under vacuum conditions. When processing high-viscosity materials such as silver glue and underfill, it delivers more uniform dispersion and lower gas content. It supports small-batch laboratory verification and pilot production, providing process support for packaging materials from formulation development to mass production rollout.

From the perspective of industrial chain trends, the advanced packaging sector is undergoing capacity expansion. High-end packaging lines of domestic packaging and testing enterprises have been launched one after another, driving synchronized growth in demand for packaging materials and supporting equipment. Whether for packaging based on conventional organic substrates or glass-based panel-level packaging currently in ramp-up, material degassing remains an indispensable step to guarantee packaging yield.

Technological evolution in advanced packaging is elevating the importance of material processing equipment. As emerging technologies such as panel-level packaging gradually scale up, demand for degassing of high-viscosity packaging materials like silver glue and underfill will keep rising. Equipment manufacturers with stable planetary vacuum degassing capabilities will gain more opportunities amid the process upgrading of advanced packaging materials.