Vacuum Planetary Mixing Defoamer
TEL:18925129293
SIENOX Vacuum Mixer‑Defoamer SIE‑MIX60
Standard Vacuum Defoaming Module · Planetary Mixing Combined With Vacuum Negative Pressure — In‑Depth Removal of Nano‑Scale Bubbles
300 mL Laboratory Capacity + Built‑in Vacuum System + 0‑3000 rpm Stepless Speed Adjustment
SIENOX SIE‑MIX60 is a 300 mL planetary mixer‑defoamer equipped with standard ‑98 kPa vacuum module, specially developed for laboratory R&D scenarios requiring vacuum‑assisted defoaming. Integrated with vacuum system based on planetary mixing‑defoaming capability, it enables synchronous mixing and vacuum defoaming. Nano‑scale microbubbles that cannot be eliminated merely by centrifugal force can be removed within one processing cycle.
✓ CE Certified ✓ FC Certified ✓ ISO9001 Quality Management System ✓ RoHS Compliance ✓ Customizable Voltage (110V/220V available)
Why eliminate micro‑bubbles inside materials?
Residual nanoscale micro‑bubbles in materials compromise the accuracy of experimental data and degrade end‑product performance.
Adhesive R&D and ProductionMicro‑bubbles in epoxy structural adhesives weaken bonding strength and compromise accuracy of mechanical‑property test data. Bubbles in sealants cause sealing failure after curing and trigger leakage during pressure‑resistance tests. During adhesive R&D, test deviations induced by bubbles may lead to misjudgment in formula screening and extend R&D cycles. | Precision Electronic AssemblyMicro‑bubbles in chip underfill form voids after reflow soldering and impair device reliability. Bubbles inside conductive adhesives break conductive paths and result in electronic‑component failure. Bubbles within adhesives for dispensing processes bring uneven glue volume, hurting assembly precision and product consistency. | Biosensor ManufacturingBubbles in biosensor‑encapsulation adhesives undermine stability of sensor‑signal transmission and cause fluctuation of test readings. Bubbles in reagent‑immobilization materials trigger uneven distribution of bio‑active substances and degrade sensor‑response consistency. Bubbles in microfluidic‑chip bonding adhesives may block or leak flow channels and reduce detection accuracy. |
✨ Limitations of conventional equipment: Ordinary planetary mixer‑degassers remove bubbles via centrifugal force, yet perform poorly against nanoscale micro‑bubbles and deep‑trapped bubbles inside high‑viscosity media. The vacuum mixing‑degassing solution applies ‑98 kPa negative pressure while planetary mixing proceeds. The pressure differential inflates micro‑bubbles so they escape, delivering deep‑level degassing unachievable by centrifugal‑only mixing.
Why choose the SIE‑MIX60?
Three core features tailored for laboratory vacuum‑degassing R&D
Deep‑Layer Vacuum DegassingThe MIX60ZK comes standard with a ‑98 kPa vacuum system, enabling vacuum degassing without extra options. While planetary mixing generates centrifugal force to eliminate large bubbles, vacuum negative pressure further removes nano‑scale micro‑bubbles and deep‑seated bubbles that centrifugal force cannot handle. Combined with 3000 rpm high‑speed rotation, mixing and degassing run simultaneously. Deep‑layer degassing results are achieved in one single run, ideal for material R&D with strict bubble‑rate requirements. | Precision Small‑Sample ProcessingThe 300 mL capacity matches regular laboratory‑R&D consumption, meeting sample‑preparation demands while preventing material waste. Dual‑cup design enables simultaneous processing of two sample groups, suitable for comparative experiments and process validation. 100‑recipe storage saves parameters such as vacuum level, rotation speed and time with one‑click. Different vacuum‑degassing processes can be stored for various materials for easy recall and reproducibility, ensuring repeatable experimental data. | Reproducible Process ParametersTouch‑screen operation allows precise adjustment of vacuum level, rotation speed, time and other parameters for consistent processing conditions for every batch. With optional MES network integration, processing data is automatically uploaded to the system to meet R&D traceability requirements. From vacuum‑degassing parameter setup to processing‑data logging, the whole process is traceable and reproducible, well‑suited for R&D projects requiring strict process management. |
✨ Combining deep vacuum degassing, small‑batch precision processing and reproducible parameters, the MIX60 is an ideal laboratory unit for R&D workflows requiring vacuum‑assisted degassing.
Working Principle
Synchronized revolution‑and‑rotation drive paired with vacuum negative‑pressure achieves deep degassing
Step 1: Centrifugal Force Generated by Revolution The revolution plate rotates at high speed to generate strong centrifugal force for materials inside the vessel, driving full‑range material convection to achieve macro‑mixing. Meanwhile, centrifugal force pushes low‑density bubbles toward the rotating axis and promotes aggregation and escape of large‑size bubbles. Step 2: Shear Force Provided by Rotation The vessel spins around its own axis to generate directional shear force, breaking agglomerated particles for micro‑dispersion. High speed up to 3000 rpm delivers powerful shear force for high‑efficiency full‑volume mixing. The shear force also thins bubble walls and accelerates bubble rupture. Step 3: Enhanced Degassing via Vacuum Negative Pressure While revolution‑rotation mixing proceeds, the vacuum system reduces chamber pressure to ‑98 kPa. Increased pressure difference inside and outside bubbles under low‑pressure environment makes nano‑scale micro‑bubbles expand, rise and escape faster. Vacuum degassing compensates the limited centrifugal‑force effect on tiny bubbles, realizing full‑range degassing from large bubbles down to nano‑scale bubbles. Revolution, rotation and vacuum work simultaneously. Materials complete the full‑process “Mixing → Dispersion → Deep‑Layer Degassing” inside sealed vessels. 3000 rpm high‑speed rotation combined with ‑98 kPa vacuum balances mixing efficiency and degassing depth. |  |
Quick Technical Specifications
Full range of technical parameters for reference, customization supported according to actual demands.
| Model | SIE‑MIX60 |
| Mixing Capacity | 0–300 mL (standard container) * Larger volume customizable |
| Container Type | Test tube / Jar / Cup; adapters for syringes & cartridges available |
| Number of Containers | 1 or 2 jars (user‑selectable) |
| Max Speed | 0 – 3000 RPM (stepless adjustable) |
| Revolution / Rotation Ratio | Fixed planetary ratio |
| Vacuum Level | Standard: –98 kPa / Optional: –100 kPa |
| Control System | Touch‑screen, stores up to 100 sets of recipe parameters |
| Power Supply | 220V, 50/60Hz (110V US/JP standard customizable) |
| Dimension(W×D×H) | 510 × 430 × 500 mm |
| Net Weight | Approx. 95 kg |
| Certifications | CE, FC, ISO9001, RoHS Compliance |
Our Partners
Trusted by leading industrial manufacturing clusters and advanced university laboratories worldwide
FAQ - Frequently Asked Questions
Answers to common questions about product performance and everyday process selection
-
脱泡机的作用是什么？
脱泡机是一种用于去除液体中的气泡的设备。它的作用在于帮助生产过程中的液体混合、反应、涂布、印刷、灌注等工艺环节，避免气泡的产生和对最终产品的影响。在许多工业和实验室环境中，去除气泡是非常必要的，因为气泡可能会对产品质量产生负面影响，如影响表面张力和稳定性等问题。脱泡机通常采用各种不同的技术，如振动、超声波、离心等，以实现有效的气泡去除。它的应用领域广泛，包括但不限于半导体、太阳能、光学、生物技术、材料科学等。
-
售后服务怎么样？
公司拥有专业的售后服务人员，24小时专人服务，一对一提供技术支持，解决您的后顾之忧。
-
为什么要选择施诺斯？
选择施诺斯的原因有很多，以下是一些主要的原因：
1. 专业性：我们的团队由一群专业的人士组成，他们在各自的领域拥有丰富的经验和知识。我们不仅了解行业趋势和最佳实践，而且还能提供切实可行的解决方案。
2. 服务质量：我们注重客户的需求和满意度，始终致力于提供高质量的服务。我们不仅快速响应客户需求，而且还能根据客户的要求进行定制化服务。
3. 可靠性：我们以诚信和专业精神为宗旨，始终遵守承诺和协议。我们的工作方法和交付成果均符合行业标准和最佳实践，使得我们的客户能够信任我们。
4. 创新性：我们不断探索新的方法和工具，以提供更好的服务并满足客户的需求。我们鼓励创新和实验，并愿意接受挑战和改变。
5. 成本效益：我们提供高性价比的服务，不仅能够帮助客户节省成本，而且还能提高效率和生产力。我们始终以客户的利益为出发点，为客户提供最优的解决方案。
6. 团队合作：我们相信团队的力量和合作的价值，我们的团队成员之间互相支持、协作和尊重。我们与客户、合作伙伴和其他利益相关者建立紧密的合作关系，以实现共同的目标。
以上只是选择我们的部分原因，我们相信还有很多其他的优点和价值可以为客户提供。如果您正在寻找一家专业、可靠、高质量的服务提供商，我们非常期待与您的合作。
-
搅拌脱泡机的工作原理？
施诺斯搅拌脱泡机通过公转的离心力进行脱泡，通过公转与自转形成的剪切力进行搅拌，
再辅助以真空泵抽取气体以达到真空状态，去除纳米级微小气泡。 不接触物料，无二次污染，无二次浪费。
-
施诺斯能提供工程咨询技术服务吗？
施诺斯能为广大客户提供全面的工程和现代化的咨询服务。施诺斯近二十年的搅拌经验，可以为你提供高效的咨询服务。
想要让搅拌机性能更上一层楼，提升系统的整体效能？我们有全面的咨询、工程以及现代化改造服务，为您量身打造解决方案。 在如今竞争激烈的全球化浪潮中，唯有不断创新、持续优化，才能始终跑在对手前面。您的生产工艺和产品日新月异，我们就为您提供最适配的混合技术。不管是新的产品参数，还是既有的工艺条件，我们都能对现有系统和搅拌设备进行全方位的检查与评估，挖掘其中潜藏的流程优化空间和机械性能提升潜力，并且帮您把这些改进切实落地。 要是您的搅拌设备已经跟不上时代步伐，能耗居高不下，或是维护成本让您头疼不已，那就别犹豫，我们的咨询、工程设计和现代化改造服务，就是为您排忧解难的良方。欢迎随时联系我们，携手开启高效生产新征程！
List of Technical Specifications
Parameter Comparison of Same‑Series Models for Accurate Model Selection
| Model | SIE‑MIX60 | SIE‑MIXF301 | SIE‑MIX90 |
| Mixing Capacity | 0–300 mL (standard container) * Customizable | 0–300 mL (standard container) * Customizable | 0–1000 mL (standard container) * Customizable |
| Container Type | Test tube / Jar / Cup; adapters for syringes & cartridges available | Test tube / Jar / Cup; adapters for syringes & cartridges available | Test tube / Jar / Cup; adapters for syringes & cartridges available |
| Number of Containers | 1 or 2 jars (user‑selectable) | 1 or 2 jars (user‑selectable) | 1 or 2 jars (user‑selectable) |
| Max Speed | 0 – 3000 RPM (stepless adjustable) | 0 – 2000 RPM (stepless adjustable) | 0 – 2000 RPM (stepless adjustable) |
| Revolution / Rotation Ratio | Fixed planetary ratio | Freely adjustable | Fixed planetary ratio |
| Vacuum Level | Standard: –98 kPa / Optional: –100 kPa | Standard: –98 kPa / Optional: –100 kPa | Standard: –98 kPa / Optional: –100 kPa |
| Control System | Touch‑screen, stores up to 100 sets of recipe parameters | Touch‑screen, stores up to 100 sets of recipe parameters | Touch‑screen, stores up to 100 sets of recipe parameters |
| Power Supply | 220V, 50/60Hz (110V US/JP standard customizable) | 220V, 50/60Hz (110V US/JP standard customizable) | 220V, 50/60Hz (110V US/JP standard customizable) |
| Dimension(W×D×H) | 510 × 430 × 500 mm | 510 × 430 × 500 mm | 610 × 560 × 780 mm |
| Net Weight | 95 kg | 115 kg | 153 kg |
| Certifications | CE, FC | CE, FC | CE, FC |
*** The above are typical models only. SIENOX provides customized solutions according to customer requirements. For model‑selection consultation: +86‑189‑2512‑9293
Multi‑Industry Solutions
Covers Typical Mixing & Defoaming Applications for Materials Across Six Major Industries
Adhesive R&DEpoxy structural adhesives, sealants, hot‑melt adhesives, pressure‑sensitive adhesives, modified adhesives |
Precision Electronic AssemblyUnderfill adhesives, conductive adhesives, die attach adhesives, dispensing adhesives, chip bonding adhesives |
BiosensorsEncapsulation adhesives, reagent immobilization materials, microfluidic bonding adhesives, biocompatible adhesives, sensor sealants |
Microelectronic PackagingPackaging epoxy adhesives, molding compounds, lead bonding adhesives, substrate bonding adhesives, passivation layer materials |
Functional CoatingsHydrophobic coatings, conductive coatings, insulating coatings, anti‑corrosion coatings, wear‑resistant coatings |
Electronic PastesSilver paste, copper paste, carbon paste, resistor pastes, dielectric pastes |
Comprehensive Equipment Operation Demonstration Videos
Get an Intuitive, Clear & Dynamic View of Simultaneous Defoaming by Planetary Centrifugal and High‑Negative‑Pressure Technology
Actual Test Results of Defoaming Process
Tested Processing Performance for Six Typical Materials
Paste‑Like Materials |
Adhesive with Powder |
Polymer Materials |
Pharmaceutical Gels |
Silver Paste |
Battery Slurry |
Comparison of Measured Data
Before‑and‑After Defoaming Comparison for Three Representative Materials
| Material Type | Status Before Treatment | After MIX60 Treatment |
| Silver Paste | Plenty of visible bubbles on paste surface, uneven silver‑powder distribution with obvious agglomeration and sedimentation | Smooth and dense paste surface, silver powder homogeneously dispersed without agglomeration, good fluidity and stable electrical conductivity |
| Battery Cathode Slurry | Numerous internal bubbles and poor fluidity, resulting in stripes and pinholes during coating | Homogeneous and fluent slurry with no residual bubbles. Flat and smooth coated surface with consistent coating thickness |
| Epoxy Adhesive (AB Glue) | Dense microbubbles inside mixed adhesive, milky‑white turbid appearance, uneven surface after curing | Transparent and clear adhesive without visible bubbles. Smooth surface after curing, dense cross‑section free of voids |
* Internal laboratory test data. Actual improvement varies with material formula. Real customer cases are available upon request from sales team.
