胶水脱泡机

TEL:18925129293

底部填充胶脱泡机


解决 Underfill 气泡空洞・芯片填充完整、焊点可靠

高流动性脱泡 + 填充无空洞 + 精密电子组装可靠

施诺斯底部填充胶脱泡方案针对 CSP/BGA 底部填充胶流动填充芯片底部易裹气的问题,真空脱泡后填充完整无空洞,缓解热应力、保护焊点。

✓ CE认证  ✓ ISO9001质量体系 ✓ RoHS符合性 ✓ 支持电压定制(110V/220V)

Online Message Free Sample Testing Engineer Hotline: 189-2512-9293

为什么需要底部填充胶脱泡机

BGA/CSP 填充

Underfill 胶流动填充芯片底部,气泡空洞造成热应力集中,温度循环下焊点开裂、芯片失效。

填充流动受阻

胶液裹气后毛细填充受阻,底部出现未填满空洞,防护与补强作用下降。

精密封装良率

精密电子封装对空洞敏感,空洞缺陷返修成本高,要求胶液脱泡到位再点胶。

✨ 传统困境:底部填充胶点胶裹气,芯片底部空洞焊点开裂——需要高流动性脱泡无空洞。

为何选择施诺斯 Underfill 脱泡方案

填充无空洞

脱除气泡后胶液高流动填充,芯片底部完整无空洞,焊点更可靠。

精密控量

非接触脱泡不改变胶液配比与流动性,点胶填充量精准稳定。

从小样到批量

C/ZK 支持研发打样,MIX 系列批量,工艺平滑放大。

✨

设备配套说明

施诺斯AB胶脱泡方案可与其他设备配合形成完整灌封工艺链路: 

搅拌+脱泡一体化:MIX系列搅拌脱泡机在真空环境下搅拌混合AB胶并同步脱泡,一道工序完成混合+除泡。 

温控脱泡:WK系列温控脱泡机可在设定温度下脱泡,适合高粘度AB胶加温降粘后脱泡,提升脱泡效率。 

脱泡+点胶联动:脱泡完成后直接接入SIE-301/302/303点胶机灌封,减少中间转移环节引入新气泡。 

加压精脱:对脱泡率要求高的场景,搅拌真空脱泡后转入RX加压脱泡机做二次精脱,脱泡率更高。

搅拌脱泡工作原理03.jpg

规格参数

选型指南

底部填充胶类型典型状态推荐脱泡方式推荐设备
研发打样少量胶离心 / 真空脱泡C系列 / ZK系列
毛细流动 Underfill低-中粘度真空脱泡ZK系列 / MIX60
快固化 Underfill中粘度真空搅拌脱泡MIX60 / MIX80
批量封装点胶中粘度真空搅拌脱泡MIX1000plus

Our Partners

Trusted by leading industrial manufacturing clusters and advanced university laboratories worldwide

Partner Showcase

FAQ - Frequently Asked Questions

Answers to common questions about product performance and everyday process selection

  • What is the working principle of a centrifugal defoaming machine?

    Principle of centrifugal defoaming machine: The bubbles are released by the downward principle of gravity.

  • How is the after-sales service?

    The company has professional after-sales service personnel, 24-hour dedicated service, and one-on-one technical support to solve your worries.

  • Why choose SIENOX?

    There are many reasons for choosing SIENOX, and the following are some of the main reasons:

    1. Professionalism: Our team consists of a group of professional individuals with rich experience and knowledge in their respective fields. We not only understand industry trends and best practices, but also provide practical and feasible solutions.

    2. Service quality: We focus on customer needs and satisfaction, and are always committed to providing high-quality services. We not only respond quickly to customer needs, but also provide customized services according to their requirements.

    3. Reliability: We adhere to the principles of integrity and professionalism, always adhering to commitments and agreements. Our work methods and deliverables comply with industry standards and best practices, enabling our clients to trust us.

    4. Innovation: We continuously explore new methods and tools to provide better services and meet customer needs. We encourage innovation and experimentation, and are willing to accept challenges and change.

    5. Cost effectiveness: We provide cost-effective services that not only help customers save costs, but also improve efficiency and productivity. We always prioritize the interests of our customers and provide them with the best solutions.

    6. Teamwork: We believe in the power and value of teamwork, and our team members support, collaborate, and respect each other. We establish close cooperative relationships with customers, partners, and other stakeholders to achieve common goals.

    The above are just some of the reasons for choosing us. We believe there are many other advantages and values that can be provided to customers. If you are looking for a professional, reliable, and high-quality service provider, we look forward to working with you.


  • How does the stirring and defoaming machine work?

    The SIENOX stirring and defoaming machine performs defoaming through centrifugal force at revolution and stirring through shear force formed by revolution and rotation,

    Assisted by a vacuum pump to extract gas and achieve a vacuum state, removing nanoscale tiny bubbles. No contact with materials, no secondary pollution, and no secondary waste.

  • What is the function of a defoaming machine?

    A defoaming machine is a device used to remove bubbles from liquids. Its function is to assist in the liquid mixing, reaction, coating, printing, infusion and other process steps in the production process, avoiding the generation of bubbles and their impact on the final product. In many industrial and laboratory environments, removing bubbles is essential as they may have a negative impact on product quality, such as affecting surface tension and stability. Defoaming machines typically use various techniques such as vibration, ultrasound, centrifugation, etc. to achieve effective bubble removal. It has a wide range of applications, including but not limited to semiconductors, solar energy, optics, biotechnology, materials science, etc.

技术指标一览表

同系列型号参数对比,助力精准选型

底部填充胶类型典型状态推荐脱泡方式推荐设备
研发打样少量胶离心 / 真空脱泡C系列 / ZK系列
毛细流动 Underfill低-中粘度真空脱泡ZK系列 / MIX60
快固化 Underfill中粘度真空搅拌脱泡MIX60 / MIX80
批量封装点胶中粘度真空搅拌脱泡MIX1000plus

多行业解决方案

覆盖六大行业典型材料搅拌脱泡应用

BGA.jpg

BGA 封装

BGA/CSP 底部填充

手机芯片.jpg

手机芯片

手机、平板芯片封装

存储芯片.jpg

存储芯片

存储器、模组 Underfill

汽车电子.jpg

汽车电子

车载模组底部填充

摄像头模组.jpg

摄像头模组

影像模组填充补强

Underfill厂.jpg

Underfill厂

底部填充胶研发灌装

全方位设备操作演示视频

脱泡工艺实测效果

六种典型材料实测处理效果

润滑油搅拌脱泡.jpg

膏状材料

光刻胶搅拌脱泡.jpg

胶水+粉体

高分子材料.jpg

高分子材料

凝胶脱泡02.jpg

医药凝胶

银浆粉搅拌脱泡.jpg

银浆材料

电池浆料+胶粘剂搅拌脱泡.jpg

电池浆料



使用注意事项

注意事项操作说明
预热降粘粘度较高的 Underfill 可按工艺预热降粘后再脱泡,提升流动性。
缓慢泄压脱泡后缓慢开盖泄压,防止胶液反泡影响点胶。
精密控量点胶前确认脱泡充分,避免微泡造成填充空洞。
及时点胶脱泡后尽快点胶填充,避免静置重新裹气。

* 内部实验室测试数据,具体效果因胶黏剂配方与点胶工艺而异。真实客户案例可联系销售获取。

客户交付与应用案例

扎根制造一线,赋能各大行业标杆产线与国家重点研究机构

电子材料.jpg

消费电子行业胶水材料解决方案

高粘度胶水.jpg

广东某电子企业采购施诺斯真空斯搅拌脱泡机

涂膜材料.jpg

工业大学涂膜材料脱泡解决方案



Back to Top